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FEATURED PROJECTS 56
- Flexible Printed Circuit Boards
- Semiconductor Fabrication Materials
- Printed Circuit Boards (PCBs)
- Superconducting Wire
- Superconducting Magnets
- Silicon Reclaim Wafers
- Semiconductor Advanced Packaging
- Next Generation Non Volatile Memory
- High-k and ALD/CVD Metal Precursors
- Semiconductor (Silicon) Intellectual Property (SIP)
- FinFET Technology
- Test / Burn-in Sockets
- Monolithic Microwave IC (MMIC)
- High Density Interconnect
- Power Management IC (PMIC)
- Sapphire Substrates
- Semiconductor Foundry
- Substrate-Like PCB
- 3D Chips (3D IC)
- Chip Resistors
- Micro Server IC
- Non-Volatile Memory Express (NVMe)
- Ultracapacitors
- Ultra-Low-Power Microcontrollers
- System-in-Package (SiP) Technology
- Photocatalysts
- PXI Source Measure Units (SMU)
- IC Sockets
- Edge Artificial Intelligence Chips
- RF Semiconductors
- Embedded Non-Volatile Memory (eNVM)
- Industrial Semiconductors
- Internet of Things (IoT) Chip
- GaN Power Devices
- Superconductors
- Opto Semiconductors
- Power Semiconductors
- Flat Panel Displays (FPDs)
- Power Transistors
- Discrete Diodes
- Semiconductor Processing Equipment
- SFF Board
- Soft Magnetic Materials
- Gallium Arsenide (GaAs) Wafers
- GaN Semiconductor Devices
- Foundry Services
- Field Programmable Gate Arrays (FPGA)
- GNSS Chips
- Glass Substrates
- Piezoelectric Smart Materials
- Microwave Devices
- Semiconductor Assembly and Testing Services (SATS)
- Semiconductor Fabrication Software
- Laser Diodes
- Interactive Flat Panels
- Chemical Vapor Deposition