VALIDATED EXECUTIVE ENGAGEMENTS
POOL + OUTREACH
432
Number of executives repeatedly engaged by snail & email outreach
INTERACTIONS
86
Interactions with Platform & by Email
PARTICIPANTS
17
Unique # Participated
VALIDATIONS
8
Responses Validated*
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DATE
JULY 2020
TABLES
108
PAGES
184
EDITION
9
PRICE
USD $4950
Tapping into New Geographical Markets is a Great Way to Grow!
What's Your Addressable Opportunity in the Semiconductor Advanced Packaging Market?
Amid the COVID-19 crisis, the global market for Semiconductor Advanced Packaging estimated at US$32 Billion in the year 2020, is projected to reach a revised size of US$44.2 Billion by 2027, growing at a CAGR of 4.7% over the analysis period 2020-2027. Flip Chip Packaging, one of the segments analyzed in the report, is projected to record a 4.5% CAGR and reach US$34.4 Billion by the end of the analysis period. After an early analysis of the business implications of the pandemic and its induced economic crisis, growth in the FI WLP segment is readjusted to a revised 5.9% CAGR for the next 7-year period.
The Semiconductor Advanced Packaging market in the U.S. is estimated at US$9.4 Billion in the year 2020. China, the world`s second largest economy, is forecast to reach a projected market size of US$7.8 Billion by the year 2027 trailing a CAGR of 4.5% over the analysis period 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 4.4% and 4% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 4.5% CAGR.
In the global 2.5D/3D Packaging segment, USA, Canada, Japan, China and Europe will drive the 6.5% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$1.7 Billion in the year 2020 will reach a projected size of US$2.7 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$4.9 Billion by the year 2027.We bring years of research experience to this 9th edition of our report. The 184-page report presents concise insights into how the pandemic has impacted production and the buy side for 2020 and 2021. A short-term phased recovery by key geography is also addressed.
Amkor Technology, Inc.; ASE Technology Holding, Co., Ltd.; China Wafer Level CSP Co., Ltd.; ChipMOS Technologies, Inc.; FlipChip International LLC; HANA Micron Inc.; Jiangsu Changjiang Electronics Technology Co., Ltd.; King Yuan Electronics Corp. (KYEC); Nepes Corporation; Powertech Technology, Inc.; Samsung Semiconductor, Inc.; SIGNETICS; Tianshui Huatian Technology Co., Ltd.; TongFu Microelectronics Co., Ltd.; TSMC Ltd.; UTAC Holdings Ltd.; Veeco Instruments Inc.
» Device (Analog & Mixed ICs, MEMS & Sensors, Other Devices) » Packaging Technology (Flip Chip Packaging, FI WLP, 2.5D/3D Packaging, FO WLP)
» World » United States » Canada » Japan » China » Europe » France » Germany » Italy » United Kingdom » and Rest of Europe » Asia-Pacific » Rest of World
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05
| I. INTRODUCTION, METHODOLOGY & REPORT SCOPE |
| II. EXECUTIVE SUMMARY |
| 1. MARKET OVERVIEW |
| Global Competitor Market Shares |
| Semiconductor Advanced Packaging Competitor Market Share Scenario Worldwide (in %): 2019 & 2025 |
| Impact of Covid-19 and a Looming Global Recession |
| 2. FOCUS ON SELECT PLAYERS |
| 3. MARKET TRENDS & DRIVERS |
| 4. GLOBAL MARKET PERSPECTIVE |
| Semiconductor Advanced Packaging Global Market Estimates and Forecasts in US$ Million by Region/Country: 2018-2025 |
| Semiconductor Advanced Packaging Global Retrospective Market Scenario in US$ Million by Region/Country: 2009-2017 |
| Semiconductor Advanced Packaging Market Share Shift across Key Geographies Worldwide: 2009 VS 2019 VS 2025 |
| Analog & Mixed ICs (Device) World Market by Region/Country in US$ Million: 2018 to 2025 |
| Analog & Mixed ICs (Device) Historic Market Analysis by Region/Country in US$ Million: 2009 to 2017 |
| Analog & Mixed ICs (Device) Market Share Distribution in Percentage by Region/Country: 2009 VS 2019 VS 2025 |
| MEMS & Sensors (Device) World Market Estimates and Forecasts in US$ Million by Region/Country: 2018 to 2025 |
| MEMS & Sensors (Device) Market Worldwide Historic Review by Region/Country in US$ Million: 2009 to 2017 |
| MEMS & Sensors (Device) Market Percentage Share Distribution by Region/Country: 2009 VS 2019 VS 2025 |
| Other Devices (Device) Market Opportunity Analysis Worldwide in US$ Million by Region/Country: 2018 to 2025 |
| Other Devices (Device) Global Historic Demand in US$ Million by Region/Country: 2009 to 2017 |
| Other Devices (Device) Market Share Distribution in Percentage by Region/Country: 2009 VS 2019 VS 2025 |
| Flip Chip Packaging (Packaging Technology) World Market by Region/Country in US$ Million: 2018 to 2025 |
| Flip Chip Packaging (Packaging Technology) Historic Market Analysis by Region/Country in US$ Million: 2009 to 2017 |
| Flip Chip Packaging (Packaging Technology) Market Share Breakdown of Worldwide Sales by Region/Country: 2009 VS 2019 VS 2025 |
| FI WLP (Packaging Technology) Potential Growth Markets Worldwide in US$ Million: 2018 to 2025 |
| FI WLP (Packaging Technology) Historic Market Perspective by Region/Country in US$ Million: 2009 to 2017 |
| FI WLP (Packaging Technology) Market Sales Breakdown by Region/Country in Percentage: 2009 VS 2019 VS 2025 |
| 2.5D/3D Packaging (Packaging Technology) Geographic Market Spread Worldwide in US$ Million: 2018 to 2025 |
| 2.5D/3D Packaging (Packaging Technology) Region Wise Breakdown of Global Historic Demand in US$ Million: 2009 to 2017 |
| 2.5D/3D Packaging (Packaging Technology) Market Share Distribution in Percentage by Region/Country: 2009 VS 2019 VS 2025 |
| FO WLP (Packaging Technology) World Market Estimates and Forecasts by Region/Country in US$ Million: 2018 to 2025 |
| FO WLP (Packaging Technology) Market Historic Review by Region/Country in US$ Million: 2009 to 2017 |
| FO WLP (Packaging Technology) Market Share Breakdown by Region/Country: 2009 VS 2019 VS 2025 |
| III. MARKET ANALYSIS |
| GEOGRAPHIC MARKET ANALYSIS |
| UNITED STATES |
| Market Facts & Figures |
| US Semiconductor Advanced Packaging Market Share (in %) by Company: 2019 & 2025 |
| United States Semiconductor Advanced Packaging Market Estimates and Projections in US$ Million by Device: 2018 to 2025 |
| Semiconductor Advanced Packaging Market in the United States by Device: A Historic Review in US$ Million for 2009-2017 |
| United States Semiconductor Advanced Packaging Market Share Breakdown by Device: 2009 VS 2019 VS 2025 |
| United States Semiconductor Advanced Packaging Market Estimates and Projections in US$ Million by Packaging Technology: 2018 to 2025 |
| Semiconductor Advanced Packaging Market in the United States by Packaging Technology: A Historic Review in US$ Million for 2009-2017 |
| United States Semiconductor Advanced Packaging Market Share Breakdown by Packaging Technology: 2009 VS 2019 VS 2025 |
| CANADA |
| Canadian Semiconductor Advanced Packaging Market Estimates and Forecasts in US$ Million by Device: 2018 to 2025 |
| Canadian Semiconductor Advanced Packaging Historic Market Review by Device in US$ Million: 2009-2017 |
| Semiconductor Advanced Packaging Market in Canada: Percentage Share Breakdown of Sales by Device for 2009, 2019, and 2025 |
| Canadian Semiconductor Advanced Packaging Market Estimates and Forecasts in US$ Million by Packaging Technology: 2018 to 2025 |
| Canadian Semiconductor Advanced Packaging Historic Market Review by Packaging Technology in US$ Million: 2009-2017 |
| Semiconductor Advanced Packaging Market in Canada: Percentage Share Breakdown of Sales by Packaging Technology for 2009, 2019, and 2025 |
| JAPAN |
| Japanese Market for Semiconductor Advanced Packaging: Annual Sales Estimates and Projections in US$ Million by Device for the Period 2018-2025 |
| Semiconductor Advanced Packaging Market in Japan: Historic Sales Analysis in US$ Million by Device for the Period 2009-2017 |
| Japanese Semiconductor Advanced Packaging Market Share Analysis by Device: 2009 VS 2019 VS 2025 |
| Japanese Market for Semiconductor Advanced Packaging: Annual Sales Estimates and Projections in US$ Million by Packaging Technology for the Period 2018-2025 |
| Semiconductor Advanced Packaging Market in Japan: Historic Sales Analysis in US$ Million by Packaging Technology for the Period 2009-2017 |
| Japanese Semiconductor Advanced Packaging Market Share Analysis by Packaging Technology: 2009 VS 2019 VS 2025 |
| CHINA |
| Chinese Semiconductor Advanced Packaging Market Growth Prospects in US$ Million by Device for the Period 2018-2025 |
| Semiconductor Advanced Packaging Historic Market Analysis in China in US$ Million by Device: 2009-2017 |
| Chinese Semiconductor Advanced Packaging Market by Device: Percentage Breakdown of Sales for 2009, 2019, and 2025 |
| Chinese Semiconductor Advanced Packaging Market Growth Prospects in US$ Million by Packaging Technology for the Period 2018-2025 |
| Semiconductor Advanced Packaging Historic Market Analysis in China in US$ Million by Packaging Technology: 2009-2017 |
| Chinese Semiconductor Advanced Packaging Market by Packaging Technology: Percentage Breakdown of Sales for 2009, 2019, and 2025 |
| EUROPE |
| Market Facts & Figures |
| European Semiconductor Advanced Packaging Market: Competitor Market Share Scenario (in %) for 2019 & 2025 |
| European Semiconductor Advanced Packaging Market Demand Scenario in US$ Million by Region/Country: 2018-2025 |
| Semiconductor Advanced Packaging Market in Europe: A Historic Market Perspective in US$ Million by Region/Country for the Period 2009-2017 |
| European Semiconductor Advanced Packaging Market Share Shift by Region/Country: 2009 VS 2019 VS 2025 |
| European Semiconductor Advanced Packaging Market Estimates and Forecasts in US$ Million by Device: 2018-2025 |
| Semiconductor Advanced Packaging Market in Europe in US$ Million by Device: A Historic Review for the Period 2009-2017 |
| European Semiconductor Advanced Packaging Market Share Breakdown by Device: 2009 VS 2019 VS 2025 |
| European Semiconductor Advanced Packaging Market Estimates and Forecasts in US$ Million by Packaging Technology: 2018-2025 |
| Semiconductor Advanced Packaging Market in Europe in US$ Million by Packaging Technology: A Historic Review for the Period 2009-2017 |
| European Semiconductor Advanced Packaging Market Share Breakdown by Packaging Technology: 2009 VS 2019 VS 2025 |
| FRANCE |
| Semiconductor Advanced Packaging Market in France by Device: Estimates and Projections in US$ Million for the Period 2018-2025 |
| French Semiconductor Advanced Packaging Historic Market Scenario in US$ Million by Device: 2009-2017 |
| French Semiconductor Advanced Packaging Market Share Analysis by Device: 2009 VS 2019 VS 2025 |
| Semiconductor Advanced Packaging Market in France by Packaging Technology: Estimates and Projections in US$ Million for the Period 2018-2025 |
| French Semiconductor Advanced Packaging Historic Market Scenario in US$ Million by Packaging Technology: 2009-2017 |
| French Semiconductor Advanced Packaging Market Share Analysis by Packaging Technology: 2009 VS 2019 VS 2025 |
| GERMANY |
| Semiconductor Advanced Packaging Market in Germany: Recent Past, Current and Future Analysis in US$ Million by Device for the Period 2018-2025 |
| German Semiconductor Advanced Packaging Historic Market Analysis in US$ Million by Device: 2009-2017 |
| German Semiconductor Advanced Packaging Market Share Breakdown by Device: 2009 VS 2019 VS 2025 |
| Semiconductor Advanced Packaging Market in Germany: Recent Past, Current and Future Analysis in US$ Million by Packaging Technology for the Period 2018-2025 |
| German Semiconductor Advanced Packaging Historic Market Analysis in US$ Million by Packaging Technology: 2009-2017 |
| German Semiconductor Advanced Packaging Market Share Breakdown by Packaging Technology: 2009 VS 2019 VS 2025 |
| ITALY |
| Italian Semiconductor Advanced Packaging Market Growth Prospects in US$ Million by Device for the Period 2018-2025 |
| Semiconductor Advanced Packaging Historic Market Analysis in Italy in US$ Million by Device: 2009-2017 |
| Italian Semiconductor Advanced Packaging Market by Device: Percentage Breakdown of Sales for 2009, 2019, and 2025 |
| Italian Semiconductor Advanced Packaging Market Growth Prospects in US$ Million by Packaging Technology for the Period 2018-2025 |
| Semiconductor Advanced Packaging Historic Market Analysis in Italy in US$ Million by Packaging Technology: 2009-2017 |
| Italian Semiconductor Advanced Packaging Market by Packaging Technology: Percentage Breakdown of Sales for 2009, 2019, and 2025 |
| UNITED KINGDOM |
| United Kingdom Market for Semiconductor Advanced Packaging: Annual Sales Estimates and Projections in US$ Million by Device for the Period 2018-2025 |
| Semiconductor Advanced Packaging Market in the United Kingdom: Historic Sales Analysis in US$ Million by Device for the Period 2009-2017 |
| United Kingdom Semiconductor Advanced Packaging Market Share Analysis by Device: 2009 VS 2019 VS 2025 |
| United Kingdom Market for Semiconductor Advanced Packaging: Annual Sales Estimates and Projections in US$ Million by Packaging Technology for the Period 2018-2025 |
| Semiconductor Advanced Packaging Market in the United Kingdom: Historic Sales Analysis in US$ Million by Packaging Technology for the Period 2009-2017 |
| United Kingdom Semiconductor Advanced Packaging Market Share Analysis by Packaging Technology: 2009 VS 2019 VS 2025 |
| REST OF EUROPE |
| Rest of Europe Semiconductor Advanced Packaging Market Estimates and Forecasts in US$ Million by Device: 2018-2025 |
| Semiconductor Advanced Packaging Market in Rest of Europe in US$ Million by Device: A Historic Review for the Period 2009-2017 |
| Rest of Europe Semiconductor Advanced Packaging Market Share Breakdown by Device: 2009 VS 2019 VS 2025 |
| Rest of Europe Semiconductor Advanced Packaging Market Estimates and Forecasts in US$ Million by Packaging Technology: 2018-2025 |
| Semiconductor Advanced Packaging Market in Rest of Europe in US$ Million by Packaging Technology: A Historic Review for the Period 2009-2017 |
| Rest of Europe Semiconductor Advanced Packaging Market Share Breakdown by Packaging Technology: 2009 VS 2019 VS 2025 |
| ASIA-PACIFIC |
| Semiconductor Advanced Packaging Market in Asia-Pacific by Device: Estimates and Projections in US$ Million for the Period 2018-2025 |
| Asia-Pacific Semiconductor Advanced Packaging Historic Market Scenario in US$ Million by Device: 2009-2017 |
| Asia-Pacific Semiconductor Advanced Packaging Market Share Analysis by Device: 2009 VS 2019 VS 2025 |
| Semiconductor Advanced Packaging Market in Asia-Pacific by Packaging Technology: Estimates and Projections in US$ Million for the Period 2018-2025 |
| Asia-Pacific Semiconductor Advanced Packaging Historic Market Scenario in US$ Million by Packaging Technology: 2009-2017 |
| Asia-Pacific Semiconductor Advanced Packaging Market Share Analysis by Packaging Technology: 2009 VS 2019 VS 2025 |
| REST OF WORLD |
| Rest of World Semiconductor Advanced Packaging Market Estimates and Forecasts in US$ Million by Device: 2018 to 2025 |
| Rest of World Semiconductor Advanced Packaging Historic Market Review by Device in US$ Million: 2009-2017 |
| Semiconductor Advanced Packaging Market in Rest of World: Percentage Share Breakdown of Sales by Device for 2009, 2019, and 2025 |
| Rest of World Semiconductor Advanced Packaging Market Estimates and Forecasts in US$ Million by Packaging Technology: 2018 to 2025 |
| Rest of World Semiconductor Advanced Packaging Historic Market Review by Packaging Technology in US$ Million: 2009-2017 |
| Semiconductor Advanced Packaging Market in Rest of World: Percentage Share Breakdown of Sales by Packaging Technology for 2009, 2019, and 2025 |
| IV. COMPETITION |
| Total Companies Profiled : 19 Click here to request a full table of contents and more details on this project. |
| V. CURATED RESEARCH |
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