EXECUTIVE ENGAGEMENTS
POOL
432
Number of executives repeatedly engaged by snail & email outreach
INTERACTIONS
86
Interactions with Platform & by Email
PARTICIPANTS
17
Unique # Participated
VALIDATIONS
7
Responses Validated*
COMPANIES
109
Responses Validated*
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DATE
OCT 2022
TABLES
126
PAGES
488
EDITION
11
PRICE
USD 4950
CODE
MCP14658
*Engagement stats are ongoing and dynamic
RESEARCH MODULES
EXECUTIVES
HIGHLIGHTS & REPORT INDEX
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Global Semiconductor Advanced Packaging Market to Reach $53.2 Billion by 2027
In the changed post COVID-19 business landscape, the global market for Semiconductor Advanced Packaging estimated at US$31.8 Billion in the year 2020, is projected to reach a revised size of US$53.2 Billion by 2027, growing at a CAGR of 7.6% over the analysis period 2020-2027. Flip Chip Packaging, one of the segments analyzed in the report, is projected to record a 7.2% CAGR and reach US$39.1 Billion by the end of the analysis period. Taking into account the ongoing post pandemic recovery, growth in the 2.5d/3d Packaging segment is readjusted to a revised 10.1% CAGR for the next 7-year period.
The U.S. Market is Estimated at $3 Billion, While China is Forecast to Grow at 9.3% CAGR
The Semiconductor Advanced Packaging market in the U.S. is estimated at US$3 Billion in the year 2020. China, the world`s second largest economy, is forecast to reach a projected market size of US$15 Billion by the year 2027 trailing a CAGR of 9.3% over the analysis period 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 5.3% and 6.2% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 5.5% CAGR.FI WLP Segment to Record 6.8% CAGR
In the global FI WLP segment, USA, Canada, Japan, China and Europe will drive the 6.8% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$1.6 Billion in the year 2020 will reach a projected size of US$2.4 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets.
SELECT PLAYERS
Advanced Semiconductor Engineering, Inc.; Amkor Technology, Inc.; ChipMOS Technologies Inc.; FlipChip International LLC; HANA Micron Inc.; ISI - Interconnect Systems; JCET Group; King Yuan Electronics Co., Ltd.; NEPES; Powertech Technology Inc.; Samsung; Signetics; Taiwan Semiconductor Manufacturing Company Limited; Veeco Instruments Inc.
SEGMENTS
» Technology (Flip Chip Packaging, 2.5D/3D Packaging, FI WLP, FO WLP) » (Consumer Electronics, Industrial, Automotive, Aerospace & Defense, Other End-Uses)
GEOGRAPHIES
» World » USA » Canada » Japan » China » Europe » France » Germany » Italy » UK » Rest of Europe » Asia-Pacific » South Korea » Taiwan » Rest of Asia-Pacific » Rest of World
TABLE OF CONTENTS
| I. METHODOLOGY |
| II. EXECUTIVE SUMMARY |
| 1. MARKET OVERVIEW |
| The Race Between the Virus & Vaccines Intensifies. Amidst this Chaotic Battle, Where is the World Economy Headed? |
| Progress on Vaccinations: Why Should Businesses Care? |
| With IMF’s Upward Revision of Global GDP Forecasts, Most Companies are Bullish about an Economic Comeback Despite a Continuing Pandemic |
| EXHIBIT: A Strong Yet Exceedingly Patchy & Uncertain Recovery Shaped by New Variants Comes Into Play: World Economic Growth Projections (Real GDP, Annual % Change) for 2020 through 2022 |
| EXHIBIT: Easing Unemployment Levels in 2021 Although Moderate Will Infuse Hope for Industries Reliant on Consumer Discretionary Incomes: Global Number of Unemployed People (In Million) for Years 2019, 2020, 2021, and 2022 |
| Impact of COVID-19 on the Semiconductor Industry Exposes the Risk of Value Chain Modularity |
| Among the Hammered Companies in the Supply Chain is the “Semiconductor Industry” |
| EXHIBIT: Measuring the Impact of COVID-19 on the Semiconductor Industry in Terms of Disruption & Time to Recovery (In Months) as of May 2020 |
| EXHIBIT: Supply Chain Disruptions Impact a Large Number of Electronic Manufacturers: % Share of Companies Impacted by Supply Chain Delays Due to COVID-19 Worldwide as of May 2020 |
| Semiconductor Trends for Specific End-Use Categories |
| COVID-19 Pandemic Storm Warrants New Strategies to Help Semiconductor Leaders Secure New Lease of Life |
| Falling Consumer Confidence Impacts Sales of Automotive and Consumer Electronics |
| Industrial Activity Remain Subdued in 2020 |
| EXHIBIT: Global PMI Index Points for the Years 2018, 2019 & 2020 |
| Competitive Scenario |
| Semiconductor Supply Chain Transitions at Various Levels |
| Financial Performances of Packaging Suppliers Reveals New Growth Players |
| Unconventional Players Joining Semiconductor Advanced Packaging Bandwagon |
| Semiconductor Advanced Packaging – Global Key Competitors Percentage Market Share in 2022 (E) |
| Competitive Market Presence - Strong/Active/Niche/Trivial for 109 Players Worldwide in 2022 (E) |
| Rising Semiconductor Demand Presents Bundle of Joy for Advanced Packaging Market |
| Prominent Factors Stirring Semiconductor Advanced Packaging Market |
| Global Market Prospects & Outlook |
| Flip-Chip: Key Contributing Segment |
| Rising Investments to Benefit Market |
| Key Trends to Drive Semiconductor Advanced Packaging Market |
| Regional Analysis |
| An Introduction to Semiconductor Advanced Packaging |
| Recent Market Activity |
| 2. FOCUS ON SELECT PLAYERS |
| 3. MARKET TRENDS & DRIVERS |
| Semiconductor Industry Trends Indicating Brighter Days Ahead for Advanced Packaging |
| Digital Transformation Drive to Steer Future Growth of Advanced Packaging Market |
| EXHIBIT: Global Digital Transformation Spending (In US$ Trillion) for the Years 2019 through 2023 |
| IoT Ecosystem to Rev Up Opportunities for Semiconductor Advanced Packaging |
| EXHIBIT: Global Number of IoT Connected Devices (In Billion Units) for the Years 2016, 2018, 2020, 2022 & 2025 |
| EXHIBIT: Global Investments in Industrial IoT (IIoT) Platforms (In US$ Million) for the Years 2018, 2022 and 2025 |
| EXHIBIT: Global IoT Market (In US$ Billion) by Industry for the Years 2018 and 2022 |
| EXHIBIT: World IoT Semiconductors Market by Function (2018 & 2022): Percentage Breakdown of Value Sales for Communications, Processing, and Sensing |
| Increasing Functionality & Application Scope |
| New Packaging Technologies Crucial to Semiconductor Innovation |
| 3D Chip Stacking Technology to Drive Future Advanced Packaging Technology |
| 3D InCites - Advanced Packaging for 5G |
| 2.5D Packaging Emerges as Powerful Option for Next-Generation AI Products |
| Advanced Packaging Influences Design Chain |
| Led by Innovation, Semiconductor Advanced Packaging Enters into Exciting Era |
| Innovative Advanced Packaging Techniques to Flood the Market |
| Amkor Technology Leading Packaging Technology Innovation |
| Prominent Technology Trends |
| Reducing the Cost of Advanced Packaging |
| Investments in Advanced Packaging: A Critical Component for Resilient Semiconductor Supply Chain |
| Trends in Consumer Electronics Sector Influence the Semiconductor Advanced Packaging Market |
| Post Pandemic Recovery in CE Sector to Augment Prospects |
| EXHIBIT: Worldwide Shipments of Smartphones, Tablets, and Laptops (in Million Units) for the Years 2019, 2021 and 2023 |
| EXHIBIT: Global Smart Homes Market by Category in US$ Billion for the Years 2020 and 2022 |
| Review of Key CE Products Driving Adoption of Semiconductor Advanced Packaging Technology |
| Smartphones |
| Tablet PCs |
| FOWLP and Challenges to Packaging Materials Suppliers |
| Automobile Electronification Trends Widen the Addressable Market |
| EXHIBIT: Breakdown of the Total Cost of Electronics in an Automobile (in %) for the Years 1970, 1980, 2000, 2017, 2020 and 2030 |
| EXHIBIT: World Automobile Production in Million Units: 2008-2022 |
| Anticipated Post COVID Recovery to Revive Opportunities in Aerospace Sector |
| EXHIBIT: Commercial Airline Revenue Growth (in %) for 2010-2020 |
| EXHIBIT: Global Airlines Performance by Region: 2020 Vs 2019 |
| Sustained High Growth in ICT Sector Augurs Well |
| EXHIBIT: World Internet Penetration Rate (in %) by Geographic Region: June 2021 |
| EXHIBIT: Breakdown of Global IP Traffic by Application Type (in %): 2019 & 2022 |
| EXHIBIT: Global Wireless Communication Market (2018 & 2020): Percentage Breakdown of Traffic Volume by Mobile Device Type |
| Factors Precipitating Semiconductor Advanced Packaging Demand & Challenges |
| Factors Putting Additional Demands on Packaging |
| Fan-Out Packaging: Promises & Key Challenges |
| Implications of Chiplets & Related Designs for Advanced Packaging |
| Solving Lithography Challenges |
| Warped Wafer Processing |
| UBM/RDL and PR Strip Challenges |
| UBM/RDL Etch |
| Semiconductor Supply Chain: The Complex Nature & Vulnerabilities |
| Vulnerabilities for WBG Power Semiconductors |
| 4. GLOBAL MARKET PERSPECTIVE |
| World Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR |
| World Historic Review for Semiconductor Advanced Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| World 15-Year Perspective for Semiconductor Advanced Packaging by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2012, 2021 & 2027 |
| World Recent Past, Current & Future Analysis for Flip Chip Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR |
| World Historic Review for Flip Chip Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| World 15-Year Perspective for Flip Chip Packaging by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027 |
| World Recent Past, Current & Future Analysis for 2.5D/3D Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR |
| World Historic Review for 2.5D/3D Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| World 15-Year Perspective for 2.5D/3D Packaging by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027 |
| World Recent Past, Current & Future Analysis for FI WLP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR |
| World Historic Review for FI WLP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| World 15-Year Perspective for FI WLP by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027 |
| World Recent Past, Current & Future Analysis for FO WLP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR |
| World Historic Review for FO WLP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| World 15-Year Perspective for FO WLP by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027 |
| World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR |
| World Historic Review for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| World 15-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027 |
| World Recent Past, Current & Future Analysis for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR |
| World Historic Review for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| World 15-Year Perspective for Industrial by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027 |
| World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR |
| World Historic Review for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| World 15-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027 |
| World Recent Past, Current & Future Analysis for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR |
| World Historic Review for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| World 15-Year Perspective for Aerospace & Defense by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027 |
| World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR |
| World Historic Review for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| World 15-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027 |
| III. MARKET ANALYSIS |
| UNITED STATES |
| Semiconductor Advanced Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2022 (E) |
| USA Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR |
| USA Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| USA 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027 |
| USA Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR |
| USA Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| USA 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027 |
| CANADA |
| Canada Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR |
| Canada Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| Canada 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027 |
| Canada Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR |
| Canada Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| Canada 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027 |
| JAPAN |
| Semiconductor Advanced Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2022 (E) |
| Japan Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR |
| Japan Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| Japan 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027 |
| Japan Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR |
| Japan Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| Japan 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027 |
| CHINA |
| Semiconductor Advanced Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2022 (E) |
| China Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR |
| China Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| China 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027 |
| China Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR |
| China Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| China 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027 |
| EUROPE |
| Semiconductor Advanced Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2022 (E) |
| Europe Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR |
| Europe Historic Review for Semiconductor Advanced Packaging by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| Europe 15-Year Perspective for Semiconductor Advanced Packaging by Geographic Region - Percentage Breakdown of Value Revenues for France, Germany, Italy, UK and Rest of Europe Markets for Years 2012, 2021 & 2027 |
| Europe Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR |
| Europe Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| Europe 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027 |
| Europe Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR |
| Europe Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| Europe 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027 |
| FRANCE |
| France Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR |
| France Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| France 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027 |
| France Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR |
| France Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| France 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027 |
| GERMANY |
| Germany Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR |
| Germany Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| Germany 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027 |
| Germany Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR |
| Germany Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| Germany 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027 |
| ITALY |
| Italy Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR |
| Italy Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| Italy 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027 |
| Italy Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR |
| Italy Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| Italy 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027 |
| UNITED KINGDOM |
| UK Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR |
| UK Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| UK 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027 |
| UK Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR |
| UK Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| UK 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027 |
| REST OF EUROPE |
| Rest of Europe Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR |
| Rest of Europe Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| Rest of Europe 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027 |
| Rest of Europe Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR |
| Rest of Europe Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| Rest of Europe 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027 |
| ASIA-PACIFIC |
| Semiconductor Advanced Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2022 (E) |
| Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Geographic Region - South Korea, Taiwan and Rest of Asia-Pacific Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR |
| Asia-Pacific Historic Review for Semiconductor Advanced Packaging by Geographic Region - South Korea, Taiwan and Rest of Asia-Pacific Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| Asia-Pacific 15-Year Perspective for Semiconductor Advanced Packaging by Geographic Region - Percentage Breakdown of Value Revenues for South Korea, Taiwan and Rest of Asia-Pacific Markets for Years 2012, 2021 & 2027 |
| Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR |
| Asia-Pacific Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| Asia-Pacific 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027 |
| Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR |
| Asia-Pacific Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| Asia-Pacific 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027 |
| SOUTH KOREA |
| South Korea Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR |
| South Korea Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| South Korea 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027 |
| South Korea Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR |
| South Korea Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| South Korea 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027 |
| TAIWAN |
| Taiwan Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR |
| Taiwan Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| Taiwan 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027 |
| Taiwan Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR |
| Taiwan Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| Taiwan 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027 |
| REST OF ASIA-PACIFIC |
| Rest of Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR |
| Rest of Asia-Pacific Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| Rest of Asia-Pacific 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027 |
| Rest of Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR |
| Rest of Asia-Pacific Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| Rest of Asia-Pacific 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027 |
| REST OF WORLD |
| Rest of World Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR |
| Rest of World Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| Rest of World 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027 |
| Rest of World Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR |
| Rest of World Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR |
| Rest of World 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027 |
| IV. COMPETITION |
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