Semiconductor Advanced Packaging

World Market Report

MCP14658

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DATE

OCT 2022

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126

PAGES

488

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USD 4950

CODE

MCP14658


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What`s New for 2022?

» Global competitiveness and key competitor percentage market shares
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Global Semiconductor Advanced Packaging Market to Reach $53.2 Billion by 2027
In the changed post COVID-19 business landscape, the global market for Semiconductor Advanced Packaging estimated at US$31.8 Billion in the year 2020, is projected to reach a revised size of US$53.2 Billion by 2027, growing at a CAGR of 7.6% over the analysis period 2020-2027. Flip Chip Packaging, one of the segments analyzed in the report, is projected to record a 7.2% CAGR and reach US$39.1 Billion by the end of the analysis period. Taking into account the ongoing post pandemic recovery, growth in the 2.5d/3d Packaging segment is readjusted to a revised 10.1% CAGR for the next 7-year period.

The U.S. Market is Estimated at $3 Billion, While China is Forecast to Grow at 9.3% CAGR
The Semiconductor Advanced Packaging market in the U.S. is estimated at US$3 Billion in the year 2020. China, the world`s second largest economy, is forecast to reach a projected market size of US$15 Billion by the year 2027 trailing a CAGR of 9.3% over the analysis period 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 5.3% and 6.2% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 5.5% CAGR.FI WLP Segment to Record 6.8% CAGR
In the global FI WLP segment, USA, Canada, Japan, China and Europe will drive the 6.8% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$1.6 Billion in the year 2020 will reach a projected size of US$2.4 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets.

SELECT PLAYERS

Advanced Semiconductor Engineering, Inc.; Amkor Technology, Inc.; ChipMOS Technologies Inc.; FlipChip International LLC; HANA Micron Inc.; ISI - Interconnect Systems; JCET Group; King Yuan Electronics Co., Ltd.; NEPES; Powertech Technology Inc.; Samsung; Signetics; Taiwan Semiconductor Manufacturing Company Limited; Veeco Instruments Inc.

SEGMENTS

» Technology (Flip Chip Packaging, 2.5D/3D Packaging, FI WLP, FO WLP) » (Consumer Electronics, Industrial, Automotive, Aerospace & Defense, Other End-Uses)

GEOGRAPHIES

» World » USA » Canada » Japan » China » Europe » France » Germany » Italy » UK » Rest of Europe » Asia-Pacific » South Korea » Taiwan » Rest of Asia-Pacific » Rest of World

TABLE OF CONTENTS

1. MARKET OVERVIEW
The Race Between the Virus & Vaccines Intensifies. Amidst this Chaotic Battle, Where is the World Economy Headed?
Progress on Vaccinations: Why Should Businesses Care?
With IMF’s Upward Revision of Global GDP Forecasts, Most Companies are Bullish about an Economic Comeback Despite a Continuing Pandemic
EXHIBIT: A Strong Yet Exceedingly Patchy & Uncertain Recovery Shaped by New Variants Comes Into Play: World Economic Growth Projections (Real GDP, Annual % Change) for 2020 through 2022
EXHIBIT: Easing Unemployment Levels in 2021 Although Moderate Will Infuse Hope for Industries Reliant on Consumer Discretionary Incomes: Global Number of Unemployed People (In Million) for Years 2019, 2020, 2021, and 2022
Impact of COVID-19 on the Semiconductor Industry Exposes the Risk of Value Chain Modularity
Among the Hammered Companies in the Supply Chain is the “Semiconductor Industry”
EXHIBIT: Measuring the Impact of COVID-19 on the Semiconductor Industry in Terms of Disruption & Time to Recovery (In Months) as of May 2020
EXHIBIT: Supply Chain Disruptions Impact a Large Number of Electronic Manufacturers: % Share of Companies Impacted by Supply Chain Delays Due to COVID-19 Worldwide as of May 2020
Semiconductor Trends for Specific End-Use Categories
COVID-19 Pandemic Storm Warrants New Strategies to Help Semiconductor Leaders Secure New Lease of Life
Falling Consumer Confidence Impacts Sales of Automotive and Consumer Electronics
Industrial Activity Remain Subdued in 2020
EXHIBIT: Global PMI Index Points for the Years 2018, 2019 & 2020
Competitive Scenario
Semiconductor Supply Chain Transitions at Various Levels
Financial Performances of Packaging Suppliers Reveals New Growth Players
Unconventional Players Joining Semiconductor Advanced Packaging Bandwagon
Semiconductor Advanced Packaging – Global Key Competitors Percentage Market Share in 2022 (E)
Competitive Market Presence - Strong/Active/Niche/Trivial for 109 Players Worldwide in 2022 (E)
Rising Semiconductor Demand Presents Bundle of Joy for Advanced Packaging Market
Prominent Factors Stirring Semiconductor Advanced Packaging Market
Global Market Prospects & Outlook
Flip-Chip: Key Contributing Segment
Rising Investments to Benefit Market
Key Trends to Drive Semiconductor Advanced Packaging Market
Regional Analysis
An Introduction to Semiconductor Advanced Packaging
Recent Market Activity
2. FOCUS ON SELECT PLAYERS
3. MARKET TRENDS & DRIVERS
Semiconductor Industry Trends Indicating Brighter Days Ahead for Advanced Packaging
Digital Transformation Drive to Steer Future Growth of Advanced Packaging Market
EXHIBIT: Global Digital Transformation Spending (In US$ Trillion) for the Years 2019 through 2023
IoT Ecosystem to Rev Up Opportunities for Semiconductor Advanced Packaging
EXHIBIT: Global Number of IoT Connected Devices (In Billion Units) for the Years 2016, 2018, 2020, 2022 & 2025
EXHIBIT: Global Investments in Industrial IoT (IIoT) Platforms (In US$ Million) for the Years 2018, 2022 and 2025
EXHIBIT: Global IoT Market (In US$ Billion) by Industry for the Years 2018 and 2022
EXHIBIT: World IoT Semiconductors Market by Function (2018 & 2022): Percentage Breakdown of Value Sales for Communications, Processing, and Sensing
Increasing Functionality & Application Scope
New Packaging Technologies Crucial to Semiconductor Innovation
3D Chip Stacking Technology to Drive Future Advanced Packaging Technology
3D InCites - Advanced Packaging for 5G
2.5D Packaging Emerges as Powerful Option for Next-Generation AI Products
Advanced Packaging Influences Design Chain
Led by Innovation, Semiconductor Advanced Packaging Enters into Exciting Era
Innovative Advanced Packaging Techniques to Flood the Market
Amkor Technology Leading Packaging Technology Innovation
Prominent Technology Trends
Reducing the Cost of Advanced Packaging
Investments in Advanced Packaging: A Critical Component for Resilient Semiconductor Supply Chain
Trends in Consumer Electronics Sector Influence the Semiconductor Advanced Packaging Market
Post Pandemic Recovery in CE Sector to Augment Prospects
EXHIBIT: Worldwide Shipments of Smartphones, Tablets, and Laptops (in Million Units) for the Years 2019, 2021 and 2023
EXHIBIT: Global Smart Homes Market by Category in US$ Billion for the Years 2020 and 2022
Review of Key CE Products Driving Adoption of Semiconductor Advanced Packaging Technology
Smartphones
Tablet PCs
FOWLP and Challenges to Packaging Materials Suppliers
Automobile Electronification Trends Widen the Addressable Market
EXHIBIT: Breakdown of the Total Cost of Electronics in an Automobile (in %) for the Years 1970, 1980, 2000, 2017, 2020 and 2030
EXHIBIT: World Automobile Production in Million Units: 2008-2022
Anticipated Post COVID Recovery to Revive Opportunities in Aerospace Sector
EXHIBIT: Commercial Airline Revenue Growth (in %) for 2010-2020
EXHIBIT: Global Airlines Performance by Region: 2020 Vs 2019
Sustained High Growth in ICT Sector Augurs Well
EXHIBIT: World Internet Penetration Rate (in %) by Geographic Region: June 2021
EXHIBIT: Breakdown of Global IP Traffic by Application Type (in %): 2019 & 2022
EXHIBIT: Global Wireless Communication Market (2018 & 2020): Percentage Breakdown of Traffic Volume by Mobile Device Type
Factors Precipitating Semiconductor Advanced Packaging Demand & Challenges
Factors Putting Additional Demands on Packaging
Fan-Out Packaging: Promises & Key Challenges
Implications of Chiplets & Related Designs for Advanced Packaging
Solving Lithography Challenges
Warped Wafer Processing
UBM/RDL and PR Strip Challenges
UBM/RDL Etch
Semiconductor Supply Chain: The Complex Nature & Vulnerabilities
Vulnerabilities for WBG Power Semiconductors
4. GLOBAL MARKET PERSPECTIVE
World Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Semiconductor Advanced Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Semiconductor Advanced Packaging by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for Flip Chip Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Flip Chip Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Flip Chip Packaging by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for 2.5D/3D Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for 2.5D/3D Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for 2.5D/3D Packaging by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for FI WLP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for FI WLP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for FI WLP by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for FO WLP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for FO WLP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for FO WLP by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Industrial by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Aerospace & Defense by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
UNITED STATES
Semiconductor Advanced Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2022 (E)
USA Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
USA Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
USA 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
USA Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
USA Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
USA 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
CANADA
Canada Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Canada Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Canada 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
Canada Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Canada Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Canada 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
JAPAN
Semiconductor Advanced Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2022 (E)
Japan Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Japan Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Japan 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
Japan Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Japan Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Japan 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
CHINA
Semiconductor Advanced Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2022 (E)
China Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
China Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
China 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
China Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
China Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
China 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
EUROPE
Semiconductor Advanced Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2022 (E)
Europe Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
Europe Historic Review for Semiconductor Advanced Packaging by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Europe 15-Year Perspective for Semiconductor Advanced Packaging by Geographic Region - Percentage Breakdown of Value Revenues for France, Germany, Italy, UK and Rest of Europe Markets for Years 2012, 2021 & 2027
Europe Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Europe Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Europe 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
Europe Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Europe Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Europe 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
FRANCE
France Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
France Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
France 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
France Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
France Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
France 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
GERMANY
Germany Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Germany Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Germany 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
Germany Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Germany Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Germany 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
ITALY
Italy Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Italy Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Italy 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
Italy Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Italy Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Italy 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
UNITED KINGDOM
UK Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
UK Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
UK 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
UK Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
UK Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
UK 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
REST OF EUROPE
Rest of Europe Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Rest of Europe Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Rest of Europe 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
Rest of Europe Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Rest of Europe Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Rest of Europe 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
ASIA-PACIFIC
Semiconductor Advanced Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2022 (E)
Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Geographic Region - South Korea, Taiwan and Rest of Asia-Pacific Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
Asia-Pacific Historic Review for Semiconductor Advanced Packaging by Geographic Region - South Korea, Taiwan and Rest of Asia-Pacific Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Asia-Pacific 15-Year Perspective for Semiconductor Advanced Packaging by Geographic Region - Percentage Breakdown of Value Revenues for South Korea, Taiwan and Rest of Asia-Pacific Markets for Years 2012, 2021 & 2027
Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Asia-Pacific Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Asia-Pacific 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Asia-Pacific Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Asia-Pacific 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
SOUTH KOREA
South Korea Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
South Korea Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
South Korea 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
South Korea Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
South Korea Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
South Korea 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
TAIWAN
Taiwan Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Taiwan Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Taiwan 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
Taiwan Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Taiwan Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Taiwan 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
REST OF ASIA-PACIFIC
Rest of Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Rest of Asia-Pacific Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Rest of Asia-Pacific 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
Rest of Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Rest of Asia-Pacific Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Rest of Asia-Pacific 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
REST OF WORLD
Rest of World Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Rest of World Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Rest of World 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
Rest of World Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Rest of World Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Rest of World 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027

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