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PRINTED CIRCUIT BOARDS (PCBS)

Global Market Trajectory & Analytics

MCP-1883

VALIDATED EXECUTIVE ENGAGEMENTS

POOL + OUTREACH

1399
Number of executives repeatedly engaged by snail & email outreach

INTERACTIONS

252
Interactions with Platform & by Email

PARTICIPANTS

56
Unique # Participated

VALIDATIONS

26
Responses Validated*
* Login to view program details and full enterprise executive list.

DATE

JULY 2020

TABLES

192

PAGES

441

EDITION

16

PRICE

USD $5450


The global market for Printed Circuit Boards (PCBs) is projected to reach a revised US$76billion by the year 2027afterwitnessing aUS$4.8 billion erosion in market value in the year 2020. With several of the end-use industries now caught in the financial storm raised by the COVID-19 pandemic, the market for printed circuit boards (PCBs) is expected to slump in the year 2020. Manufacturers of electronic products are facing dual challenges of production bottlenecks as a result of supply chain disruptions and inability to deliver on backlogged orders and weak new orders as a result of soft consumer demand. Electronics supply chain already in state of flux in the pre-pandemic period by the U.S. and China trade and tariff war has been pushed into crisis with little preparation at the start of the pandemic in January 2020. With most electronic raw material supply dependent on Southeast Asian countries and China, over 75% of companies witnessed shipment delays which in the month of April rose to 3 to 5 weeks. The overall velocity of the value chain to perform and fulfill orders has reduced significantly. In addition, the pandemic has disrupted supply chains causing massive damage for manufacturing companies reliant on China for supplies. These supply chain disruptions will step up the pressure to decouple from China. Rethinking supply chains will spur the movement of production out of China, including for electronics. Consumer electronics manufacturing, followed closely by automotive and industrial electronics remain the worst impacted. With companies cancelling and delaying modernization plans and with IT budgets slashed, industrial electronics is also feeling the pain of the general slowdown. With most electronic companies expected to witness decline in sales and profitability, the semiconductor industry also remains impacted and likely to face short-term financial hardships. The global market for PCBs against this backdrop is expected to decline by -8.1 in 2020.


A rolling disaster, the pandemic has slowed down economic activity and has pushed the global economy into a steep recession. In addition to consumers, even governments are now facing rapidly depleting fiscal coffers. The financial ramifications for the world economy, is that over US$2 trillion is likely to be shaved off the global GDP as lost income. The asphyxiated economy has set into motion a cascading effect of a marked recession which is being felt by businesses and consumers alike. Global GDP is expected to dip into the red at -3% with the US economy shrinking by a shocking -5.9%. With roots in China, the world's supply chains are facing unprecedented disruption & shutdown. Interwoven with a demand crisis, the supply chain shocks are exerting a compounded blow to manufacturing companies worldwide. Manufacturing PMI which started declining at the start of the pandemic shows no signs of improving with the recession now acting impeding early recovery. In the midst of this crisis, demand for industrial semiconductors, electronics and manufacturing automation technologies are taking a heavy blow as cash strapped companies struggle to cope.

AT&S (Austria Technologie & Systemtechnik) AG; CMK Corporation; Daeduck Electronics Co., Ltd.; Dynamic Electronics Co., Ltd.; Nan Ya Printed Circuit Board Corporation; Nippon Mektron Ltd.; Samsung Electro-Mechanics; Shenzhen Kinwong Electronic Co., Ltd.; TTM Technologies; Unimicron Corporation
» Type (Multi-Layer, Double-Sided, Single-Sided) » Substrate Type (Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex, and Other Substrate Types) » End-Use (Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense, Other End-Uses)
» World » United States » Canada » Japan » China » Europe » France » Germany » Italy » United Kingdom » Spain » Russia » and Rest of Europe » Asia-Pacific » Australia » India » South Korea » and Rest of Asia-Pacific » Latin America » Argentina » Brazil » Mexico » and Rest of Latin America » Middle East » Iran » Israel » Saudi Arabia » United Arab Emirates » and Rest of Middle East » and Africa

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05
1. MARKET OVERVIEW
What are PCBs, Where are they Used & Why are they the Backbone of Electronics?
PCBs Are a Key Part of the Electronics Value Chain. COVID-19 Exposes the Risk of Value Chain Modularity
COVID-19 Emerges as a Black Swan Event for the Electronics Industry
Among the Hammered Companies in the Supply Chain is the Semiconductor Industry
Table: Measuring the Impact of COVID-19 On the Semiconductor Industry in Terms of Disruption & Time to Recovery (In Months) as of May 2020
Table: Supply Chain Disruptions Impact a Large Number of Electronic Manufacturers: % Share of Companies Impacted by Supply Chain Delays Due to COVID-19 Worldwide as of May 2020
Falling Consumer Confidence Impacts Retail Sales of Consumer & Automotive Electronics
Table: Rapidly Eroding Consumer Confidence Thwarts Hopes for a Quick Recovery: Global Consumer Confidence Index Points for 4Q2019, 1Q2020 & 2Q2020
Table: Shrinking Disposable Incomes Take its Toll on Consumer Demand for Electronics: Global 1Q Sell-In Shipments of Electronic Products Estimated in Jan-2020 Vs March 2020 (In Million Units)
Deteriorating Business Confidence & Virus Led Economic Recession Impacts Prospects for Industrial Electronics
Table: Virus Led Recession Frustrates Recovery of Upstream & Downstream Markets in the Electronics Industry: Global GDP Growth (In %) for the Years 2019, 2020 & 2021
Table: Manufacturing Industry Bites the Dust Severing All Planned Digital & Electronic Plant Upgrade Investments: Global Manufacturing PMI Index Score January 2020 to May 2020
Its a Bumpy Road to Recovery as Loosening Up of Restrictions Triggers a Second Wave of Infections
Table: Rising Global Infections Dampen Sentiment & Keep Businesses on Tenterhooks: Global Number of COVID-19 Infections Per Day in the Month of June 2020
Table: Despite Moves to Reopen the Economy, Battered Business Confidence Plummets to New Depths: Business Confidence Index (BCI) Points
Recent Market Activity
World Brands
2. FOCUS ON SELECT PLAYERS
3. MARKET TRENDS & DRIVERS
Digital Transformation Catalyzed by the Pandemic Provides the Perfect Platform for Growth in the Post COVID-19 Period.
The Scenario Bodes Well for All Things Electronic & Digital. Special Focus on PCBs for Electronic Wearables
Table: Its Not CIOs or CFOs, its COVID-19 Leading Digital Transformation Globally: Global Digital Transformation Spending (In US$ Trillion) for the Years 2019 through 2023
Post COVID-19 As Technology Steps Forward to Help With Social Distancing, Renewed Focus Will Be Shed on Industrial Automation
Table: As a Lesson Learnt in Social Distancing from the COVID-19 Pandemic, Use of Industrial Robots to Spike in the Post COVID-19 Period: Industrial Robot Density (Units Per 10,000 Workers) for the Years 2019 & 2023
As Telemedicine Storms into the Spotlight in the Post COVID-19 Period, Medical Wearables to Offer Opportunities for Rigid-flex PCBs
Table: COVID-19 Pandemic Catalyzes Migration to New Models of Remote Care Delivery & Boosts Importance of Electronics Subsystems Supporting Smart Wearables: Global Number of Telemedicine Patients (In Million) for the Years 2016, 2018, 2020, 2023 & 2025
A Return to Economic Normalcy Will Reignite Growth Drivers in the Consumer Electronics End-Use Sector
Table: Smart Homes Emerge as a Disruptive Trend Enhancing Lives of Homeowners & Also Creating New Market Opportunities Players in the Electronics Value Chain: Global Smart Homes Market by Category in US$ Billion for the Years 2020 and 2022
The Coming Era of Electronification of Medical Devices to Bring Attractive Opportunities for Medical PCBs
Table: A 47.1% Increase in Growth in the Post COVID-19 Period for the Medical Devices Industry Encourages an Optimistic Outlook for Medical PCBs: Global Medical Devices Industry (In US$ Billion) for the Years 2000, 2023 & 2025
PCBs are the Core of IoT Devices. Disruptions Caused by the Pandemic & the Push for Connected Tech to Benefit Market Growth
A Review of the IoT Opportunity for Flex and HDI PCBs
Table: IoT to Take a Quantum Leap With the Pandemic Highlighting the Importance of Remote Operations in Ensuring Business Resiliency: Global Number of IoT Connected Devices (In Billion Units) for the Years 2016, 2018, 2020, 2022 & 2025
Coronavirus Outbreak Makes Driverless Cars Attractive. Autonomous Cars Hold Robust Potential for Growth of PCBs in the Post COVID Period
Non-Contact Deliveries Made Popular by the Pandemic Will Ready the PCB Market for the Coming Age of Drones
What Does this Mean for PCB Designers and Manufacturers?
Table: In the Touch-Me-Not Environment to Follow in the Post Pandemic Period, Use of Drones Will Rise to New Highs: Number of Countries Worldwide Using Drones/UAVs by Type 2019 & 2025
As Post Pandemic Economic Rebuilding Efforts Get Underway, Focus on Pandemic Ready Smart Cities Will Create a Hotbed of Opportunities for PCBs
Table: Focus on Reshaping City Resilience to Future Pandemics & Crisis Will Spur Rejuvenated Spending on Smart City Projects in the Post COVID-19 Period, Providing a Goldmine of Opportunities for Electronic Technologies: Global Smart City Spending (In US$ Billion) for the Years 2021, 2023 & 2025
Its a Slower & Longer Road to Recovery for PCBs Used in Defense & Avionics
Table: With the Aviation Industry on the Brink of Annihilation, Pre-Pandemic Digitalization Plans Will Take a Long Time to Witness a Return to Implementation: Expected Revenue Losses in Global Aviation (In US$ Billion)
Table: Massive Employment Losses in Tourism Highlights How Far the Aviation Industry is from Making a Meaningful Recovery: Employment Losses in Tourism (In Million) by End of 2020
Integration of Artificial Intelligence Into PCB Design & Production Comes of Age
4. GLOBAL MARKET PERSPECTIVE
World Current & Future Analysis for Printed Circuit Boards (PCBs) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
World Historic Review for Printed Circuit Boards (PCBs) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
World 15-Year Perspective for Printed Circuit Boards (PCBs) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2012, 2020 & 2027
World Current & Future Analysis for Multi-Layer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
World Historic Review for Multi-Layer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
World 15-Year Perspective for Multi-Layer by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
World Current & Future Analysis for Double-Sided by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
World Historic Review for Double-Sided by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
World 15-Year Perspective for Double-Sided by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
World Current & Future Analysis for Single-Sided by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
World Historic Review for Single-Sided by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
World 15-Year Perspective for Single-Sided by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
World Current & Future Analysis for Standard Multilayer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
World Historic Review for Standard Multilayer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
World 15-Year Perspective for Standard Multilayer by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
World Current & Future Analysis for High-Density Interconnect (HDI) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
World Historic Review for High-Density Interconnect (HDI) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
World 15-Year Perspective for High-Density Interconnect (HDI) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
World Current & Future Analysis for IC Substrate by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
World Historic Review for IC Substrate by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
World 15-Year Perspective for IC Substrate by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
World Current & Future Analysis for Rigid 1-2 Sided by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
World Historic Review for Rigid 1-2 Sided by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
World 15-Year Perspective for Rigid 1-2 Sided by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
World Current & Future Analysis for Rigid-Flex by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
World Historic Review for Rigid-Flex by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
World 15-Year Perspective for Rigid-Flex by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
World Current & Future Analysis for Other Substrate Types by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
World Historic Review for Other Substrate Types by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
World 15-Year Perspective for Other Substrate Types by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
World Current & Future Analysis for Computer & Peripherals by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
World Historic Review for Computer & Peripherals by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
World 15-Year Perspective for Computer & Peripherals by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
World Current & Future Analysis for Communications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
World Historic Review for Communications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
World 15-Year Perspective for Communications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
World Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
World Historic Review for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
World 15-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
World Current & Future Analysis for Industrial Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
World Historic Review for Industrial Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
World 15-Year Perspective for Industrial Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
World Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
World Historic Review for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
World 15-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
World Current & Future Analysis for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
World Historic Review for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
World 15-Year Perspective for Aerospace & Defense by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
World Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
World Historic Review for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
World 15-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
GEOGRAPHIC MARKET ANALYSIS
United States
Semiconductor Industry in the U.S.
USA Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
USA Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
USA 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2020 & 2027
USA Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
USA Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
USA 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2020 & 2027
USA Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
USA Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
USA 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027
Canada
Canada Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Canada Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Canada 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2020 & 2027
Canada Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Canada Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Canada 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2020 & 2027
Canada Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Canada Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Canada 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027
Japan
Semiconductor Industry in Japan
Japan Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Japan Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Japan 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2020 & 2027
Japan Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Japan Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Japan 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2020 & 2027
Japan Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Japan Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Japan 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027
China
China Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
China Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
China 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2020 & 2027
China Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
China Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
China 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2020 & 2027
China Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
China Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
China 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027
Europe
Europe Current & Future Analysis for Printed Circuit Boards (PCBs) by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
Europe Historic Review for Printed Circuit Boards (PCBs) by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Europe 15-Year Perspective for Printed Circuit Boards (PCBs) by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2012, 2020 & 2027
Europe Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Europe Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Europe 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2020 & 2027
Europe Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Europe Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Europe 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2020 & 2027
Europe Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Europe Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Europe 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027
France
France Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
France Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
France 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2020 & 2027
France Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
France Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
France 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2020 & 2027
France Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
France Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
France 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027
Germany
Germany Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Germany Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Germany 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2020 & 2027
Germany Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Germany Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Germany 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2020 & 2027
Germany Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Germany Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Germany 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027
Italy
Italy Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Italy Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Italy 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2020 & 2027
Italy Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Italy Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Italy 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2020 & 2027
Italy Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Italy Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Italy 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027
United Kingdom
UK Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
UK Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
UK 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2020 & 2027
UK Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
UK Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
UK 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2020 & 2027
UK Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
UK Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
UK 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027
Rest of Europe
Rest of Europe Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Rest of Europe Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Rest of Europe 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2020 & 2027
Rest of Europe Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Rest of Europe Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Rest of Europe 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2020 & 2027
Rest of Europe Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Rest of Europe Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Rest of Europe 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027
Asia-Pacific
Asia-Pacific Current & Future Analysis for Printed Circuit Boards (PCBs) by Geographic Region - South Korea, Taiwan and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
Asia-Pacific Historic Review for Printed Circuit Boards (PCBs) by Geographic Region - South Korea, Taiwan and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Asia-Pacific 15-Year Perspective for Printed Circuit Boards (PCBs) by Geographic Region - Percentage Breakdown of Value Sales for South Korea, Taiwan and Rest of Asia-Pacific Markets for Years 2012, 2020 & 2027
Asia-Pacific Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Asia-Pacific Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Asia-Pacific 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2020 & 2027
Asia-Pacific Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Asia-Pacific Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Asia-Pacific 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2020 & 2027
Asia-Pacific Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Asia-Pacific Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Asia-Pacific 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027
South Korea
South Korea Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
South Korea Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
South Korea 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2020 & 2027
South Korea Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
South Korea Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
South Korea 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2020 & 2027
South Korea Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
South Korea Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
South Korea 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027
Taiwan
Taiwan, a Semiconductor Behemoth
Taiwan Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Taiwan Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Taiwan 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2020 & 2027
Taiwan Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Taiwan Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Taiwan 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2020 & 2027
Taiwan Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Taiwan Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Taiwan 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027
Rest of Asia-Pacific
Rest of Asia-Pacific Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Rest of Asia-Pacific Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Rest of Asia-Pacific 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2020 & 2027
Rest of Asia-Pacific Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Rest of Asia-Pacific Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Rest of Asia-Pacific 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2020 & 2027
Rest of Asia-Pacific Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Rest of Asia-Pacific Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Rest of Asia-Pacific 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027
Rest of World
Rest of World Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Rest of World Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Rest of World 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2020 & 2027
Rest of World Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Rest of World Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Rest of World 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2020 & 2027
Rest of World Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Rest of World Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Rest of World 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027
Total Companies Profiled : 225

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