SYSTEM-ON-A-CHIP (SOC)

Global Market Trajectory & Analytics

MCP-1471

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  •  DATE

    JANUARY 2022

  •  TABLES

    213

  •  PAGES

    326

  •  EDITION

    15

  •  PRICE

    USD $5600


COVID-19 IMPACT SURVEY

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Amid the COVID-19 crisis, the global market for System-On-A-Chip (SoC) estimated at US$65.3 Billion in the year 2020, is projected to reach a revised size of US$118.8 Billion by 2027, growing at a CAGR of 8.9% over the analysis period 2020-2027. Mixed Signal, one of the segments analyzed in the report, is projected to record a 10% CAGR and reach US$52.7 Billion by the end of the analysis period. After an early analysis of the business implications of the pandemic and its induced economic crisis, growth in the Digital segment is readjusted to a revised 8.8% CAGR for the next 7-year period.
The System-On-A-Chip (SoC) market in the U.S. is estimated at US$17.8 Billion in the year 2020. China, the world`s second largest economy, is forecast to reach a projected market size of US$26.5 Billion by the year 2027 trailing a CAGR of 13.4% over the analysis period 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 5.1% and 8.1% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 6% CAGR.
In the global Analog segment, USA, Canada, Japan, China and Europe will drive the 7.3% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$11.8 Billion in the year 2020 will reach a projected size of US$19.3 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$16.3 Billion by the year 2027, while Latin America will expand at a 9.3% CAGR through the analysis period.
Competitors identified in this market include, among others, Apple Inc.; ARM Holdings Plc; Broadcom Corporation; Infineon Technologies AG; Intel Corporation; Marvell Technology Group Ltd.; Microsemi Corp.; NVIDIA Corporation; NXP Semiconductors N.V.; Palmchip Corporation; Qualcomm Inc.; Renesas Electronics Corporation; Samsung Electronics Co., Ltd.; STMicroelectronics; Taiwan Semiconductor Manufacturing Co., Ltd.; Texas Instruments, Inc.; Xilinx, Inc.
» Type (Mixed Signal, Digital, Analog, Other Types) » Application (Consumer Electronics, Telecommunication, Automotive, Other Applications)
» World » United States » Canada » Japan » China » Europe » France » Germany » Italy » United Kingdom » Spain » Russia » and Rest of Europe » Asia-Pacific » Australia » India » South Korea » and Rest of Asia-Pacific » Latin America » Argentina » Brazil » Mexico » and Rest of Latin America » Middle East » Iran » Israel » Saudi Arabia » United Arab Emirates » and Rest of Middle East » and Africa

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