EXECUTIVE ENGAGEMENTS
OUTREACH
3272
Number of executives repeatedly engaged by snail & email outreach
INTERACTIONS
589
Interactions with Platform & by Email
PARTICIPANTS
98
Unique # Participated
VALIDATIONS
44
Responses Validated*
COMPETITORS
75
Responses Validated*
* Login for a full stack data experience
DATE
JAN 2021
TABLES
132
PAGES
414
EDITION
5
PRICE
USD $4950
HIGHLIGHTS
Amid the COVID-19 crisis, the global market for Semiconductor and IC Packaging Materials estimated at US$25 Billion in the year 2020, is projected to reach a revised size of US$36 Billion by 2027, growing at a CAGR of 5.3% over the analysis period 2020-2027.Organic Substrates, one of the segments analyzed in the report, is projected to grow at a 5.8% CAGR to reach US$10.7 Billion by the end of the analysis period.After an early analysis of the business implications of the pandemic and its induced economic crisis, growth in the Bonding Wires segment is readjusted to a revised 4.9% CAGR for the next 7-year period. This segment currently accounts for a 18.6% share of the global Semiconductor and IC Packaging Materials market.
The Semiconductor and IC Packaging Materials market in the U.S. is estimated at US$3.2 Billion in the year 2020. The country currently accounts for a 12.84% share in the global market. China, the world second largest economy, is forecast to reach an estimated market size of US$9.2 Billion in the year 2027 trailing a CAGR of 6.2% through 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 3.5% and 4.6% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 4.1% CAGR while Rest of European market (as defined in the study) will reach US$9.2 Billion by the year 2027.
In the global Lead frames segment, USA, Canada, Japan, China and Europe will drive the 3.2% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$2.2 Billion in the year 2020 will reach a projected size of US$2.7 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$12.2 Billion by the year 2027.We bring years of research experience to this 5th edition of our report. The 184-page report presents concise insights into how the pandemic has impacted production and the buy side for 2020 and 2021. A short-term phased recovery by key geography is also addressed.
SELECT PLAYERS
Amkor Technology, Inc.; BASF SE; DuPont de Nemours, Inc.; Element Solutions Inc.; Henkel AG & Co. KGaA; Honeywell International Inc.; Kyocera Chemical Corporation; LG Chem Ltd.; Mitsui High-tec, Inc.; Showa Denko Materials Co., Ltd.; Sumitomo Bakelite Co., Ltd.; Tanaka Holdings Co., Ltd.; Toppan Printing Co., Ltd.; Toray Industries, Inc.
SEGMENTS
» Type (Organic Substrates, Bonding Wires, Lead Frames, Ceramic Packages, Encapsulation Resins, Other Types) » End-Use (Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense, Other End-Uses)
GEOGRAPHIES
» World » USA » Canada » Japan » China » Europe » France » Germany » Italy » UK » Rest of Europe » Asia-Pacific » South Korea » Taiwan » Rest of Asia-Pacific » Rest of World
TABLE OF CONTENTS
| I. METHODOLOGY |
| II. EXECUTIVE SUMMARY |
| 1. MARKET OVERVIEW |
| No Prizes for Guessing the Importance of Semiconductors |
| As 2020 Draws to a Close, It Has Been a Year of Astounding Disruption & Unbelievable Transformation |
| Table: COVID-19 Leaves the World in Shambles & Industries and Markets Upended: World Economic Growth Projections (Real GDP, Annual % Change) for 2019, 2020 & 2021 |
| Semiconductors Are Key Part of the Electronics Value Chain. COVID-19 Exposes the Risk of Value Chain Modularity |
| Among the Hammered in the Supply Chain is the “Semiconductor Industry” |
| The Human Cost of the Pandemic Intensifies the Shockwaves Ripping Through the Semiconductor Industry |
| Table: A Big Blow to Consumerism, Rising Levels of Unemployment Threatens to Shrink the Global Middle Class Population: Unemployment in the U.S. (In Million) |
| Eventual Recovery after the Downturn |
| Outlook Beyond 2020 Remains Promising. Here’s Why |
| COVID-19 Accelerates Digital Transformation |
| Table: COVID-19 Has Created an Environment Where Digital Transformation Equals Survival: Global Digital Transformation Spending (In US$ Billion) for Years 2017 Through 2023 |
| Focus Shed on Harnessing Digital Transformation Bodes Well for All Things Electronic & Digital. Semiconductors Storm Into the Spotlight |
| Semiconductor ICs & Packaging Materials, Definition, Scope, Importance & Types |
| Recent Market Activity |
| Innovations |
| 2. FOCUS ON SELECT PLAYERS |
| 3. MARKET TRENDS & DRIVERS |
| Emergence of Quantum Computing Drives the Importance of Semiconductors From Design to Materials |
| Table: As Quantum Hardware Emerges Into an Active Area of Research, New Opportunities to Open for All in the Semiconductor Value Chain: Global Market for Quantum Computing (In US$ Million) for Years 2020 2024 & 2027 |
| Growing Demand for New Generation Smart ICs for Emerging Technologies like AI Bodes Well for Growth |
| Special Focus on AI: Here’s Why AI is Witnessing Robust Growth |
| Table: AI Unleashes a New Wave of Growth for Next Gen Semiconductors: Global Market for Artificial Intelligence (In US$ Billion) for Years 2021, 2025, 2027 |
| AI Hardware: A New & Robust Area of Opportunity for Semiconductor Companies |
| Table: Rapidly Evolving AI Hardware Market to Boost Semiconductor Sales & Revenues, a Postive Growth Indicator for Semiconductor & IC Packaging Materials: Global AI Semiconductor Market (In US$ Billion) for Years 2020, 2023 & 2025 |
| Post COVID-19 As Technology Steps Forward to Help With Social Distancing, Renewed Focus Will Be Shed on Industrial Automation: Industrial Semiconductors to Emerge Into a Key Growth Pocket |
| Table: As a Lesson Learnt in Social Distancing from the COVID-19 Pandemic, Use of Industrial Robots to Spike in the Post COVID-19 Period: Industrial Robot Density (Units Per 10,000 Workers) |
| Table: Global Market for Industrial Semiconductors (In US$ Billion) for Years 2020, 2022 & 2024 |
| Looking Beyond Current Challenges, the Coming Age of Autonomous Driving to Spur Growth Across the Semiconductor Value Chain |
| 2020, A Bad Year for Automobile Sales |
| Table: COVID-19 Triggers Massive, Unexpected & Unprecedented Erosion in Vehicle Sales: Decline in Global Auto Sales (In Million Units) in the Year 2020 |
| Although Bad, 2020 is Not the Worst Year: The Pandemic Accelerates Autonomous Driving Technologies |
| Table: COVID-19 Hits the Gas Pedal, Accelerating the Journey Towards Autonomous Driving. Joining This Exciting Journey Littered With Opportunities is Automotive Semiconductors: Global Autonomous Vehicle Sales (In Million) |
| Table: Global Autonomous Vehicle Sales (In US$ Billion) |
| The Future of Modern Cars is Digital. Software & Electronics Gain Precedence |
| Table: Measuring the Growing Importance of Electronics in Cars: Automotive Electronics as a Percentage of Vehicle Production Cost for the Years 2010, 2020 & 2030 |
| Rapid Proliferation of Electronic & Electrical Subsystems and Sub-Assembles Powered by Electronification and Electrification Trends Drives the Commercial Value of Electronic Adhesives |
| Table: Average Value of In-Vehicle Electronics Per Vehicle (In US$) for the Years 2018, 2025 & 2030 |
| 3D Packaging Emerges As a Key Driver of Growth & Innovation in the Market |
| New Packaging Technologies Crucial to Semiconductor Innovation |
| A Review of the Aerospace Industry: 2020 Impact & Recovery |
| Darkening Outlook for the Aerospace Industry Overshadows Semiconductor Demand in this Sector |
| Declines in Air Cargo Worsens an Already Punishing Business Climate |
| Table: With the Aviation Industry on the Brink of Annihilation, Sluggish Aircraft Assembly Lines Means Aerospace Semiconductor Will Take Longer to Recover: Expected Revenue Losses in Global Aviation (In US$ Billion) for the Year 2020 |
| Post COVID Recovery Will be Led by the New Era of Connected Aircraft |
| Table: Robust Outlook for the Future of Connected Aviation to Open Up Opportunities to New Gen Semiconductor Solutions: Global Number of Connected Aircraft (In Units) for the Years 2016, 2018, 2021, 2025 & 2029 |
| 4. GLOBAL MARKET PERSPECTIVE |
| World Current & Future Analysis for Semiconductor & IC Packaging Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 |
| World Historic Review for Semiconductor & IC Packaging Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| World 15-Year Perspective for Semiconductor & IC Packaging Materials by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2012, 2020 & 2027 |
| World Current & Future Analysis for Organic Substrates by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 |
| World Historic Review for Organic Substrates by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| World 15-Year Perspective for Organic Substrates by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027 |
| World Current & Future Analysis for Bonding Wires by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 |
| World Historic Review for Bonding Wires by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| World 15-Year Perspective for Bonding Wires by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027 |
| World Current & Future Analysis for Lead frames by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 |
| World Historic Review for Lead frames by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| World 15-Year Perspective for Lead frames by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027 |
| World Current & Future Analysis for Ceramic Packages by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 |
| World Historic Review for Ceramic Packages by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| World 15-Year Perspective for Ceramic Packages by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027 |
| World Current & Future Analysis for Encapsulation Resins by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 |
| World Historic Review for Encapsulation Resins by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| World 15-Year Perspective for Encapsulation Resins by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027 |
| World Current & Future Analysis for Other Types by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 |
| World Historic Review for Other Types by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| World 15-Year Perspective for Other Types by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027 |
| World Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 |
| World Historic Review for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| World 15-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027 |
| World Current & Future Analysis for Communications & Telecom by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 |
| World Historic Review for Communications & Telecom by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| World 15-Year Perspective for Communications & Telecom by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027 |
| World Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 |
| World Historic Review for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| World 15-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027 |
| World Current & Future Analysis for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 |
| World Historic Review for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| World 15-Year Perspective for Aerospace & Defense by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027 |
| World Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 |
| World Historic Review for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| World 15-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027 |
| III. MARKET ANALYSIS |
| UNITED STATES |
| USA Current & Future Analysis for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 |
| USA Historic Review for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| USA 15-Year Perspective for Semiconductor & IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027 |
| USA Current & Future Analysis for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 |
| USA Historic Review for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| USA 15-Year Perspective for Semiconductor & IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027 |
| CANADA |
| Canada Current & Future Analysis for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 |
| Canada Historic Review for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| Canada 15-Year Perspective for Semiconductor & IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027 |
| Canada Current & Future Analysis for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 |
| Canada Historic Review for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| Canada 15-Year Perspective for Semiconductor & IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027 |
| JAPAN |
| Japan Current & Future Analysis for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 |
| Japan Historic Review for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| Japan 15-Year Perspective for Semiconductor & IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027 |
| Japan Current & Future Analysis for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 |
| Japan Historic Review for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| Japan 15-Year Perspective for Semiconductor & IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027 |
| CHINA |
| China Current & Future Analysis for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 |
| China Historic Review for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| China 15-Year Perspective for Semiconductor & IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027 |
| China Current & Future Analysis for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 |
| China Historic Review for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| China 15-Year Perspective for Semiconductor & IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027 |
| EUROPE |
| Europe Current & Future Analysis for Semiconductor & IC Packaging Materials by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 |
| Europe Historic Review for Semiconductor & IC Packaging Materials by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| Europe 15-Year Perspective for Semiconductor & IC Packaging Materials by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2012, 2020 & 2027 |
| Europe Current & Future Analysis for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 |
| Europe Historic Review for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| Europe 15-Year Perspective for Semiconductor & IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027 |
| Europe Current & Future Analysis for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 |
| Europe Historic Review for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| Europe 15-Year Perspective for Semiconductor & IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027 |
| FRANCE |
| France Current & Future Analysis for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 |
| France Historic Review for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| France 15-Year Perspective for Semiconductor & IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027 |
| France Current & Future Analysis for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 |
| France Historic Review for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| France 15-Year Perspective for Semiconductor & IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027 |
| GERMANY |
| Germany Current & Future Analysis for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 |
| Germany Historic Review for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| Germany 15-Year Perspective for Semiconductor & IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027 |
| Germany Current & Future Analysis for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 |
| Germany Historic Review for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| Germany 15-Year Perspective for Semiconductor & IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027 |
| ITALY |
| Italy Current & Future Analysis for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 |
| Italy Historic Review for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| Italy 15-Year Perspective for Semiconductor & IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027 |
| Italy Current & Future Analysis for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 |
| Italy Historic Review for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| Italy 15-Year Perspective for Semiconductor & IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027 |
| UNITED KINGDOM |
| UK Current & Future Analysis for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 |
| UK Historic Review for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| UK 15-Year Perspective for Semiconductor & IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027 |
| UK Current & Future Analysis for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 |
| UK Historic Review for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| UK 15-Year Perspective for Semiconductor & IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027 |
| REST OF EUROPE |
| Rest of Europe Current & Future Analysis for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 |
| Rest of Europe Historic Review for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| Rest of Europe 15-Year Perspective for Semiconductor & IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027 |
| Rest of Europe Current & Future Analysis for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 |
| Rest of Europe Historic Review for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| Rest of Europe 15-Year Perspective for Semiconductor & IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027 |
| ASIA-PACIFIC |
| Asia-Pacific Current & Future Analysis for Semiconductor & IC Packaging Materials by Geographic Region - South Korea, Taiwan and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 |
| Asia-Pacific Historic Review for Semiconductor & IC Packaging Materials by Geographic Region - South Korea, Taiwan and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| Asia-Pacific 15-Year Perspective for Semiconductor & IC Packaging Materials by Geographic Region - Percentage Breakdown of Value Sales for South Korea, Taiwan and Rest of Asia-Pacific Markets for Years 2012, 2020 & 2027 |
| Asia-Pacific Current & Future Analysis for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 |
| Asia-Pacific Historic Review for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| Asia-Pacific 15-Year Perspective for Semiconductor & IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027 |
| Asia-Pacific Current & Future Analysis for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 |
| Asia-Pacific Historic Review for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| Asia-Pacific 15-Year Perspective for Semiconductor & IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027 |
| SOUTH KOREA |
| South Korea Current & Future Analysis for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 |
| South Korea Historic Review for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| South Korea 15-Year Perspective for Semiconductor & IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027 |
| South Korea Current & Future Analysis for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 |
| South Korea Historic Review for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| South Korea 15-Year Perspective for Semiconductor & IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027 |
| TAIWAN |
| Taiwan Current & Future Analysis for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 |
| Taiwan Historic Review for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| Taiwan 15-Year Perspective for Semiconductor & IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027 |
| Taiwan Current & Future Analysis for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 |
| Taiwan Historic Review for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| Taiwan 15-Year Perspective for Semiconductor & IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027 |
| REST OF ASIA-PACIFIC |
| Rest of Asia-Pacific Current & Future Analysis for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 |
| Rest of Asia-Pacific Historic Review for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| Rest of Asia-Pacific 15-Year Perspective for Semiconductor & IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027 |
| Rest of Asia-Pacific Current & Future Analysis for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 |
| Rest of Asia-Pacific Historic Review for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| Rest of Asia-Pacific 15-Year Perspective for Semiconductor & IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027 |
| REST OF WORLD |
| Rest of World Current & Future Analysis for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 |
| Rest of World Historic Review for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| Rest of World 15-Year Perspective for Semiconductor & IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027 |
| Rest of World Current & Future Analysis for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 |
| Rest of World Historic Review for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 |
| Rest of World 15-Year Perspective for Semiconductor & IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027 |
| IV. COMPETITION |
| Total Companies Profiled: 75 |
The World of Semiconductor and IC Packaging Materials is Changing Fast!
It's Time to Identify Upcoming Revenue Pockets & Growth Areas.
PREVIEW REPORT
Our robust permission-based engagement strategy requires a one-time double opt-in and/or re-consent for all users. We will re-establish consent once a year from date of last use. Both these practices exceed GDPR mandates.
What we store: Primary coordinates such as email, company address and phone. In-house developed influencer rank.
How we store: Encrypted and additionally secured by firewalls.
How we use your data: Only to contact you directly. We never share your coordinates with any individual or entity outside our company for any reason.
Privacy queries: Privacy@StrategyR.com