Semiconductor and IC Packaging Materials

World Market Report

MCP14657

EXECUTIVE ENGAGEMENTS

POOL

3283
Number of executives repeatedly engaged by snail & email outreach

INTERACTIONS

598
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PARTICIPANTS

104
Unique # Participated

VALIDATIONS

33
Responses Validated*

COMPANIES

106
Responses Validated*
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DATE

JAN 2023

TABLES

132

PAGES

452

EDITION

7

PRICE

USD 4950

CODE

MCP14657


COMPETITIVE METRICS

COMPETITORS (ALPHABETICAL)

RANK

(S/A/N/T)

%

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* S = Strong; A = Active; N = Niche; T= Trivial (<1%)
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HIGHLIGHTS & REPORT INDEX

What`s New for 2023?

» Special coverage on Russia-Ukraine war; global inflation; easing of "zero-Covid" policy in China and its `bumpy` reopening; supply chain disruptions, global trade tensions; and risk of recession.
» Global competitiveness and key competitor percentage market shares
» Market presence across multiple geographies - Strong/Active/Niche/Trivial
» Online interactive peer-to-peer collaborative bespoke updates
» Access to our digital archives and MarketGlass Research Platform
» Complimentary updates for one year

Looking Ahead to 2023

The global economy is at a critical crossroads with a number of interlocking challenges and crises running in parallel. The uncertainty around how Russia`s war on Ukraine will play out this year and the war`s role in creating global instability means that the trouble on the inflation front is not over yet. Food and fuel inflation will remain a persistent economic problem. Higher retail inflation will impact consumer confidence and spending. As governments combat inflation by raising interest rates, new job creation will slowdown and impact economic activity and growth. Lower capital expenditure is in the offing as companies go slow on investments, held back by inflation worries and weaker demand. With slower growth and high inflation, developed markets seem primed to enter into a recession. Fears of new COVID outbreaks and China’s already uncertain post-pandemic path poses a real risk of the world experiencing more acute supply chain pain and manufacturing disruptions this year. Volatile financial markets, growing trade tensions, stricter regulatory environment and pressure to mainstream climate change into economic decisions will compound the complexity of challenges faced. Year 2023 is expected to be tough year for most markets, investors and consumers. Nevertheless, there is always opportunity for businesses and their leaders who can chart a path forward with resilience and adaptability.

Global Semiconductor and IC Packaging Materials Market to Reach $49.1 Billion by 2027
In the changed post COVID-19 business landscape, the global market for Semiconductor and IC Packaging Materials estimated at US$21.2 Billion in the year 2020, is projected to reach a revised size of US$49.1 Billion by 2027, growing at a CAGR of 12.8% over the analysis period 2020-2027. Organic Substrates, one of the segments analyzed in the report, is projected to record a 13.8% CAGR and reach US$14.6 Billion by the end of the analysis period. Taking into account the ongoing post pandemic recovery, growth in the Bonding Wires segment is readjusted to a revised 14.8% CAGR for the next 7-year period.

The U.S. Market is Estimated at $1.5 Billion, While China is Forecast to Grow at 15.3% CAGR
The Semiconductor and IC Packaging Materials market in the U.S. is estimated at US$1.5 Billion in the year 2020. China, the world`s second largest economy, is forecast to reach a projected market size of US$11.2 Billion by the year 2027 trailing a CAGR of 15.3% over the analysis period 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 11% and 6.9% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 10.8% CAGR.Ceramic Packages Segment to Record 10.8% CAGR
In the global Ceramic Packages segment, USA, Canada, Japan, China and Europe will drive the 10.8% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$1.6 Billion in the year 2020 will reach a projected size of US$3.1 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets.

SELECT PLAYERS

Amkor Technology, Inc.; BASF SE; DuPont de Nemours, Inc.; eChem Solutions Corp.; Henkel AG & Co. KGaA; Honeywell International Inc. ; Kyocera Chemical Co. Ltd.; LG Chemical Ltd.; Mitsui High-Tec., Inc.; Showa Denko Materials Co., Ltd.; Sumitomo Bakelite Co., Ltd.; Tanaka Holdings Co., Ltd.; Toppan Printing Co., Ltd.; Toray Industries Inc.

SEGMENTS

» Type (Organic Substrates, Bonding Wires, Ceramic Packages, Lead Frames, Encapsulation Resins, Other Types) » End-Use (Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense, Other End-Uses)

GEOGRAPHIES

» World » USA » Canada » Japan » China » Europe » France » Germany » Italy » UK » Rest of Europe » Asia-Pacific » South Korea » Taiwan » Rest of Asia-Pacific » Rest of World

TABLE OF CONTENTS

1. MARKET OVERVIEW
Semiconductor ICs & Packaging Materials, Definition, Scope, Importance & Types
As “Digitalization of Everything” Creeps Through Every Facet of Modern Life, Semiconductors the Lifeblood of the Whole Concept Becomes the Most Chased After Commodity
Table: The Semiconductor Decade is on its Way Guided by the Digitalization Wave: Digital Transformation (DX) Spending of Business Practices, Products & Organization (In US$ Billion) for Years 2021 Through 2025
Table: Digital Transformation Across Networking & Communications, Data Processing, Industrial, Consumer Electronics, Automotive, Aerospace, Healthcare, Retail, Media & Entertainment Shapes a Robust Semiconductor Industry Vital to the Continued Evolution of Human Civilization: Global Semiconductor Industry (In US$ Billion) for Years 2022, 2024, 2026, 2028, and 2030
What’s Ahead for Businesses & Markets?
Table: Shaken by the War, Global Oil Prices Spiral & Feed Inflationary Pressures: Global Average Annual Brent Crude Oil Price (In US$ Per Barrel) for Years 2017 through 2022
Table: War-Induced Commodity Price Increases & Broad Based Price Pressures Mark the Return of Global Inflation in 2022: Global Inflation Rates (In %) for the Years 2019 Through 2022
Table: After the Pandemic, Global Economic Uncertainty Surges Amidst War, Inflation, Political Tensions & Supply Chain Disruptions Aggravated by China’s Slowdown: World Economic Growth Projections (Real GDP, Annual % Change) for the Years 2020, 2021, 2022 and 2023
Competition
Semiconductor and IC Packaging Materials – Global Key Competitors Percentage Market Share in 2022 (E)
Competitive Market Presence - Strong/Active/Niche/Trivial for 106 Players Worldwide in 2022 (E)
Semiconductor ICs & Packaging Materials: Introduction, Types, Market Structure
World Brands
Recent Market Activity
2. FOCUS ON SELECT PLAYERS
3. MARKET TRENDS & DRIVERS
As Global Chip Shortage Continues Into the Year 2022, It is Time to Review the Implications for Semiconductor Materials & Consumables
Rising Semiconductor Demand, Favorable Regulations & Robust Demand for Advanced Packaging Drives Growth of Packaging Materials
Table: Roust Outlook for Semiconductor Advanced Packaging Technologies to Brighten Opportunities in the Upstream Packaging Materials Market: Global Semiconductor Advanced Packaging Market by Technology (In US$ Million) for Years 2022, 2024, and 2026
Emergence of Quantum Computing Drives the Importance of Semiconductors From Design to Materials
Table: As Quantum Hardware Emerges Into an Active Area of Research, New Opportunities to Open for All in the Semiconductor Value Chain: Global Market for Quantum Computing (In US$ Million) for Years 2022, 2024, 2026 & 2028
Growing Demand for New Generation Smart ICs for Emerging Technologies like AI Bodes Well for Market Growth
Table: Growing Focus on AI Chip Development & Production Opens a Parallel Growth Avenue for Chip Packaging Materials: Global Market for AI Chips (In US$ Billion) for Years 2022, 2024, 2026, 2028 and 2030
Vehicle Electronification & Autonomous Driving to Bring the Automotive Industry Into the Spotlight as One of the Fastest Growing End-Uses Sector
Table: The Exciting Journey Towards Autonomous Driving is Littered with Opportunities for Automotive Semiconductors: Global Autonomous Vehicle Sales (In Units) for Years 2022, 2024 & 2026
3D Packaging Emerges As a Key Driver of Growth & Innovation in the Market
Development New Packaging Technologies Bodes Well for Market Growth
IoT Ecosystem to Rev Up Opportunities for Semiconductor Advanced Packaging Technologies & Materials
Table: Growing Ecosystem of IoT Devices Bodes Well for IoT Hardware Including ICs/Chips & Modules: Global Number of IoT Connected Devices (In Billion) for Years 2015, 2017, 2019, 2021, 2023, and 2025
Connected Aircraft to Drive the Aerospace End-Use Industry’s Appetite for Semiconductor Chips & Packaging Materials
Table: Robust Outlook for the Future of Connected Aviation to Open Up Opportunities to New Generation Semiconductor Solutions: Global Number of Connected Aircraft (In Units) for the Years 2021, 2025 & 2029
A Quick Review of Key Market Challenges
4. GLOBAL MARKET PERSPECTIVE
World Semiconductor and IC Packaging Materials Market Analysis of Annual Sales in US$ Million for Years 2012 through 2027
World Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Semiconductor and IC Packaging Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Semiconductor and IC Packaging Materials by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for Organic Substrates by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Organic Substrates by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Organic Substrates by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for Bonding Wires by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Bonding Wires by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Bonding Wires by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for Lead frames by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Lead frames by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Lead frames by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for Ceramic Packages by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Ceramic Packages by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Ceramic Packages by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for Encapsulation Resins by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Encapsulation Resins by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Encapsulation Resins by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for Other Types by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Other Types by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Other Types by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for Communications & Telecom by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Communications & Telecom by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Communications & Telecom by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Aerospace & Defense by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
UNITED STATES
Semiconductor and IC Packaging Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2022 (E)
USA Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
USA Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
USA 15-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2021 & 2027
USA Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
USA Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
USA 15-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
CANADA
Canada Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Canada Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Canada 15-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2021 & 2027
Canada Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Canada Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Canada 15-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
JAPAN
Japan Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Japan Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Japan 15-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2021 & 2027
Japan Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Japan Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Japan 15-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
CHINA
China Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
China Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
China 15-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2021 & 2027
China Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
China Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
China 15-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
EUROPE
Semiconductor and IC Packaging Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2022 (E)
Europe Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
Europe Historic Review for Semiconductor and IC Packaging Materials by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Europe 15-Year Perspective for Semiconductor and IC Packaging Materials by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2012, 2021 & 2027
Europe Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Europe Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Europe 15-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2021 & 2027
Europe Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Europe Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Europe 15-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
FRANCE
France Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
France Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
France 15-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2021 & 2027
France Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
France Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
France 15-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
GERMANY
Germany Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Germany Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Germany 15-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2021 & 2027
Germany Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Germany Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Germany 15-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
ITALY
Italy Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Italy Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Italy 15-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2021 & 2027
Italy Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Italy Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Italy 15-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
UNITED KINGDOM
UK Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
UK Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
UK 15-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2021 & 2027
UK Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
UK Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
UK 15-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
REST OF EUROPE
Rest of Europe Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Rest of Europe Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Rest of Europe 15-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2021 & 2027
Rest of Europe Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Rest of Europe Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Rest of Europe 15-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
ASIA-PACIFIC
Semiconductor and IC Packaging Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2022 (E)
Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Geographic Region - South Korea, Taiwan and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
Asia-Pacific Historic Review for Semiconductor and IC Packaging Materials by Geographic Region - South Korea, Taiwan and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Asia-Pacific 15-Year Perspective for Semiconductor and IC Packaging Materials by Geographic Region - Percentage Breakdown of Value Sales for South Korea, Taiwan and Rest of Asia-Pacific Markets for Years 2012, 2021 & 2027
Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Asia-Pacific Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Asia-Pacific 15-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2021 & 2027
Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Asia-Pacific Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Asia-Pacific 15-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
SOUTH KOREA
South Korea Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
South Korea Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
South Korea 15-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2021 & 2027
South Korea Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
South Korea Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
South Korea 15-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
TAIWAN
Taiwan Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Taiwan Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Taiwan 15-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2021 & 2027
Taiwan Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Taiwan Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Taiwan 15-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
REST OF ASIA-PACIFIC
Rest of Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Rest of Asia-Pacific Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Rest of Asia-Pacific 15-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2021 & 2027
Rest of Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Rest of Asia-Pacific Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Rest of Asia-Pacific 15-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
REST OF WORLD
Rest of World Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Rest of World Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Rest of World 15-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2021 & 2027
Rest of World Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Rest of World Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Rest of World 15-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027

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