What`s New for 2023?

» Special coverage on Russia-Ukraine war; global inflation; easing of "zero-Covid" policy in China and its `bumpy` reopening; supply chain disruptions, global trade tensions; and risk of recession.
» Global competitiveness and key competitor percentage market shares
» Market presence across multiple geographies - Strong/Active/Niche/Trivial
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Looking Ahead to 2023

The global economy is at a critical crossroads with a number of interlocking challenges and crises running in parallel. The uncertainty around how Russia`s war on Ukraine will play out this year and the war`s role in creating global instability means that the trouble on the inflation front is not over yet. Food and fuel inflation will remain a persistent economic problem. Higher retail inflation will impact consumer confidence and spending. As governments combat inflation by raising interest rates, new job creation will slowdown and impact economic activity and growth. Lower capital expenditure is in the offing as companies go slow on investments, held back by inflation worries and weaker demand. With slower growth and high inflation, developed markets seem primed to enter into a recession. Fears of new COVID outbreaks and China’s already uncertain post-pandemic path poses a real risk of the world experiencing more acute supply chain pain and manufacturing disruptions this year. Volatile financial markets, growing trade tensions, stricter regulatory environment and pressure to mainstream climate change into economic decisions will compound the complexity of challenges faced. Year 2023 is expected to be tough year for most markets, investors and consumers. Nevertheless, there is always opportunity for businesses and their leaders who can chart a path forward with resilience and adaptability.

Global Semiconductor and IC Packaging Materials Market to Reach $49.1 Billion by 2027
In the changed post COVID-19 business landscape, the global market for Semiconductor and IC Packaging Materials estimated at US$21.2 Billion in the year 2020, is projected to reach a revised size of US$49.1 Billion by 2027, growing at a CAGR of 12.8% over the analysis period 2020-2027. Organic Substrates, one of the segments analyzed in the report, is projected to record a 13.8% CAGR and reach US$14.6 Billion by the end of the analysis period. Taking into account the ongoing post pandemic recovery, growth in the Bonding Wires segment is readjusted to a revised 14.8% CAGR for the next 7-year period.

The U.S. Market is Estimated at $1.5 Billion, While China is Forecast to Grow at 15.3% CAGR
The Semiconductor and IC Packaging Materials market in the U.S. is estimated at US$1.5 Billion in the year 2020. China, the world`s second largest economy, is forecast to reach a projected market size of US$11.2 Billion by the year 2027 trailing a CAGR of 15.3% over the analysis period 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 11% and 6.9% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 10.8% CAGR.Ceramic Packages Segment to Record 10.8% CAGR
In the global Ceramic Packages segment, USA, Canada, Japan, China and Europe will drive the 10.8% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$1.6 Billion in the year 2020 will reach a projected size of US$3.1 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets.