VALIDATED EXECUTIVE ENGAGEMENTS
POOL + OUTREACH
3272
Number of executives repeatedly engaged by snail & email outreach
INTERACTIONS
589
Interactions with Platform & by Email
PARTICIPANTS
98
Unique # Participated
VALIDATIONS
44
Responses Validated*
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DATE
SEPTEMBER 2020
TABLES
120
PAGES
187
EDITION
5
PRICE
USD $4950
Easy Growth Opportunities Often Go Unnoticed. Find Your "Low Hanging Fruit".
Top Markets for Semiconductor & IC Packaging Materials.
Amid the COVID-19 crisis, the global market for Semiconductor and IC Packaging Materials estimated at US$26.5 Billion in the year 2020, is projected to reach a revised size of US$35.7 Billion by 2027, growing at a CAGR of 4.3% over the analysis period 2020-2027. Organic Substrates, one of the segments analyzed in the report, is projected to record a 5.2% CAGR and reach US$11.3 Billion by the end of the analysis period. After an early analysis of the business implications of the pandemic and its induced economic crisis, growth in the Bonding Wires segment is readjusted to a revised 4.7% CAGR for the next 7-year period.
The Semiconductor and IC Packaging Materials market in the U.S. is estimated at US$7.8 Billion in the year 2020. China, the world`s second largest economy, is forecast to reach a projected market size of US$6.3 Billion by the year 2027 trailing a CAGR of 4% over the analysis period 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 4.1% and 3.5% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 4% CAGR.
In the global Lead frames segment, USA, Canada, Japan, China and Europe will drive the 4.6% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$2.8 Billion in the year 2020 will reach a projected size of US$3.9 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$4 Billion by the year 2027.We bring years of research experience to this 5th edition of our report. The 187-page report presents concise insights into how the pandemic has impacted production and the buy side for 2020 and 2021. A short-term phased recovery by key geography is also addressed.
BASF SE; Henkel AG & Co. KGaA; Hitachi Chemical Co., Ltd.; LG Chem Ltd.; Mitsui High-Tec Inc.; Sumitomo Chemical Co., Ltd.; Tanaka Holdings Co., Ltd.; Toray Industries, Inc.
» Packaging Technologies (SOP, GA, QFN, DFN, Other Packaging Technologies) » Types (Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins, Other Types)
» World » United States » Canada » Japan » China » Europe » France » Germany » Italy » United Kingdom » and Rest of Europe » Asia-Pacific » Rest of World
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05
| I. INTRODUCTION, METHODOLOGY & REPORT SCOPE |
| II. EXECUTIVE SUMMARY |
| 1. MARKET OVERVIEW |
| Global Competitor Market Shares |
| Semiconductor & IC Packaging Materials Competitor Market Share Scenario Worldwide (in %): 2019 & 2025 |
| Impact of Covid-19 and a Looming Global Recession |
| 2. FOCUS ON SELECT PLAYERS |
| 3. MARKET TRENDS & DRIVERS |
| 4. GLOBAL MARKET PERSPECTIVE |
| Semiconductor and IC Packaging Materials Global Market Estimates and Forecasts in US$ Million by Region/Country: 2018-2025 |
| Semiconductor and IC Packaging Materials Global Retrospective Market Scenario in US$ Million by Region/Country: 2009-2017 |
| Semiconductor and IC Packaging Materials Market Share Shift across Key Geographies Worldwide: 2009 VS 2019 VS 2025 |
| Organic Substrates (Types) World Market by Region/Country in US$ Million: 2018 to 2025 |
| Organic Substrates (Types) Historic Market Analysis by Region/Country in US$ Million: 2009 to 2017 |
| Organic Substrates (Types) Market Share Breakdown of Worldwide Sales by Region/Country: 2009 VS 2019 VS 2025 |
| Bonding Wires (Types) Potential Growth Markets Worldwide in US$ Million: 2018 to 2025 |
| Bonding Wires (Types) Historic Market Perspective by Region/Country in US$ Million: 2009 to 2017 |
| Bonding Wires (Types) Market Sales Breakdown by Region/Country in Percentage: 2009 VS 2019 VS 2025 |
| Lead frames (Types) Geographic Market Spread Worldwide in US$ Million: 2018 to 2025 |
| Lead frames (Types) Region Wise Breakdown of Global Historic Demand in US$ Million: 2009 to 2017 |
| Lead frames (Types) Market Share Distribution in Percentage by Region/Country: 2009 VS 2019 VS 2025 |
| Ceramic Packages (Types) World Market Estimates and Forecasts by Region/Country in US$ Million: 2018 to 2025 |
| Ceramic Packages (Types) Market Historic Review by Region/Country in US$ Million: 2009 to 2017 |
| Ceramic Packages (Types) Market Share Breakdown by Region/Country: 2009 VS 2019 VS 2025 |
| Encapsulation Resins (Types) World Market by Region/Country in US$ Million: 2018 to 2025 |
| Encapsulation Resins (Types) Historic Market Analysis by Region/Country in US$ Million: 2009 to 2017 |
| Encapsulation Resins (Types) Market Share Distribution in Percentage by Region/Country: 2009 VS 2019 VS 2025 |
| Other Types (Types) World Market Estimates and Forecasts in US$ Million by Region/Country: 2018 to 2025 |
| Other Types (Types) Market Worldwide Historic Review by Region/Country in US$ Million: 2009 to 2017 |
| Other Types (Types) Market Percentage Share Distribution by Region/Country: 2009 VS 2019 VS 2025 |
| SOP (Packaging Technologies) Market Opportunity Analysis Worldwide in US$ Million by Region/Country: 2018 to 2025 |
| SOP (Packaging Technologies) Global Historic Demand in US$ Million by Region/Country: 2009 to 2017 |
| SOP (Packaging Technologies) Market Share Distribution in Percentage by Region/Country: 2009 VS 2019 VS 2025 |
| GA (Packaging Technologies) World Market by Region/Country in US$ Million: 2018 to 2025 |
| GA (Packaging Technologies) Historic Market Analysis by Region/Country in US$ Million: 2009 to 2017 |
| GA (Packaging Technologies) Market Share Breakdown of Worldwide Sales by Region/Country: 2009 VS 2019 VS 2025 |
| QFN (Packaging Technologies) Potential Growth Markets Worldwide in US$ Million: 2018 to 2025 |
| QFN (Packaging Technologies) Historic Market Perspective by Region/Country in US$ Million: 2009 to 2017 |
| QFN (Packaging Technologies) Market Sales Breakdown by Region/Country in Percentage: 2009 VS 2019 VS 2025 |
| DFN (Packaging Technologies) Geographic Market Spread Worldwide in US$ Million: 2018 to 2025 |
| DFN (Packaging Technologies) Region Wise Breakdown of Global Historic Demand in US$ Million: 2009 to 2017 |
| DFN (Packaging Technologies) Market Share Distribution in Percentage by Region/Country: 2009 VS 2019 VS 2025 |
| Other Packaging Technologies (Packaging Technologies) World Market Estimates and Forecasts by Region/Country in US$ Million: 2018 to 2025 |
| Other Packaging Technologies (Packaging Technologies) Market Historic Review by Region/Country in US$ Million: 2009 to 2017 |
| Other Packaging Technologies (Packaging Technologies) Market Share Breakdown by Region/Country: 2009 VS 2019 VS 2025 |
| III. MARKET ANALYSIS |
| GEOGRAPHIC MARKET ANALYSIS |
| UNITED STATES |
| Market Facts & Figures |
| US Semiconductor & IC Packaging Materials Market Share (in %) by Company: 2019 & 2025 |
| United States Semiconductor and IC Packaging Materials Market Estimates and Projections in US$ Million by Types: 2018 to 2025 |
| Semiconductor and IC Packaging Materials Market in the United States by Types: A Historic Review in US$ Million for 2009-2017 |
| United States Semiconductor and IC Packaging Materials Market Share Breakdown by Types: 2009 VS 2019 VS 2025 |
| United States Semiconductor and IC Packaging Materials Market Estimates and Projections in US$ Million by Packaging Technologies: 2018 to 2025 |
| Semiconductor and IC Packaging Materials Market in the United States by Packaging Technologies: A Historic Review in US$ Million for 2009-2017 |
| United States Semiconductor and IC Packaging Materials Market Share Breakdown by Packaging Technologies: 2009 VS 2019 VS 2025 |
| CANADA |
| Canadian Semiconductor and IC Packaging Materials Market Estimates and Forecasts in US$ Million by Types: 2018 to 2025 |
| Canadian Semiconductor and IC Packaging Materials Historic Market Review by Types in US$ Million: 2009-2017 |
| Semiconductor and IC Packaging Materials Market in Canada: Percentage Share Breakdown of Sales by Types for 2009, 2019, and 2025 |
| Canadian Semiconductor and IC Packaging Materials Market Estimates and Forecasts in US$ Million by Packaging Technologies: 2018 to 2025 |
| Canadian Semiconductor and IC Packaging Materials Historic Market Review by Packaging Technologies in US$ Million: 2009-2017 |
| Semiconductor and IC Packaging Materials Market in Canada: Percentage Share Breakdown of Sales by Packaging Technologies for 2009, 2019, and 2025 |
| JAPAN |
| Japanese Market for Semiconductor and IC Packaging Materials: Annual Sales Estimates and Projections in US$ Million by Types for the Period 2018-2025 |
| Semiconductor and IC Packaging Materials Market in Japan: Historic Sales Analysis in US$ Million by Types for the Period 2009-2017 |
| Japanese Semiconductor and IC Packaging Materials Market Share Analysis by Types: 2009 VS 2019 VS 2025 |
| Japanese Market for Semiconductor and IC Packaging Materials: Annual Sales Estimates and Projections in US$ Million by Packaging Technologies for the Period 2018-2025 |
| Semiconductor and IC Packaging Materials Market in Japan: Historic Sales Analysis in US$ Million by Packaging Technologies for the Period 2009-2017 |
| Japanese Semiconductor and IC Packaging Materials Market Share Analysis by Packaging Technologies: 2009 VS 2019 VS 2025 |
| CHINA |
| Chinese Semiconductor and IC Packaging Materials Market Growth Prospects in US$ Million by Types for the Period 2018-2025 |
| Semiconductor and IC Packaging Materials Historic Market Analysis in China in US$ Million by Types: 2009-2017 |
| Chinese Semiconductor and IC Packaging Materials Market by Types: Percentage Breakdown of Sales for 2009, 2019, and 2025 |
| Chinese Semiconductor and IC Packaging Materials Market Growth Prospects in US$ Million by Packaging Technologies for the Period 2018-2025 |
| Semiconductor and IC Packaging Materials Historic Market Analysis in China in US$ Million by Packaging Technologies: 2009-2017 |
| Chinese Semiconductor and IC Packaging Materials Market by Packaging Technologies: Percentage Breakdown of Sales for 2009, 2019, and 2025 |
| EUROPE |
| Market Facts & Figures |
| European Semiconductor & IC Packaging Materials Market: Competitor Market Share Scenario (in %) for 2019 & 2025 |
| European Semiconductor and IC Packaging Materials Market Demand Scenario in US$ Million by Region/Country: 2018-2025 |
| Semiconductor and IC Packaging Materials Market in Europe: A Historic Market Perspective in US$ Million by Region/Country for the Period 2009-2017 |
| European Semiconductor and IC Packaging Materials Market Share Shift by Region/Country: 2009 VS 2019 VS 2025 |
| European Semiconductor and IC Packaging Materials Market Estimates and Forecasts in US$ Million by Types: 2018-2025 |
| Semiconductor and IC Packaging Materials Market in Europe in US$ Million by Types: A Historic Review for the Period 2009-2017 |
| European Semiconductor and IC Packaging Materials Market Share Breakdown by Types: 2009 VS 2019 VS 2025 |
| European Semiconductor and IC Packaging Materials Market Estimates and Forecasts in US$ Million by Packaging Technologies: 2018-2025 |
| Semiconductor and IC Packaging Materials Market in Europe in US$ Million by Packaging Technologies: A Historic Review for the Period 2009-2017 |
| European Semiconductor and IC Packaging Materials Market Share Breakdown by Packaging Technologies: 2009 VS 2019 VS 2025 |
| FRANCE |
| Semiconductor and IC Packaging Materials Market in France by Types: Estimates and Projections in US$ Million for the Period 2018-2025 |
| French Semiconductor and IC Packaging Materials Historic Market Scenario in US$ Million by Types: 2009-2017 |
| French Semiconductor and IC Packaging Materials Market Share Analysis by Types: 2009 VS 2019 VS 2025 |
| Semiconductor and IC Packaging Materials Market in France by Packaging Technologies: Estimates and Projections in US$ Million for the Period 2018-2025 |
| French Semiconductor and IC Packaging Materials Historic Market Scenario in US$ Million by Packaging Technologies: 2009-2017 |
| French Semiconductor and IC Packaging Materials Market Share Analysis by Packaging Technologies: 2009 VS 2019 VS 2025 |
| GERMANY |
| Semiconductor and IC Packaging Materials Market in Germany: Recent Past, Current and Future Analysis in US$ Million by Types for the Period 2018-2025 |
| German Semiconductor and IC Packaging Materials Historic Market Analysis in US$ Million by Types: 2009-2017 |
| German Semiconductor and IC Packaging Materials Market Share Breakdown by Types: 2009 VS 2019 VS 2025 |
| Semiconductor and IC Packaging Materials Market in Germany: Recent Past, Current and Future Analysis in US$ Million by Packaging Technologies for the Period 2018-2025 |
| German Semiconductor and IC Packaging Materials Historic Market Analysis in US$ Million by Packaging Technologies: 2009-2017 |
| German Semiconductor and IC Packaging Materials Market Share Breakdown by Packaging Technologies: 2009 VS 2019 VS 2025 |
| ITALY |
| Italian Semiconductor and IC Packaging Materials Market Growth Prospects in US$ Million by Types for the Period 2018-2025 |
| Semiconductor and IC Packaging Materials Historic Market Analysis in Italy in US$ Million by Types: 2009-2017 |
| Italian Semiconductor and IC Packaging Materials Market by Types: Percentage Breakdown of Sales for 2009, 2019, and 2025 |
| Italian Semiconductor and IC Packaging Materials Market Growth Prospects in US$ Million by Packaging Technologies for the Period 2018-2025 |
| Semiconductor and IC Packaging Materials Historic Market Analysis in Italy in US$ Million by Packaging Technologies: 2009-2017 |
| Italian Semiconductor and IC Packaging Materials Market by Packaging Technologies: Percentage Breakdown of Sales for 2009, 2019, and 2025 |
| UNITED KINGDOM |
| United Kingdom Market for Semiconductor and IC Packaging Materials: Annual Sales Estimates and Projections in US$ Million by Types for the Period 2018-2025 |
| Semiconductor and IC Packaging Materials Market in the United Kingdom: Historic Sales Analysis in US$ Million by Types for the Period 2009-2017 |
| United Kingdom Semiconductor and IC Packaging Materials Market Share Analysis by Types: 2009 VS 2019 VS 2025 |
| United Kingdom Market for Semiconductor and IC Packaging Materials: Annual Sales Estimates and Projections in US$ Million by Packaging Technologies for the Period 2018-2025 |
| Semiconductor and IC Packaging Materials Market in the United Kingdom: Historic Sales Analysis in US$ Million by Packaging Technologies for the Period 2009-2017 |
| United Kingdom Semiconductor and IC Packaging Materials Market Share Analysis by Packaging Technologies: 2009 VS 2019 VS 2025 |
| REST OF EUROPE |
| Rest of Europe Semiconductor and IC Packaging Materials Market Estimates and Forecasts in US$ Million by Types: 2018-2025 |
| Semiconductor and IC Packaging Materials Market in Rest of Europe in US$ Million by Types: A Historic Review for the Period 2009-2017 |
| Rest of Europe Semiconductor and IC Packaging Materials Market Share Breakdown by Types: 2009 VS 2019 VS 2025 |
| Rest of Europe Semiconductor and IC Packaging Materials Market Estimates and Forecasts in US$ Million by Packaging Technologies: 2018-2025 |
| Semiconductor and IC Packaging Materials Market in Rest of Europe in US$ Million by Packaging Technologies: A Historic Review for the Period 2009-2017 |
| Rest of Europe Semiconductor and IC Packaging Materials Market Share Breakdown by Packaging Technologies: 2009 VS 2019 VS 2025 |
| ASIA-PACIFIC |
| Semiconductor and IC Packaging Materials Market in Asia-Pacific by Types: Estimates and Projections in US$ Million for the Period 2018-2025 |
| Asia-Pacific Semiconductor and IC Packaging Materials Historic Market Scenario in US$ Million by Types: 2009-2017 |
| Asia-Pacific Semiconductor and IC Packaging Materials Market Share Analysis by Types: 2009 VS 2019 VS 2025 |
| Semiconductor and IC Packaging Materials Market in Asia-Pacific by Packaging Technologies: Estimates and Projections in US$ Million for the Period 2018-2025 |
| Asia-Pacific Semiconductor and IC Packaging Materials Historic Market Scenario in US$ Million by Packaging Technologies: 2009-2017 |
| Asia-Pacific Semiconductor and IC Packaging Materials Market Share Analysis by Packaging Technologies: 2009 VS 2019 VS 2025 |
| REST OF WORLD |
| Rest of World Semiconductor and IC Packaging Materials Market Estimates and Forecasts in US$ Million by Types: 2018 to 2025 |
| Rest of World Semiconductor and IC Packaging Materials Historic Market Review by Types in US$ Million: 2009-2017 |
| Semiconductor and IC Packaging Materials Market in Rest of World: Percentage Share Breakdown of Sales by Types for 2009, 2019, and 2025 |
| Rest of World Semiconductor and IC Packaging Materials Market Estimates and Forecasts in US$ Million by Packaging Technologies: 2018 to 2025 |
| Rest of World Semiconductor and IC Packaging Materials Historic Market Review by Packaging Technologies in US$ Million: 2009-2017 |
| Semiconductor and IC Packaging Materials Market in Rest of World: Percentage Share Breakdown of Sales by Packaging Technologies for 2009, 2019, and 2025 |
| IV. COMPETITION |
| Total Companies Profiled : 5 Click here to request a full table of contents and more details on this project. |
| V. CURATED RESEARCH |
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