Semiconductor and IC Packaging Materials

Global Market Trajectory & Analytics

MCP14657

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DATE

JAN 2021

TABLES

132

PAGES

414

EDITION

5

PRICE

USD 4950

CODE

MCP14657


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HIGHLIGHTS & REPORT INDEX

Global Semiconductor and IC Packaging Materials Market to Reach $34.3 Billion by 2026

Semiconductor or integrated circuit (IC) packaging materials are advanced electronic solutions intended to connect an IC chip to package substrates, another packages or a printed circuit board (PCB). These materials hold critical significance for semiconductor wafer-level packaging, 3D integration and heterogeneous integration technologies. The semiconductor industry continues to become more and more complex and dynamic due to ever-changing technology trends in the electronics sector. Continuous technology developments and breakthrough understanding in the electronics, over the decades have helped improvements in semiconductors industry in terms of technology and materials used, making it indispensable in a wide range of applications. Global market for semiconductors is driven by major end-use application markets such as building & home automation, industrial automation, medical devices, and aerospace. Rapid advances in electronics technology like cloud computing, AI and smart automobiles are creating the requirement of high-integration, high-speed ICs that score high in terms of energy efficiency. These developments along with increasing thinning and miniaturization of electronic devices such as wearable devices and smart phones are driving the need for semiconductor packages featuring high density and multilayer, low profiles.

Amid the COVID-19 crisis, the global market for Semiconductor and IC Packaging Materials estimated at US$25 Billion in the year 2020, is projected to reach a revised size of US$34.3 Billion by 2026, growing at a CAGR of 5.3% over the analysis period. Organic Substrates, one of the segments analyzed in the report, is projected to grow at a 5.8% CAGR to reach US$10.7 Billion by the end of the analysis period. After a thorough analysis of the business implications of the pandemic and its induced economic crisis, growth in the Bonding Wires segment is readjusted to a revised 4.9% CAGR for the next 7-year period. This segment currently accounts for a 18.6% share of the global Semiconductor and IC Packaging Materials market.

The U.S. Market is Estimated at $3.2 in 2021, While China is Forecast to Reach $8.7 Billion by 2026

The Semiconductor and IC Packaging Materials market in the U.S. is estimated at US$3.2 Billion in the year 2021. The country currently accounts for a 12.84% share in the global market. China, the world`s second largest economy, is forecast to reach an estimated market size of US$8.7 Billion in the year 2026 trailing a CAGR of 6.2% through the analysis period. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 3.5% and 4.6% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 4.1% CAGR while Rest of European market (as defined in the study) will reach US$9.2 Billion by the end of the analysis period. Digital transformation is now visible in all industrial sectors. Over 60% of companies in North America, Europe and Asia expect to witness a higher velocity of change in digital transformation during the years 2020 through 2023, thus creating demand for semiconductor and IC packaging materials.

Lead frames Segment to Reach $4.2 Billion by 2026

In the global Lead frames segment, USA, Canada, Japan, China and Europe will drive the 3.2% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$2.2 Billion in the year 2020 will reach a projected size of US$2.7 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$1.5 Billion by the year 2026.

SELECT PLAYERS

Amkor Technology, Inc.; BASF SE; DuPont de Nemours, Inc.; Element Solutions Inc.; Henkel AG & Co. KGaA; Honeywell International Inc.; Kyocera Chemical Corporation; LG Chem Ltd.; Mitsui High-tec, Inc.; Showa Denko Materials Co., Ltd.; Sumitomo Bakelite Co., Ltd.; Tanaka Holdings Co., Ltd.; Toppan Printing Co., Ltd.; Toray Industries, Inc.

SEGMENTS

» Type (Organic Substrates, Bonding Wires, Lead Frames, Ceramic Packages, Encapsulation Resins, Other Types) » End-Use (Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense, Other End-Uses)

GEOGRAPHIES

» World » USA » Canada » Japan » China » Europe » France » Germany » Italy » UK » Rest of Europe » Asia-Pacific » South Korea » Taiwan » Rest of Asia-Pacific » Rest of World

TABLE OF CONTENTS

1. MARKET OVERVIEW
No Prizes for Guessing the Importance of Semiconductors
As 2020 Draws to a Close, It Has Been a Year of Astounding Disruption & Unbelievable Transformation
Table: COVID-19 Leaves the World in Shambles & Industries and Markets Upended: World Economic Growth Projections (Real GDP, Annual % Change) for 2019, 2020 & 2021
Semiconductors Are Key Part of the Electronics Value Chain. COVID-19 Exposes the Risk of Value Chain Modularity
Among the Hammered in the Supply Chain is the “Semiconductor Industry”
The Human Cost of the Pandemic Intensifies the Shockwaves Ripping Through the Semiconductor Industry
Table: A Big Blow to Consumerism, Rising Levels of Unemployment Threatens to Shrink the Global Middle Class Population: Unemployment in the U.S. (In Million)
Eventual Recovery after the Downturn
Outlook Beyond 2020 Remains Promising. Here’s Why
COVID-19 Accelerates Digital Transformation
Table: COVID-19 Has Created an Environment Where Digital Transformation Equals Survival: Global Digital Transformation Spending (In US$ Billion) for Years 2017 Through 2023
Focus Shed on Harnessing Digital Transformation Bodes Well for All Things Electronic & Digital. Semiconductors Storm Into the Spotlight
Semiconductor ICs & Packaging Materials, Definition, Scope, Importance & Types
Recent Market Activity
Innovations
2. FOCUS ON SELECT PLAYERS
3. MARKET TRENDS & DRIVERS
Emergence of Quantum Computing Drives the Importance of Semiconductors From Design to Materials
Table: As Quantum Hardware Emerges Into an Active Area of Research, New Opportunities to Open for All in the Semiconductor Value Chain: Global Market for Quantum Computing (In US$ Million) for Years 2020 2024 & 2027
Growing Demand for New Generation Smart ICs for Emerging Technologies like AI Bodes Well for Growth
Special Focus on AI: Here’s Why AI is Witnessing Robust Growth
Table: AI Unleashes a New Wave of Growth for Next Gen Semiconductors: Global Market for Artificial Intelligence (In US$ Billion) for Years 2021, 2025, 2027
AI Hardware: A New & Robust Area of Opportunity for Semiconductor Companies
Table: Rapidly Evolving AI Hardware Market to Boost Semiconductor Sales & Revenues, a Postive Growth Indicator for Semiconductor & IC Packaging Materials: Global AI Semiconductor Market (In US$ Billion) for Years 2020, 2023 & 2025
Post COVID-19 As Technology Steps Forward to Help With Social Distancing, Renewed Focus Will Be Shed on Industrial Automation: Industrial Semiconductors to Emerge Into a Key Growth Pocket
Table: As a Lesson Learnt in Social Distancing from the COVID-19 Pandemic, Use of Industrial Robots to Spike in the Post COVID-19 Period: Industrial Robot Density (Units Per 10,000 Workers)
Table: Global Market for Industrial Semiconductors (In US$ Billion) for Years 2020, 2022 & 2024
Looking Beyond Current Challenges, the Coming Age of Autonomous Driving to Spur Growth Across the Semiconductor Value Chain
2020, A Bad Year for Automobile Sales
Table: COVID-19 Triggers Massive, Unexpected & Unprecedented Erosion in Vehicle Sales: Decline in Global Auto Sales (In Million Units) in the Year 2020
Although Bad, 2020 is Not the Worst Year: The Pandemic Accelerates Autonomous Driving Technologies
Table: COVID-19 Hits the Gas Pedal, Accelerating the Journey Towards Autonomous Driving. Joining This Exciting Journey Littered With Opportunities is Automotive Semiconductors: Global Autonomous Vehicle Sales (In Million)
Table: Global Autonomous Vehicle Sales (In US$ Billion)
The Future of Modern Cars is Digital. Software & Electronics Gain Precedence
Table: Measuring the Growing Importance of Electronics in Cars: Automotive Electronics as a Percentage of Vehicle Production Cost for the Years 2010, 2020 & 2030
Rapid Proliferation of Electronic & Electrical Subsystems and Sub-Assembles Powered by Electronification and Electrification Trends Drives the Commercial Value of Electronic Adhesives
Table: Average Value of In-Vehicle Electronics Per Vehicle (In US$) for the Years 2018, 2025 & 2030
3D Packaging Emerges As a Key Driver of Growth & Innovation in the Market
New Packaging Technologies Crucial to Semiconductor Innovation
A Review of the Aerospace Industry: 2020 Impact & Recovery
Darkening Outlook for the Aerospace Industry Overshadows Semiconductor Demand in this Sector
Declines in Air Cargo Worsens an Already Punishing Business Climate
Table: With the Aviation Industry on the Brink of Annihilation, Sluggish Aircraft Assembly Lines Means Aerospace Semiconductor Will Take Longer to Recover: Expected Revenue Losses in Global Aviation (In US$ Billion) for the Year 2020
Post COVID Recovery Will be Led by the New Era of Connected Aircraft
Table: Robust Outlook for the Future of Connected Aviation to Open Up Opportunities to New Gen Semiconductor Solutions: Global Number of Connected Aircraft (In Units) for the Years 2016, 2018, 2021, 2025 & 2029
4. GLOBAL MARKET PERSPECTIVE
World Current & Future Analysis for Semiconductor & IC Packaging Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
World Historic Review for Semiconductor & IC Packaging Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
World 15-Year Perspective for Semiconductor & IC Packaging Materials by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2012, 2020 & 2027
World Current & Future Analysis for Organic Substrates by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
World Historic Review for Organic Substrates by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
World 15-Year Perspective for Organic Substrates by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
World Current & Future Analysis for Bonding Wires by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
World Historic Review for Bonding Wires by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
World 15-Year Perspective for Bonding Wires by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
World Current & Future Analysis for Lead frames by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
World Historic Review for Lead frames by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
World 15-Year Perspective for Lead frames by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
World Current & Future Analysis for Ceramic Packages by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
World Historic Review for Ceramic Packages by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
World 15-Year Perspective for Ceramic Packages by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
World Current & Future Analysis for Encapsulation Resins by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
World Historic Review for Encapsulation Resins by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
World 15-Year Perspective for Encapsulation Resins by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
World Current & Future Analysis for Other Types by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
World Historic Review for Other Types by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
World 15-Year Perspective for Other Types by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
World Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
World Historic Review for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
World 15-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
World Current & Future Analysis for Communications & Telecom by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
World Historic Review for Communications & Telecom by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
World 15-Year Perspective for Communications & Telecom by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
World Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
World Historic Review for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
World 15-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
World Current & Future Analysis for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
World Historic Review for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
World 15-Year Perspective for Aerospace & Defense by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
World Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
World Historic Review for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
World 15-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
UNITED STATES
USA Current & Future Analysis for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
USA Historic Review for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
USA 15-Year Perspective for Semiconductor & IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027
USA Current & Future Analysis for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
USA Historic Review for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
USA 15-Year Perspective for Semiconductor & IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027
CANADA
Canada Current & Future Analysis for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Canada Historic Review for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Canada 15-Year Perspective for Semiconductor & IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027
Canada Current & Future Analysis for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Canada Historic Review for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Canada 15-Year Perspective for Semiconductor & IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027
JAPAN
Japan Current & Future Analysis for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Japan Historic Review for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Japan 15-Year Perspective for Semiconductor & IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027
Japan Current & Future Analysis for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Japan Historic Review for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Japan 15-Year Perspective for Semiconductor & IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027
CHINA
China Current & Future Analysis for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
China Historic Review for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
China 15-Year Perspective for Semiconductor & IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027
China Current & Future Analysis for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
China Historic Review for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
China 15-Year Perspective for Semiconductor & IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027
EUROPE
Europe Current & Future Analysis for Semiconductor & IC Packaging Materials by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
Europe Historic Review for Semiconductor & IC Packaging Materials by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Europe 15-Year Perspective for Semiconductor & IC Packaging Materials by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2012, 2020 & 2027
Europe Current & Future Analysis for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Europe Historic Review for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Europe 15-Year Perspective for Semiconductor & IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027
Europe Current & Future Analysis for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Europe Historic Review for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Europe 15-Year Perspective for Semiconductor & IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027
FRANCE
France Current & Future Analysis for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
France Historic Review for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
France 15-Year Perspective for Semiconductor & IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027
France Current & Future Analysis for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
France Historic Review for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
France 15-Year Perspective for Semiconductor & IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027
GERMANY
Germany Current & Future Analysis for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Germany Historic Review for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Germany 15-Year Perspective for Semiconductor & IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027
Germany Current & Future Analysis for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Germany Historic Review for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Germany 15-Year Perspective for Semiconductor & IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027
ITALY
Italy Current & Future Analysis for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Italy Historic Review for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Italy 15-Year Perspective for Semiconductor & IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027
Italy Current & Future Analysis for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Italy Historic Review for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Italy 15-Year Perspective for Semiconductor & IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027
UNITED KINGDOM
UK Current & Future Analysis for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
UK Historic Review for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
UK 15-Year Perspective for Semiconductor & IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027
UK Current & Future Analysis for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
UK Historic Review for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
UK 15-Year Perspective for Semiconductor & IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027
REST OF EUROPE
Rest of Europe Current & Future Analysis for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Rest of Europe Historic Review for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Rest of Europe 15-Year Perspective for Semiconductor & IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027
Rest of Europe Current & Future Analysis for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Rest of Europe Historic Review for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Rest of Europe 15-Year Perspective for Semiconductor & IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027
ASIA-PACIFIC
Asia-Pacific Current & Future Analysis for Semiconductor & IC Packaging Materials by Geographic Region - South Korea, Taiwan and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
Asia-Pacific Historic Review for Semiconductor & IC Packaging Materials by Geographic Region - South Korea, Taiwan and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Asia-Pacific 15-Year Perspective for Semiconductor & IC Packaging Materials by Geographic Region - Percentage Breakdown of Value Sales for South Korea, Taiwan and Rest of Asia-Pacific Markets for Years 2012, 2020 & 2027
Asia-Pacific Current & Future Analysis for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Asia-Pacific Historic Review for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Asia-Pacific 15-Year Perspective for Semiconductor & IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027
Asia-Pacific Current & Future Analysis for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Asia-Pacific Historic Review for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Asia-Pacific 15-Year Perspective for Semiconductor & IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027
SOUTH KOREA
South Korea Current & Future Analysis for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
South Korea Historic Review for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
South Korea 15-Year Perspective for Semiconductor & IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027
South Korea Current & Future Analysis for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
South Korea Historic Review for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
South Korea 15-Year Perspective for Semiconductor & IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027
TAIWAN
Taiwan Current & Future Analysis for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Taiwan Historic Review for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Taiwan 15-Year Perspective for Semiconductor & IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027
Taiwan Current & Future Analysis for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Taiwan Historic Review for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Taiwan 15-Year Perspective for Semiconductor & IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027
REST OF ASIA-PACIFIC
Rest of Asia-Pacific Current & Future Analysis for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Rest of Asia-Pacific Historic Review for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Rest of Asia-Pacific 15-Year Perspective for Semiconductor & IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027
Rest of Asia-Pacific Current & Future Analysis for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Rest of Asia-Pacific Historic Review for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Rest of Asia-Pacific 15-Year Perspective for Semiconductor & IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027
REST OF WORLD
Rest of World Current & Future Analysis for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Rest of World Historic Review for Semiconductor & IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Rest of World 15-Year Perspective for Semiconductor & IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027
Rest of World Current & Future Analysis for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
Rest of World Historic Review for Semiconductor & IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
Rest of World 15-Year Perspective for Semiconductor & IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027
Total Companies Profiled: 75

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