Semiconductor Advanced Packaging

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MAR 2022

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World Semiconductor Advanced Packaging Market to Reach $49.2 Billion by 2026

Amid the COVID-19 crisis, the global market for Semiconductor Advanced Packaging estimated at US$35.7 Billion in the year 2022, is projected to reach a revised size of US$49.2 Billion by 2026, growing at a CAGR of 7.6% over the analysis period. Flip Chip Packaging, one of the segments analyzed in the report, is projected to grow at a 7.2% CAGR, while growth in the 2.5d/3d Packaging segment is readjusted to a revised 10.1% CAGR. Growth in the global market is driven by the growing trend of miniaturization. Constant transitions and miniaturization of nodes were regular features that the industry faced, and now ULSI fabrication resulting in increased wafer sizes are further driving market growth. With many companies focusing more on R&D, there is rise in the number of manufacturers who offer innovative products. Factors such as growing numbers of consumers using electronic appliances, consumer preference for lighter, thinner, and smaller products driving the need for electronic products with advanced architecture, and the growing demand for connected devices such as tablets and smartphones are also driving growth of semiconductor advanced packaging market.

The requirement for better performance chips in consumer electronics is mainly underpinning the growth of the advanced packaging market. Further, the growing use of 2.5D packaging in chips and 3D IC in smartphones and other mobile devices is anticipated to spur advanced packaging demand. Growing interest in device miniaturization in various sectors is driving market gains. The widespread use of latest semiconductor tool is likely to boost the usage of various advanced packaging techniques. Also, the increasing R&D activities and innovations made by leading companies in the market are expected to support market growth. The expanding IoT market is also expected to drive the need for semiconductor packaging. Growing awareness of the benefits of advanced packaging in comparison to traditional packaging technologies is also boding well for the market.

But the significant costs associated with advanced packaging and the high cost of maintenance related to these systems is hampering the growth of the market. Also, the widespread concerns related to COVID-19 are restricting the market. The pandemic which has caused manufacturing activities globally to come to a halt has negatively impacted the demand for advanced packaging. Aerospace and defense, healthcare, automotive, and consumer electronics are the advanced packaging application areas that have been the most affected. There also has been a shortage of important raw materials for advanced packaging on account of the COVID-19 crisis. Further, the lack of technology standardization is limiting market growth. Innovations Key to Drive the Advanced Packaging Market

Technological innovations in semiconductor packaging are mainly based on the wafer size, which is giving rise to increased attention on wafer-level packages, in turn resulting in the introduction of innovative solutions in the chip industry. Most manufacturers are focused toward production of wafers of larger diameters due to increasing demand. Consequently, the manufacturing costs are expected to come down, leading to the development of more advanced packaging solutions. An emerging alternative to 2.5D packaging is the sub-segment of fan-out technology, which could handle multiple dies as against the fan-in wafer-level packaging that could handle only single die. Fan-out technology is experiencing significant growth due to its ability to eliminate the need for various process flows including under-fill dispensing, curing, cleaning, water fluxing, and flip-chip assembly.

The advanced packaging market is led by the flip-chip segment that is predicted to maintain its lion`s share over the coming years. The market is estimated to witness impressive performance of 2.5D/3D and fan-out categories that are slated to gain from increasing use across different applications. The fan-in WLP (WLCSP) category is dominated by mobile and estimated to post a decent growth through 2026. While the embedded die market accounts for a smaller share of advanced packaging, it is forecast to exhibit a solid growth rate due to strong contribution from the automotive, mobile and telecom & infrastructure domains. On the other hand, outsourced semiconductor assembly and tests (OSATs) remains the commanding segment of the advanced packaging market in terms of wafer starts. However, the high-end segment of the market is dominated by leading foundries. The segment encapsulates 2.5D/3D stacking and high-density fan-out options. Leading companies in the segment are making significant investments to come up with innovative options and move packaging from the substrate towards silicon/wafer platform.

The global advanced packaging market is served by numerous companies, with some of them investing big in new projects and strategies. TSMC is one of the leading players on the market that maintains a consistent focus on advanced platforms like SoW, SoIC and InFO variants along with CoWoS product lines. On the other side, Intel is investing in advanced packaging solutions under its ambitious IDM 2.0 strategy, including EMIB, Foveros, and Co-EMIB. The company is looking forwards to leverage its internal and external manufacturing resources for innovative designs, pushing the market share and cementing position in the datacenter space. Samsung is also making huge investments in advanced packaging solutions to strengthen the foundry business and compete with TSMC. In addition, leading OSATs are investing in technologies for tapping the lucrative market. While the packaging & assembly business has long been served by IDMs and OSATs, it is witnessing increasing influx of other players like foundries, EMS/DM and substrate or PCB suppliers.

Among the many emerging trends, the key trends that are expected to steer the global semiconductor advanced packaging market are the incorporation of semiconductor components in automobiles, changes in wafer size, and growing merger and acquisition (M&A) activities. During the past 5 decades, the semiconductor industry experienced drastic progression in wafer size. The industry is increasingly concentrating on production of larger-diameter wafers, and this move is expected to reduce manufacturing cost by 20% to 25%. The semiconductor industry was using wafers of 300-mm in 2016. Now foundries are investing in the development of more fabs of that type. For example, SK Hynix is starting an M14 fab in South Korea for the 300-mm technology. However, 200-mm wafers are also continue to be in demand during the next few years, because as many semiconductor devices including image sensors, display drivers, microcontrollers, and some MEMS-based products such as accelerometers still utilize 200-mm wafers in production processes. Now, the industry is planning for the development of 450-mm wafer technology, with a scheduled pilot production.

Growing demand for automation in automobiles and electrification of vehicles is driving this sector of the semiconductor market. Semiconductor ICs are used in automobiles for purposes such as GPS, airbag control, anti-lock braking systems, infotainment systems, automated driving, displays, collision detection technology, and power doors and windows. For these purposes, the semiconductor devices need to be in the exact form factor and of small size. This need in the automotive sector would further drive demand for semiconductor advanced packaging solutions. With the automotive market expected to grow due to the rising annual numbers of car production, significant demand would be generated for semiconductor devices, and this in turn would trigger demand for advanced packaging solutions during the forecast period.

SELECT PLAYERS

Advanced Semiconductor Engineering, Inc.; Amkor Technology, Inc.; ChipMOS Technologies Inc.; FlipChip International LLC; HANA Micron Inc.; ISI - Interconnect Systems; JCET Group; King Yuan Electronics Co., Ltd.; NEPES; Powertech Technology Inc.; Samsung; Signetics; Taiwan Semiconductor Manufacturing Company Limited; Veeco Instruments Inc.

SEGMENTS

» Technology (Flip Chip Packaging, 2.5D/3D Packaging, FI WLP, FO WLP) » (Consumer Electronics, Industrial, Automotive, Aerospace & Defense, Other End-Uses)

GEOGRAPHIES

» World » USA » Canada » Japan » China » Europe » France » Germany » Italy » UK » Rest of Europe » Asia-Pacific » South Korea » Taiwan » Rest of Asia-Pacific » Rest of World

TABLE OF CONTENTS

1. MARKET OVERVIEW
The Race Between the Virus & Vaccines Intensifies. Amidst this Chaotic Battle, Where is the World Economy Headed?
Progress on Vaccinations: Why Should Businesses Care?
With IMF’s Upward Revision of Global GDP Forecasts, Most Companies are Bullish about an Economic Comeback Despite a Continuing Pandemic
EXHIBIT: A Strong Yet Exceedingly Patchy & Uncertain Recovery Shaped by New Variants Comes Into Play: World Economic Growth Projections (Real GDP, Annual % Change) for 2020 through 2022
EXHIBIT: Easing Unemployment Levels in 2021 Although Moderate Will Infuse Hope for Industries Reliant on Consumer Discretionary Incomes: Global Number of Unemployed People (In Million) for Years 2019, 2020, 2021, and 2022
Impact of COVID-19 on the Semiconductor Industry Exposes the Risk of Value Chain Modularity
Among the Hammered Companies in the Supply Chain is the “Semiconductor Industry”
EXHIBIT: Measuring the Impact of COVID-19 on the Semiconductor Industry in Terms of Disruption & Time to Recovery (In Months) as of May 2020
EXHIBIT: Supply Chain Disruptions Impact a Large Number of Electronic Manufacturers: % Share of Companies Impacted by Supply Chain Delays Due to COVID-19 Worldwide as of May 2020
Semiconductor Trends for Specific End-Use Categories
COVID-19 Pandemic Storm Warrants New Strategies to Help Semiconductor Leaders Secure New Lease of Life
Falling Consumer Confidence Impacts Sales of Automotive and Consumer Electronics
Industrial Activity Remain Subdued in 2020
EXHIBIT: Global PMI Index Points for the Years 2018, 2019 & 2020
Competitive Scenario
Semiconductor Supply Chain Transitions at Various Levels
Financial Performances of Packaging Suppliers Reveals New Growth Players
Unconventional Players Joining Semiconductor Advanced Packaging Bandwagon
Semiconductor Advanced Packaging – Global Key Competitors Percentage Market Share in 2022 (E)
Competitive Market Presence - Strong/Active/Niche/Trivial for 109 Players Worldwide in 2022 (E)
Rising Semiconductor Demand Presents Bundle of Joy for Advanced Packaging Market
Prominent Factors Stirring Semiconductor Advanced Packaging Market
Global Market Prospects & Outlook
Flip-Chip: Key Contributing Segment
Rising Investments to Benefit Market
Key Trends to Drive Semiconductor Advanced Packaging Market
Regional Analysis
An Introduction to Semiconductor Advanced Packaging
Recent Market Activity
2. FOCUS ON SELECT PLAYERS
3. MARKET TRENDS & DRIVERS
Semiconductor Industry Trends Indicating Brighter Days Ahead for Advanced Packaging
Digital Transformation Drive to Steer Future Growth of Advanced Packaging Market
EXHIBIT: Global Digital Transformation Spending (In US$ Trillion) for the Years 2019 through 2023
IoT Ecosystem to Rev Up Opportunities for Semiconductor Advanced Packaging
EXHIBIT: Global Number of IoT Connected Devices (In Billion Units) for the Years 2016, 2018, 2020, 2022 & 2025
EXHIBIT: Global Investments in Industrial IoT (IIoT) Platforms (In US$ Million) for the Years 2018, 2022 and 2025
EXHIBIT: Global IoT Market (In US$ Billion) by Industry for the Years 2018 and 2022
EXHIBIT: World IoT Semiconductors Market by Function (2018 & 2022): Percentage Breakdown of Value Sales for Communications, Processing, and Sensing
Increasing Functionality & Application Scope
New Packaging Technologies Crucial to Semiconductor Innovation
3D Chip Stacking Technology to Drive Future Advanced Packaging Technology
3D InCites - Advanced Packaging for 5G
2.5D Packaging Emerges as Powerful Option for Next-Generation AI Products
Advanced Packaging Influences Design Chain
Led by Innovation, Semiconductor Advanced Packaging Enters into Exciting Era
Innovative Advanced Packaging Techniques to Flood the Market
Amkor Technology Leading Packaging Technology Innovation
Prominent Technology Trends
Reducing the Cost of Advanced Packaging
Investments in Advanced Packaging: A Critical Component for Resilient Semiconductor Supply Chain
Trends in Consumer Electronics Sector Influence the Semiconductor Advanced Packaging Market
Post Pandemic Recovery in CE Sector to Augment Prospects
EXHIBIT: Worldwide Shipments of Smartphones, Tablets, and Laptops (in Million Units) for the Years 2019, 2021 and 2023
EXHIBIT: Global Smart Homes Market by Category in US$ Billion for the Years 2020 and 2022
Review of Key CE Products Driving Adoption of Semiconductor Advanced Packaging Technology
Smartphones
Tablet PCs
FOWLP and Challenges to Packaging Materials Suppliers
Automobile Electronification Trends Widen the Addressable Market
EXHIBIT: Breakdown of the Total Cost of Electronics in an Automobile (in %) for the Years 1970, 1980, 2000, 2017, 2020 and 2030
EXHIBIT: World Automobile Production in Million Units: 2008-2022
Anticipated Post COVID Recovery to Revive Opportunities in Aerospace Sector
EXHIBIT: Commercial Airline Revenue Growth (in %) for 2010-2020
EXHIBIT: Global Airlines Performance by Region: 2020 Vs 2019
Sustained High Growth in ICT Sector Augurs Well
EXHIBIT: World Internet Penetration Rate (in %) by Geographic Region: June 2021
EXHIBIT: Breakdown of Global IP Traffic by Application Type (in %): 2019 & 2022
EXHIBIT: Global Wireless Communication Market (2018 & 2020): Percentage Breakdown of Traffic Volume by Mobile Device Type
Factors Precipitating Semiconductor Advanced Packaging Demand & Challenges
Factors Putting Additional Demands on Packaging
Fan-Out Packaging: Promises & Key Challenges
Implications of Chiplets & Related Designs for Advanced Packaging
Solving Lithography Challenges
Warped Wafer Processing
UBM/RDL and PR Strip Challenges
UBM/RDL Etch
Semiconductor Supply Chain: The Complex Nature & Vulnerabilities
Vulnerabilities for WBG Power Semiconductors
4. GLOBAL MARKET PERSPECTIVE
World Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Semiconductor Advanced Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Semiconductor Advanced Packaging by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for Flip Chip Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Flip Chip Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Flip Chip Packaging by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for 2.5D/3D Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for 2.5D/3D Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for 2.5D/3D Packaging by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for FI WLP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for FI WLP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for FI WLP by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for FO WLP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for FO WLP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for FO WLP by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Industrial by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Aerospace & Defense by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
UNITED STATES
Semiconductor Advanced Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2022 (E)
USA Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
USA Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
USA 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
USA Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
USA Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
USA 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
CANADA
Canada Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Canada Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Canada 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
Canada Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Canada Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Canada 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
JAPAN
Semiconductor Advanced Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2022 (E)
Japan Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Japan Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Japan 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
Japan Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Japan Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Japan 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
CHINA
Semiconductor Advanced Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2022 (E)
China Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
China Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
China 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
China Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
China Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
China 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
EUROPE
Semiconductor Advanced Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2022 (E)
Europe Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
Europe Historic Review for Semiconductor Advanced Packaging by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Europe 15-Year Perspective for Semiconductor Advanced Packaging by Geographic Region - Percentage Breakdown of Value Revenues for France, Germany, Italy, UK and Rest of Europe Markets for Years 2012, 2021 & 2027
Europe Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Europe Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Europe 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
Europe Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Europe Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Europe 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
FRANCE
France Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
France Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
France 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
France Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
France Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
France 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
GERMANY
Germany Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Germany Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Germany 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
Germany Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Germany Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Germany 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
ITALY
Italy Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Italy Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Italy 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
Italy Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Italy Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Italy 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
UNITED KINGDOM
UK Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
UK Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
UK 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
UK Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
UK Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
UK 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
REST OF EUROPE
Rest of Europe Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Rest of Europe Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Rest of Europe 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
Rest of Europe Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Rest of Europe Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Rest of Europe 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
ASIA-PACIFIC
Semiconductor Advanced Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2022 (E)
Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Geographic Region - South Korea, Taiwan and Rest of Asia-Pacific Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
Asia-Pacific Historic Review for Semiconductor Advanced Packaging by Geographic Region - South Korea, Taiwan and Rest of Asia-Pacific Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Asia-Pacific 15-Year Perspective for Semiconductor Advanced Packaging by Geographic Region - Percentage Breakdown of Value Revenues for South Korea, Taiwan and Rest of Asia-Pacific Markets for Years 2012, 2021 & 2027
Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Asia-Pacific Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Asia-Pacific 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Asia-Pacific Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Asia-Pacific 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
SOUTH KOREA
South Korea Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
South Korea Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
South Korea 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
South Korea Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
South Korea Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
South Korea 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
TAIWAN
Taiwan Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Taiwan Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Taiwan 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
Taiwan Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Taiwan Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Taiwan 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
REST OF ASIA-PACIFIC
Rest of Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Rest of Asia-Pacific Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Rest of Asia-Pacific 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
Rest of Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Rest of Asia-Pacific Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Rest of Asia-Pacific 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
REST OF WORLD
Rest of World Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Rest of World Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Rest of World 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
Rest of World Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Rest of World Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Rest of World 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
Total Companies Profiled: 109

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