EXECUTIVE ENGAGEMENTS
POOL
2628
Number of executives repeatedly engaged by snail & email outreach
INTERACTIONS
946
Interactions with Platform & by Email
PARTICIPANTS
246
Unique # Participated
VALIDATIONS
85
Responses Validated*
COMPANIES
225
Responses Validated*
* Login for a full stack data experience
DATE
MAY 2021
TABLES
192
PAGES
441
EDITION
16
PRICE
USD 5450
CODE
MCP-1883
*Engagement stats are ongoing and dynamic
COMPETITIVE METRICS
COMPANY |
D
S
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T
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% * |
|---|---|---|
ABL Circuits Ltd. |
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Accurate Circuit Engineering |
|
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Accutrace, Inc. |
|
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Additive Circuits (S) Pte Ltd |
|
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Advanced Circuits, Inc. |
|
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AGM PCB Srl |
|
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AKA PCB d.o.o. |
|
Login Required |
Akasaka Electronics Ltd. |
|
Login Required |
Alba Elettronica Srl |
|
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Almatron Electronics Inc. |
|
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HIGHLIGHTS & REPORT INDEX
Amid the COVID-19 crisis, the global market for Printed Circuit Boards (PCBs) estimated at US$54.8 Billion in the year 2020, is projected to reach a revised size of US$76 Billion by 2027, growing at a CAGR of 4.8% over the analysis period 2020-2027. Multi-Layer, one of the segments analyzed in the report, is projected to record a 5.2% CAGR and reach US$49.9 Billion by the end of the analysis period. After an early analysis of the business implications of the pandemic and its induced economic crisis, growth in the Double-Sided segment is readjusted to a revised 3.9% CAGR for the next 7-year period.
The Printed Circuit Boards (PCBs) market in the U.S. is estimated at US$6.2 Billion in the year 2020. China, the world`s second largest economy, is forecast to reach a projected market size of US$19.6 Billion by the year 2027 trailing a CAGR of 5.7% over the analysis period 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 3.6% and 4.4% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 3.9% CAGR.
In the global Single-Sided segment, USA, Canada, Japan, China and Europe will drive the 4.3% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$4.9 Billion in the year 2020 will reach a projected size of US$6.6 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$26.8 Billion by the year 2027.
SELECT PLAYERS
Jabil Inc.; Plexus Corp.; TTM Technologies, Inc.; Benchmark Electronics; Advanced Circuits; Murrietta Circuits; SigmaTron International, Inc.; AP Circuits; Compeq Manufacturing Co. Ltd.; Ibiden Co. Ltd.; Unimicron Technology Corp.; Tripod Technology Corp.; Zhen Ding Technology Holding Ltd.
SEGMENTS
» Type (Multi-Layer, Double-Sided, Single-Sided) » Substrate Type (Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex, and Other Substrate Types) » End-Use (Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense, Other End-Uses)
GEOGRAPHIES
» World » USA » Canada » Japan » China » Europe » France » Germany » Italy » UK » Rest of Europe » Asia-Pacific » South Korea » Taiwan » Rest of Asia-Pacific » Rest of World
TABLE OF CONTENTS
| I. METHODOLOGY |
| II. EXECUTIVE SUMMARY |
| 1. MARKET OVERVIEW |
| Influencer Market Insights |
| World Market Trajectories |
| What are PCBs, Where are they Used & Why are they the Backbone of Electronics? |
| PCBs Are a Key Part of the Electronics Value Chain. COVID-19 Exposes the Risk of Value Chain Modularity |
| COVID-19 Emerges as a Black Swan Event for the Electronics Industry |
| Among the Hammered Companies in the Supply Chain is the “Semiconductor Industry” |
| Table: Measuring the Impact of COVID-19 On the Semiconductor Industry in Terms of Disruption & Time to Recovery (In Months) as of May 2020 |
| Table: Supply Chain Disruptions Impact a Large Number of Electronic Manufacturers: % Share of Companies Impacted by Supply Chain Delays Due to COVID-19 Worldwide as of May 2020 |
| Falling Consumer Confidence Impacts Retail Sales of Consumer & Automotive Electronics |
| Table: Rapidly Eroding Consumer Confidence Thwarts Hopes for a Quick Recovery: Global Consumer Confidence Index Points for 4Q2019, 1Q2020 & 2Q2020 |
| Table: Shrinking Disposable Incomes Take its Toll on Consumer Demand for Electronics: Global 1Q Sell-In Shipments of Electronic Products Estimated in Jan-2020 Vs March 2020 (In Million Units) |
| Deteriorating Business Confidence & Virus Led Economic Recession Impacts Prospects for Industrial Electronics |
| Table: Virus Led Recession Frustrates Recovery of Upstream & Downstream Markets in the Electronics Industry: Global GDP Growth (In %) for the Years 2019, 2020 & 2021 |
| Table: Manufacturing Industry Bites the Dust Severing All Planned Digital & Electronic Plant Upgrade Investments: Global Manufacturing PMI Index Score January 2020 to May 2020 |
| It’s a Bumpy Road to Recovery as Loosening Up of Restrictions Triggers a Second Wave of Infections |
| Table: Rising Global Infections Dampen Sentiment & Keep Businesses on Tenterhooks: Global Number of COVID-19 Infections Per Day in the Month of June 2020 |
| Table: Despite Moves to Reopen the Economy, Battered Business Confidence Plummets to New Depths: Business Confidence Index (BCI) Points |
| Recent Market Activity |
| World Brands |
| 2. FOCUS ON SELECT PLAYERS |
| 3. MARKET TRENDS & DRIVERS |
| Digital Transformation Catalyzed by the Pandemic Provides the Perfect Platform for Growth in the Post COVID-19 Period. |
| The Scenario Bodes Well for All Things Electronic & Digital. Special Focus on PCBs for Electronic Wearables |
| Table: It’s Not CIOs or CFOs, its COVID-19 Leading Digital Transformation Globally: Global Digital Transformation Spending (In US$ Trillion) for the Years 2019 through 2023 |
| Post COVID-19 As Technology Steps Forward to Help With Social Distancing, Renewed Focus Will Be Shed on Industrial Automation |
| Table: As a Lesson Learnt in Social Distancing from the COVID-19 Pandemic, Use of Industrial Robots to Spike in the Post COVID-19 Period: Industrial Robot Density (Units Per 10,000 Workers) for the Years 2019 & 2023 |
| As Telemedicine Storms into the Spotlight in the Post COVID-19 Period, Medical Wearables to Offer Opportunities for Rigid-flex PCBs |
| Table: COVID-19 Pandemic Catalyzes Migration to New Models of Remote Care Delivery & Boosts Importance of Electronics Subsystems Supporting Smart Wearables: Global Number of Telemedicine Patients (In Million) for the Years 2016, 2018, 2020, 2023 & 2025 |
| A Return to Economic Normalcy Will Reignite Growth Drivers in the Consumer Electronics End-Use Sector |
| Table: Smart Homes Emerge as a Disruptive Trend Enhancing Lives of Homeowners & Also Creating New Market Opportunities Players in the Electronics Value Chain: Global Smart Homes Market by Category in US$ Billion for the Years 2020 and 2022 |
| The Coming Era of Electronification of Medical Devices to Bring Attractive Opportunities for Medical PCBs |
| Table: A 47.1% Increase in Growth in the Post COVID-19 Period for the Medical Devices Industry Encourages an Optimistic Outlook for Medical PCBs: Global Medical Devices Industry (In US$ Billion) for the Years 2000, 2023 & 2025 |
| PCBs are the Core of IoT Devices. Disruptions Caused by the Pandemic & the Push for Connected Tech to Benefit Market Growth |
| A Review of the IoT Opportunity for Flex and HDI PCBs |
| Table: IoT to Take a Quantum Leap With the Pandemic Highlighting the Importance of Remote Operations in Ensuring Business Resiliency: Global Number of IoT Connected Devices (In Billion Units) for the Years 2016, 2018, 2020, 2022 & 2025 |
| Coronavirus Outbreak Makes Driverless Cars Attractive. Autonomous Cars Hold Robust Potential for Growth of PCBs in the Post COVID Period |
| Non-Contact Deliveries Made Popular by the Pandemic Will Ready the PCB Market for the Coming Age of Drones |
| What Does this Mean for PCB Designers and Manufacturers? |
| Table: In the “Touch-Me-Not” Environment to Follow in the Post Pandemic Period, Use of Drones Will Rise to New Highs: Number of Countries Worldwide Using Drones/UAVs by Type 2019 & 2025 |
| As Post Pandemic Economic Rebuilding Efforts Get Underway, Focus on Pandemic Ready Smart Cities Will Create a Hotbed of Opportunities for PCBs |
| Table: Focus on Reshaping City Resilience to Future Pandemics & Crisis Will Spur Rejuvenated Spending on Smart City Projects in the Post COVID-19 Period, Providing a Goldmine of Opportunities for Electronic Technologies: Global Smart City Spending (In US$ Billion) for the Years 2021, 2023 & 2025 |
| It’s a Slower & Longer Road to Recovery for PCBs Used in Defense & Avionics |
| Table: With the Aviation Industry on the Brink of Annihilation, Pre-Pandemic Digitalization Plans Will Take a Long Time to Witness a Return to Implementation: Expected Revenue Losses in Global Aviation (In US$ Billion) |
| Table: Massive Employment Losses in Tourism Highlights How Far the Aviation Industry is from Making a Meaningful Recovery: Employment Losses in Tourism (In Million) by End of 2020 |
| Integration of Artificial Intelligence Into PCB Design & Production Comes of Age |
| 4. GLOBAL MARKET PERSPECTIVE |
| World Current & Future Analysis for Printed Circuit Boards (PCBs) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR |
| World Historic Review for Printed Circuit Boards (PCBs) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| World 15-Year Perspective for Printed Circuit Boards (PCBs) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2012, 2020 & 2027 |
| World Current & Future Analysis for Multi-Layer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR |
| World Historic Review for Multi-Layer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| World 15-Year Perspective for Multi-Layer by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027 |
| World Current & Future Analysis for Double-Sided by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR |
| World Historic Review for Double-Sided by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| World 15-Year Perspective for Double-Sided by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027 |
| World Current & Future Analysis for Single-Sided by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR |
| World Historic Review for Single-Sided by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| World 15-Year Perspective for Single-Sided by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027 |
| World Current & Future Analysis for Standard Multilayer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR |
| World Historic Review for Standard Multilayer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| World 15-Year Perspective for Standard Multilayer by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027 |
| World Current & Future Analysis for High-Density Interconnect (HDI) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR |
| World Historic Review for High-Density Interconnect (HDI) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| World 15-Year Perspective for High-Density Interconnect (HDI) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027 |
| World Current & Future Analysis for IC Substrate by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR |
| World Historic Review for IC Substrate by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| World 15-Year Perspective for IC Substrate by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027 |
| World Current & Future Analysis for Rigid 1-2 Sided by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR |
| World Historic Review for Rigid 1-2 Sided by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| World 15-Year Perspective for Rigid 1-2 Sided by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027 |
| World Current & Future Analysis for Rigid-Flex by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR |
| World Historic Review for Rigid-Flex by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| World 15-Year Perspective for Rigid-Flex by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027 |
| World Current & Future Analysis for Other Substrate Types by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR |
| World Historic Review for Other Substrate Types by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| World 15-Year Perspective for Other Substrate Types by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027 |
| World Current & Future Analysis for Computer & Peripherals by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR |
| World Historic Review for Computer & Peripherals by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| World 15-Year Perspective for Computer & Peripherals by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027 |
| World Current & Future Analysis for Communications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR |
| World Historic Review for Communications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| World 15-Year Perspective for Communications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027 |
| World Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR |
| World Historic Review for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| World 15-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027 |
| World Current & Future Analysis for Industrial Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR |
| World Historic Review for Industrial Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| World 15-Year Perspective for Industrial Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027 |
| World Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR |
| World Historic Review for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| World 15-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027 |
| World Current & Future Analysis for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR |
| World Historic Review for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| World 15-Year Perspective for Aerospace & Defense by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027 |
| World Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR |
| World Historic Review for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| World 15-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027 |
| III. MARKET ANALYSIS |
| UNITED STATES |
| Semiconductor Industry in the U.S. |
| USA Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| USA Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| USA 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2020 & 2027 |
| USA Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| USA Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| USA 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2020 & 2027 |
| USA Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| USA Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| USA 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027 |
| CANADA |
| Canada Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Canada Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| Canada 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2020 & 2027 |
| Canada Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Canada Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| Canada 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2020 & 2027 |
| Canada Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Canada Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| Canada 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027 |
| JAPAN |
| Semiconductor Industry in Japan |
| Japan Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Japan Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| Japan 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2020 & 2027 |
| Japan Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Japan Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| Japan 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2020 & 2027 |
| Japan Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Japan Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| Japan 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027 |
| CHINA |
| China Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| China Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| China 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2020 & 2027 |
| China Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| China Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| China 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2020 & 2027 |
| China Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| China Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| China 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027 |
| EUROPE |
| Europe Current & Future Analysis for Printed Circuit Boards (PCBs) by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR |
| Europe Historic Review for Printed Circuit Boards (PCBs) by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| Europe 15-Year Perspective for Printed Circuit Boards (PCBs) by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2012, 2020 & 2027 |
| Europe Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Europe Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| Europe 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2020 & 2027 |
| Europe Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Europe Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| Europe 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2020 & 2027 |
| Europe Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Europe Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| Europe 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027 |
| FRANCE |
| France Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| France Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| France 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2020 & 2027 |
| France Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| France Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| France 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2020 & 2027 |
| France Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| France Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| France 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027 |
| GERMANY |
| Germany Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Germany Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| Germany 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2020 & 2027 |
| Germany Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Germany Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| Germany 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2020 & 2027 |
| Germany Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Germany Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| Germany 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027 |
| ITALY |
| Italy Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Italy Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| Italy 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2020 & 2027 |
| Italy Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Italy Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| Italy 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2020 & 2027 |
| Italy Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Italy Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| Italy 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027 |
| UNITED KINGDOM |
| UK Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| UK Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| UK 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2020 & 2027 |
| UK Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| UK Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| UK 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2020 & 2027 |
| UK Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| UK Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| UK 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027 |
| REST OF EUROPE |
| Rest of Europe Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Rest of Europe Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| Rest of Europe 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2020 & 2027 |
| Rest of Europe Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Rest of Europe Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| Rest of Europe 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2020 & 2027 |
| Rest of Europe Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Rest of Europe Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| Rest of Europe 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027 |
| ASIA-PACIFIC |
| Asia-Pacific Current & Future Analysis for Printed Circuit Boards (PCBs) by Geographic Region - South Korea, Taiwan and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR |
| Asia-Pacific Historic Review for Printed Circuit Boards (PCBs) by Geographic Region - South Korea, Taiwan and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| Asia-Pacific 15-Year Perspective for Printed Circuit Boards (PCBs) by Geographic Region - Percentage Breakdown of Value Sales for South Korea, Taiwan and Rest of Asia-Pacific Markets for Years 2012, 2020 & 2027 |
| Asia-Pacific Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Asia-Pacific Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| Asia-Pacific 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2020 & 2027 |
| Asia-Pacific Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Asia-Pacific Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| Asia-Pacific 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2020 & 2027 |
| Asia-Pacific Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Asia-Pacific Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| Asia-Pacific 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027 |
| SOUTH KOREA |
| South Korea Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| South Korea Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| South Korea 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2020 & 2027 |
| South Korea Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| South Korea Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| South Korea 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2020 & 2027 |
| South Korea Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| South Korea Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| South Korea 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027 |
| TAIWAN |
| Taiwan, a Semiconductor Behemoth |
| Taiwan Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Taiwan Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| Taiwan 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2020 & 2027 |
| Taiwan Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Taiwan Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| Taiwan 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2020 & 2027 |
| Taiwan Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Taiwan Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| Taiwan 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027 |
| REST OF ASIA-PACIFIC |
| Rest of Asia-Pacific Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Rest of Asia-Pacific Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| Rest of Asia-Pacific 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2020 & 2027 |
| Rest of Asia-Pacific Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Rest of Asia-Pacific Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| Rest of Asia-Pacific 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2020 & 2027 |
| Rest of Asia-Pacific Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Rest of Asia-Pacific Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| Rest of Asia-Pacific 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027 |
| REST OF WORLD |
| Rest of World Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Rest of World Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| Rest of World 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2020 & 2027 |
| Rest of World Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Rest of World Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| Rest of World 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2020 & 2027 |
| Rest of World Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Rest of World Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR |
| Rest of World 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2020 & 2027 |
| IV. COMPETITION |
| Total Companies Profiled: 225 |
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