VALIDATED EXECUTIVE ENGAGEMENTS
POOL + OUTREACH
3108
Number of executives repeatedly engaged by snail & email outreach
INTERACTIONS
559
Interactions with Platform & by Email
PARTICIPANTS
93
Unique # Participated
VALIDATIONS
42
Responses Validated*
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DATE
JULY 2020
TABLES
144
PAGES
219
EDITION
6
PRICE
USD $5450
China Has Risen Into An Economic Powerhouse.
Find Out How You Can Leverage This Opportunity!
Amid the COVID-19 crisis, the global market for Interposer and Fan-Out WLP estimated at US$6.2 Billion in the year 2020, is projected to reach a revised size of US$26.5 Billion by 2027, growing at a CAGR of 23.1% over the analysis period 2020-2027. Through-Silicon Vias (TSVs), one of the segments analyzed in the report, is projected to record a 24.3% CAGR and reach US$16.1 Billion by the end of the analysis period. After an early analysis of the business implications of the pandemic and its induced economic crisis, growth in the Interposers segment is readjusted to a revised 22.1% CAGR for the next 7-year period.
The Interposer and Fan-Out WLP market in the U.S. is estimated at US$1.7 Billion in the year 2020. China, the world`s second largest economy, is forecast to reach a projected market size of US$6.5 Billion by the year 2027 trailing a CAGR of 29% over the analysis period 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 18% and 21.2% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 19.8% CAGR.
In the global Fan-out Wafer-Level Packaging (FOWLP) segment, USA, Canada, Japan, China and Europe will drive the 19.5% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$771.7 Million in the year 2020 will reach a projected size of US$2.7 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$4 Billion by the year 2027, while Latin America will expand at a 21.5% CAGR through the analysis period. We bring years of research experience to this 6th edition of our report. The 219-page report presents concise insights into how the pandemic has impacted production and the buy side for 2020 and 2021. A short-term phased recovery by key geography is also addressed.
Amkor Technology, Inc.; ASE Group; Broadcom Ltd.; Infineon Technologies AG; Intel Corporation; Jiangsu Changjiang Electronics Technology Co., Ltd.; Qualcomm, Inc.; Samsung Electronics Co., Ltd.; STMicroelectronics NV; Taiwan Semiconductor Manufacturing Co., Ltd.; Texas Instruments, Inc.; Toshiba Corporation; United Microelectronics Corporation
» End-Use (Consumer Electronics, Telecommunication, Industrial Sector, Automotive, Military and Aerospace, Other End-Uses) » Packaging Technology (Through-Silicon Vias (TSVs), Interposers, Fan-out Wafer-Level Packaging (FOWLP))
» World » United States » Canada » Japan » China » Europe » France » Germany » Italy » United Kingdom » Spain » Russia » and Rest of Europe » Asia-Pacific » Australia » India » South Korea » and Rest of Asia-Pacific » Latin America » Argentina » Brazil » Mexico » and Rest of Latin America » Middle East » Iran » Israel » Saudi Arabia » United Arab Emirates » and Rest of Middle East » and Africa
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05
| I. INTRODUCTION, METHODOLOGY & REPORT SCOPE |
| II. EXECUTIVE SUMMARY |
| 1. MARKET OVERVIEW |
| Global Competitor Market Shares |
| Interposer and Fan-Out WLP Competitor Market Share Scenario Worldwide (in %): 2019 & 2025 |
| Impact of Covid-19 and a Looming Global Recession |
| 2. FOCUS ON SELECT PLAYERS |
| 3. MARKET TRENDS & DRIVERS |
| 4. GLOBAL MARKET PERSPECTIVE |
| Interposer and Fan-Out WLP Global Market Estimates and Forecasts in US$ Million by Region/Country: 2020-2027 |
| Interposer and Fan-Out WLP Market Share Shift across Key Geographies Worldwide: 2020 VS 2027 |
| Through-Silicon Vias (TSVs) (Packaging Technology) World Market by Region/Country in US$ Million: 2020 to 2027 |
| Through-Silicon Vias (TSVs) (Packaging Technology) Market Share Breakdown of Worldwide Sales by Region/Country: 2020 VS 2027 |
| Interposers (Packaging Technology) Potential Growth Markets Worldwide in US$ Million: 2020 to 2027 |
| Interposers (Packaging Technology) Market Sales Breakdown by Region/Country in Percentage: 2020 VS 2027 |
| Fan-out Wafer-Level Packaging (FOWLP) (Packaging Technology) Geographic Market Spread Worldwide in US$ Million: 2020 to 2027 |
| Fan-out Wafer-Level Packaging (FOWLP) (Packaging Technology) Market Share Distribution in Percentage by Region/Country: 2020 VS 2027 |
| Consumer Electronics (End-Use) Demand Potential Worldwide in US$ Million by Region/Country: 2020-2027 |
| Consumer Electronics (End-Use) Share Breakdown Review by Region/Country: 2020 VS 2027 |
| Telecommunication (End-Use) Worldwide Latent Demand Forecasts in US$ Million by Region/Country: 2020-2027 |
| Telecommunication (End-Use) Distribution of Global Sales by Region/Country: 2020 VS 2027 |
| Industrial Sector (End-Use) Sales Estimates and Forecasts in US$ Million by Region/Country for the Years 2020 through 2027 |
| Industrial Sector (End-Use) Global Market Share Distribution by Region/Country for 2020 and 2027 |
| Automotive (End-Use) Global Opportunity Assessment in US$ Million by Region/Country: 2020-2027 |
| Automotive (End-Use) Percentage Share Breakdown of Global Sales by Region/Country: 2020 VS 2027 |
| Military and Aerospace (End-Use) Worldwide Sales in US$ Million by Region/Country: 2020-2027 |
| Military and Aerospace (End-Use) Market Share Shift across Key Geographies: 2020 VS 2027 |
| Other End-Uses (End-Use) Global Market Estimates & Forecasts in US$ Million by Region/Country: 2020-2027 |
| Other End-Uses (End-Use) Market Share Breakdown by Region/Country: 2020 VS 2027 |
| III. MARKET ANALYSIS |
| GEOGRAPHIC MARKET ANALYSIS |
| UNITED STATES |
| Market Facts & Figures |
| US Interposer and Fan-Out WLP Market Share (in %) by Company: 2019 & 2025 |
| United States Interposer and Fan-Out WLP Market Estimates and Projections in US$ Million by Packaging Technology: 2020 to 2027 |
| United States Interposer and Fan-Out WLP Market Share Breakdown by Packaging Technology: 2020 VS 2027 |
| United States Interposer and Fan-Out WLP Latent Demand Forecasts in US$ Million by End-Use: 2020 to 2027 |
| Interposer and Fan-Out WLP Market Share Breakdown in the United States by End-Use: 2020 VS 2027 |
| CANADA |
| Canadian Interposer and Fan-Out WLP Market Estimates and Forecasts in US$ Million by Packaging Technology: 2020 to 2027 |
| Interposer and Fan-Out WLP Market in Canada: Percentage Share Breakdown of Sales by Packaging Technology for 2020 and 2027 |
| Canadian Interposer and Fan-Out WLP Market Quantitative Demand Analysis in US$ Million by End-Use: 2020 to 2027 |
| Canadian Interposer and Fan-Out WLP Market Share Analysis by End-Use: 2020 VS 2027 |
| JAPAN |
| Japanese Market for Interposer and Fan-Out WLP: Annual Sales Estimates and Projections in US$ Million by Packaging Technology for the Period 2020-2027 |
| Japanese Interposer and Fan-Out WLP Market Share Analysis by Packaging Technology: 2020 VS 2027 |
| Japanese Demand Estimates and Forecasts for Interposer and Fan-Out WLP in US$ Million by End-Use: 2020 to 2027 |
| Interposer and Fan-Out WLP Market Share Shift in Japan by End-Use: 2020 VS 2027 |
| CHINA |
| Chinese Interposer and Fan-Out WLP Market Growth Prospects in US$ Million by Packaging Technology for the Period 2020-2027 |
| Chinese Interposer and Fan-Out WLP Market by Packaging Technology: Percentage Breakdown of Sales for 2020 and 2027 |
| Chinese Demand for Interposer and Fan-Out WLP in US$ Million by End-Use: 2020 to 2027 |
| Chinese Interposer and Fan-Out WLP Market Share Breakdown by End-Use: 2020 VS 2027 |
| EUROPE |
| Market Facts & Figures |
| European Interposer and Fan-Out WLP Market: Competitor Market Share Scenario (in %) for 2019 & 2025 |
| European Interposer and Fan-Out WLP Market Demand Scenario in US$ Million by Region/Country: 2018-2025 |
| European Interposer and Fan-Out WLP Market Share Shift by Region/Country: 2020 VS 2027 |
| European Interposer and Fan-Out WLP Market Estimates and Forecasts in US$ Million by Packaging Technology: 2020-2027 |
| European Interposer and Fan-Out WLP Market Share Breakdown by Packaging Technology: 2020 VS 2027 |
| European Interposer and Fan-Out WLP Addressable Market Opportunity in US$ Million by End-Use: 2020-2027 |
| European Interposer and Fan-Out WLP Market Share Analysis by End-Use: 2020 VS 2027 |
| FRANCE |
| Interposer and Fan-Out WLP Market in France by Packaging Technology: Estimates and Projections in US$ Million for the Period 2020-2027 |
| French Interposer and Fan-Out WLP Market Share Analysis by Packaging Technology: 2020 VS 2027 |
| Interposer and Fan-Out WLP Quantitative Demand Analysis in France in US$ Million by End-Use: 2020-2027 |
| French Interposer and Fan-Out WLP Market Share Analysis: A 7-Year Perspective by End-Use for 2020 and 2027 |
| GERMANY |
| Interposer and Fan-Out WLP Market in Germany: Recent Past, Current and Future Analysis in US$ Million by Packaging Technology for the Period 2020-2027 |
| German Interposer and Fan-Out WLP Market Share Breakdown by Packaging Technology: 2020 VS 2027 |
| Interposer and Fan-Out WLP Market in Germany: Annual Sales Estimates and Forecasts in US$ Million by End-Use for the Period 2020-2027 |
| Interposer and Fan-Out WLP Market Share Distribution in Germany by End-Use: 2020 VS 2027 |
| ITALY |
| Italian Interposer and Fan-Out WLP Market Growth Prospects in US$ Million by Packaging Technology for the Period 2020-2027 |
| Italian Interposer and Fan-Out WLP Market by Packaging Technology: Percentage Breakdown of Sales for 2020 and 2027 |
| Italian Demand for Interposer and Fan-Out WLP in US$ Million by End-Use: 2020 to 2027 |
| Italian Interposer and Fan-Out WLP Market Share Breakdown by End-Use: 2020 VS 2027 |
| UNITED KINGDOM |
| United Kingdom Market for Interposer and Fan-Out WLP: Annual Sales Estimates and Projections in US$ Million by Packaging Technology for the Period 2020-2027 |
| United Kingdom Interposer and Fan-Out WLP Market Share Analysis by Packaging Technology: 2020 VS 2027 |
| United Kingdom Demand Estimates and Forecasts for Interposer and Fan-Out WLP in US$ Million by End-Use: 2020 to 2027 |
| Interposer and Fan-Out WLP Market Share Shift in the United Kingdom by End-Use: 2020 VS 2027 |
| SPAIN |
| Spanish Interposer and Fan-Out WLP Market Estimates and Forecasts in US$ Million by Packaging Technology: 2020 to 2027 |
| Interposer and Fan-Out WLP Market in Spain: Percentage Share Breakdown of Sales by Packaging Technology for 2020 and 2027 |
| Spanish Interposer and Fan-Out WLP Market Quantitative Demand Analysis in US$ Million by End-Use: 2020 to 2027 |
| Spanish Interposer and Fan-Out WLP Market Share Analysis by End-Use: 2020 VS 2027 |
| RUSSIA |
| Russian Interposer and Fan-Out WLP Market Estimates and Projections in US$ Million by Packaging Technology: 2020 to 2027 |
| Russian Interposer and Fan-Out WLP Market Share Breakdown by Packaging Technology: 2020 VS 2027 |
| Russian Interposer and Fan-Out WLP Latent Demand Forecasts in US$ Million by End-Use: 2020 to 2027 |
| Interposer and Fan-Out WLP Market Share Breakdown in Russia by End-Use: 2020 VS 2027 |
| REST OF EUROPE |
| Rest of Europe Interposer and Fan-Out WLP Market Estimates and Forecasts in US$ Million by Packaging Technology: 2020-2027 |
| Rest of Europe Interposer and Fan-Out WLP Market Share Breakdown by Packaging Technology: 2020 VS 2027 |
| Rest of Europe Interposer and Fan-Out WLP Addressable Market Opportunity in US$ Million by End-Use: 2020-2027 |
| Rest of Europe Interposer and Fan-Out WLP Market Share Analysis by End-Use: 2020 VS 2027 |
| ASIA-PACIFIC |
| Asia-Pacific Interposer and Fan-Out WLP Market Estimates and Forecasts in US$ Million by Region/Country: 2020-2027 |
| Asia-Pacific Interposer and Fan-Out WLP Market Share Analysis by Region/Country: 2020 VS 2027 |
| Interposer and Fan-Out WLP Market in Asia-Pacific by Packaging Technology: Estimates and Projections in US$ Million for the Period 2020-2027 |
| Asia-Pacific Interposer and Fan-Out WLP Market Share Analysis by Packaging Technology: 2020 VS 2027 |
| Interposer and Fan-Out WLP Quantitative Demand Analysis in Asia-Pacific in US$ Million by End-Use: 2020-2027 |
| Asia-Pacific Interposer and Fan-Out WLP Market Share Analysis: A 7-Year Perspective by End-Use for 2020 and 2027 |
| AUSTRALIA |
| Interposer and Fan-Out WLP Market in Australia: Recent Past, Current and Future Analysis in US$ Million by Packaging Technology for the Period 2020-2027 |
| Australian Interposer and Fan-Out WLP Market Share Breakdown by Packaging Technology: 2020 VS 2027 |
| Interposer and Fan-Out WLP Market in Australia: Annual Sales Estimates and Forecasts in US$ Million by End-Use for the Period 2020-2027 |
| Interposer and Fan-Out WLP Market Share Distribution in Australia by End-Use: 2020 VS 2027 |
| INDIA |
| Indian Interposer and Fan-Out WLP Market Estimates and Forecasts in US$ Million by Packaging Technology: 2020 to 2027 |
| Interposer and Fan-Out WLP Market in India: Percentage Share Breakdown of Sales by Packaging Technology for 2020 and 2027 |
| Indian Interposer and Fan-Out WLP Market Quantitative Demand Analysis in US$ Million by End-Use: 2020 to 2027 |
| Indian Interposer and Fan-Out WLP Market Share Analysis by End-Use: 2020 VS 2027 |
| SOUTH KOREA |
| Interposer and Fan-Out WLP Market in South Korea: Recent Past, Current and Future Analysis in US$ Million by Packaging Technology for the Period 2020-2027 |
| Interposer and Fan-Out WLP Market Share Distribution in South Korea by Packaging Technology: 2020 VS 2027 |
| Interposer and Fan-Out WLP Market in South Korea: Recent Past, Current and Future Analysis in US$ Million by End-Use for the Period 2020-2027 |
| Interposer and Fan-Out WLP Market Share Distribution in South Korea by End-Use: 2020 VS 2027 |
| REST OF ASIA-PACIFIC |
| Rest of Asia-Pacific Market for Interposer and Fan-Out WLP: Annual Sales Estimates and Projections in US$ Million by Packaging Technology for the Period 2020-2027 |
| Rest of Asia-Pacific Interposer and Fan-Out WLP Market Share Analysis by Packaging Technology: 2020 VS 2027 |
| Rest of Asia-Pacific Demand Estimates and Forecasts for Interposer and Fan-Out WLP in US$ Million by End-Use: 2020 to 2027 |
| Interposer and Fan-Out WLP Market Share Shift in Rest of Asia-Pacific by End-Use: 2020 VS 2027 |
| LATIN AMERICA |
| Latin American Interposer and Fan-Out WLP Market Trends by Region/Country in US$ Million: 2020-2027 |
| Latin American Interposer and Fan-Out WLP Market Percentage Breakdown of Sales by Region/Country: 2020 and 2027 |
| Latin American Interposer and Fan-Out WLP Market Growth Prospects in US$ Million by Packaging Technology for the Period 2020-2027 |
| Latin American Interposer and Fan-Out WLP Market by Packaging Technology: Percentage Breakdown of Sales for 2020 and 2027 |
| Latin American Demand for Interposer and Fan-Out WLP in US$ Million by End-Use: 2020 to 2027 |
| Latin American Interposer and Fan-Out WLP Market Share Breakdown by End-Use: 2020 VS 2027 |
| ARGENTINA |
| Argentinean Interposer and Fan-Out WLP Market Estimates and Forecasts in US$ Million by Packaging Technology: 2020-2027 |
| Argentinean Interposer and Fan-Out WLP Market Share Breakdown by Packaging Technology: 2020 VS 2027 |
| Argentinean Interposer and Fan-Out WLP Addressable Market Opportunity in US$ Million by End-Use: 2020-2027 |
| Argentinean Interposer and Fan-Out WLP Market Share Analysis by End-Use: 2020 VS 2027 |
| BRAZIL |
| Interposer and Fan-Out WLP Market in Brazil by Packaging Technology: Estimates and Projections in US$ Million for the Period 2020-2027 |
| Brazilian Interposer and Fan-Out WLP Market Share Analysis by Packaging Technology: 2020 VS 2027 |
| Interposer and Fan-Out WLP Quantitative Demand Analysis in Brazil in US$ Million by End-Use: 2020-2027 |
| Brazilian Interposer and Fan-Out WLP Market Share Analysis: A 7-Year Perspective by End-Use for 2020 and 2027 |
| MEXICO |
| Interposer and Fan-Out WLP Market in Mexico: Recent Past, Current and Future Analysis in US$ Million by Packaging Technology for the Period 2020-2027 |
| Mexican Interposer and Fan-Out WLP Market Share Breakdown by Packaging Technology: 2020 VS 2027 |
| Interposer and Fan-Out WLP Market in Mexico: Annual Sales Estimates and Forecasts in US$ Million by End-Use for the Period 2020-2027 |
| Interposer and Fan-Out WLP Market Share Distribution in Mexico by End-Use: 2020 VS 2027 |
| REST OF LATIN AMERICA |
| Rest of Latin America Interposer and Fan-Out WLP Market Estimates and Projections in US$ Million by Packaging Technology: 2020 to 2027 |
| Rest of Latin America Interposer and Fan-Out WLP Market Share Breakdown by Packaging Technology: 2020 VS 2027 |
| Rest of Latin America Interposer and Fan-Out WLP Latent Demand Forecasts in US$ Million by End-Use: 2020 to 2027 |
| Interposer and Fan-Out WLP Market Share Breakdown in Rest of Latin America by End-Use: 2020 VS 2027 |
| MIDDLE EAST |
| The Middle East Interposer and Fan-Out WLP Market Estimates and Forecasts in US$ Million by Region/Country: 2018-2025 |
| The Middle East Interposer and Fan-Out WLP Market Share Breakdown by Region/Country: 2020 and 2027 |
| The Middle East Interposer and Fan-Out WLP Market Estimates and Forecasts in US$ Million by Packaging Technology: 2020 to 2027 |
| Interposer and Fan-Out WLP Market in the Middle East: Percentage Share Breakdown of Sales by Packaging Technology for 2020 and 2027 |
| The Middle East Interposer and Fan-Out WLP Market Quantitative Demand Analysis in US$ Million by End-Use: 2020 to 2027 |
| The Middle East Interposer and Fan-Out WLP Market Share Analysis by End-Use: 2020 VS 2027 |
| IRAN |
| Iranian Market for Interposer and Fan-Out WLP: Annual Sales Estimates and Projections in US$ Million by Packaging Technology for the Period 2020-2027 |
| Iranian Interposer and Fan-Out WLP Market Share Analysis by Packaging Technology: 2020 VS 2027 |
| Iranian Demand Estimates and Forecasts for Interposer and Fan-Out WLP in US$ Million by End-Use: 2020 to 2027 |
| Interposer and Fan-Out WLP Market Share Shift in Iran by End-Use: 2020 VS 2027 |
| ISRAEL |
| Israeli Interposer and Fan-Out WLP Market Estimates and Forecasts in US$ Million by Packaging Technology: 2020-2027 |
| Israeli Interposer and Fan-Out WLP Market Share Breakdown by Packaging Technology: 2020 VS 2027 |
| Israeli Interposer and Fan-Out WLP Addressable Market Opportunity in US$ Million by End-Use: 2020-2027 |
| Israeli Interposer and Fan-Out WLP Market Share Analysis by End-Use: 2020 VS 2027 |
| SAUDI ARABIA |
| Saudi Arabian Interposer and Fan-Out WLP Market Growth Prospects in US$ Million by Packaging Technology for the Period 2020-2027 |
| Saudi Arabian Interposer and Fan-Out WLP Market by Packaging Technology: Percentage Breakdown of Sales for 2020 and 2027 |
| Saudi Arabian Demand for Interposer and Fan-Out WLP in US$ Million by End-Use: 2020 to 2027 |
| Saudi Arabian Interposer and Fan-Out WLP Market Share Breakdown by End-Use: 2020 VS 2027 |
| UNITED ARAB EMIRATES |
| Interposer and Fan-Out WLP Market in the United Arab Emirates: Recent Past, Current and Future Analysis in US$ Million by Packaging Technology for the Period 2020-2027 |
| Interposer and Fan-Out WLP Market Share Distribution in United Arab Emirates by Packaging Technology: 2020 VS 2027 |
| Interposer and Fan-Out WLP Market in the United Arab Emirates: Recent Past, Current and Future Analysis in US$ Million by End-Use for the Period 2020-2027 |
| Interposer and Fan-Out WLP Market Share Distribution in United Arab Emirates by End-Use: 2020 VS 2027 |
| REST OF MIDDLE EAST |
| Interposer and Fan-Out WLP Market in Rest of Middle East: Recent Past, Current and Future Analysis in US$ Million by Packaging Technology for the Period 2020-2027 |
| Rest of Middle East Interposer and Fan-Out WLP Market Share Breakdown by Packaging Technology: 2020 VS 2027 |
| Interposer and Fan-Out WLP Market in Rest of Middle East: Annual Sales Estimates and Forecasts in US$ Million by End-Use for the Period 2020-2027 |
| Interposer and Fan-Out WLP Market Share Distribution in Rest of Middle East by End-Use: 2020 VS 2027 |
| AFRICA |
| African Interposer and Fan-Out WLP Market Estimates and Projections in US$ Million by Packaging Technology: 2020 to 2027 |
| African Interposer and Fan-Out WLP Market Share Breakdown by Packaging Technology: 2020 VS 2027 |
| African Interposer and Fan-Out WLP Latent Demand Forecasts in US$ Million by End-Use: 2020 to 2027 |
| Interposer and Fan-Out WLP Market Share Breakdown in Africa by End-Use: 2020 VS 2027 |
| IV. COMPETITION |
| Total Companies Profiled : 5 Click here to request a full table of contents and more details on this project. |
| V. CURATED RESEARCH |
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