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Global Interposer and Fan-Out WLP Market to Reach $56.1 Billion by 2027
In the changed post COVID-19 business landscape, the global market for Interposer and Fan-Out WLP estimated at US$13.1 Billion in the year 2020, is projected to reach a revised size of US$56.1 Billion by 2027, growing at a CAGR of 23.1% over the analysis period 2020-2027. Through-Silicon Via, one of the segments analyzed in the report, is projected to record a 24.3% CAGR and reach US$34.1 Billion by the end of the analysis period. Taking into account the ongoing post pandemic recovery, growth in the Interposers segment is readjusted to a revised 22.1% CAGR for the next 7-year period.

The U.S. Market is Estimated at $3.5 Billion, While China is Forecast to Grow at 29.1% CAGR
The Interposer and Fan-Out WLP market in the U.S. is estimated at US$3.5 Billion in the year 2020. China, the world`s second largest economy, is forecast to reach a projected market size of US$13.8 Billion by the year 2027 trailing a CAGR of 29% over the analysis period 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 18% and 21.2% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 19.9% CAGR. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$8.4 Billion by the year 2027.

Fan-Out Wafer-Level Packaging Segment to Record 20.2% CAGR
In the global Fan-Out Wafer-Level Packaging segment, USA, Canada, Japan, China and Europe will drive the 20.2% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$1.6 Billion in the year 2020 will reach a projected size of US$5.7 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Latin America will expand at a 21.5% CAGR through the analysis period.