Cloud EDA

Global Market Trajectory & Analytics

MCP11069

EXECUTIVE ENGAGEMENTS

POOL

2358
Number of executives repeatedly engaged by snail & email outreach

INTERACTIONS

849
Interactions with Platform & by Email

PARTICIPANTS

221
Unique # Participated

VALIDATIONS

76
Responses Validated*

COMPANIES

9
Responses Validated*
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DATE

MAY 2021

TABLES

114

PAGES

153

EDITION

5

PRICE

USD 4950

CODE

MCP11069


COMPETITIVE METRICS

COMPANY

D S N T

% *

Agnisys Inc.

Aldec, Inc.

ANSYS, Inc.

Cadence Design Systems, Inc.

Jedd Technologies Corporation

Mentor, a Siemens Business

MunEDA GmbH

Synopsys, Inc.

Zuken, Inc.

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HIGHLIGHTS & REPORT INDEX

Global Cloud EDA Market to Reach $8.6 Billion by 2026

Amid the COVID-19 crisis, the global market for Cloud EDA estimated at US$6.3 Billion in the year 2020, is projected to reach a revised size of US$8.6 Billion by 2026, growing at a CAGR of 5.3% over the analysis period. CAE, one of the segments analyzed in the report, is projected to record a 6% CAGR and reach US$2.8 Billion by the end of the analysis period. After a thorough analysis of the business implications of the pandemic and its induced economic crisis, growth in the SIP (Semiconductor Intellectual Property) segment is readjusted to a revised 5.6% CAGR for the next 7-year period.

The U.S. Market is Estimated at $2 Billion in 2021, While China is Forecast to Reach $1.5 Billion by 2026

The Cloud EDA market in the U.S. is estimated at US$2 Billion in the year 2021. China, the world`s second largest economy, is forecast to reach a projected market size of US$1.5 Billion by the year 2026 trailing a CAGR of 5% over the analysis period. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 4.9% and 4.4% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 4.9% CAGR.

IC Physical Design & Verification Segment to Reach US$1.7 Billion by the year 2026

In the global IC Physical Design & Verification segment, USA, Canada, Japan, China and Europe will drive the 4.7% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$1.1 Billion in the year 2020 will reach a projected size of US$1.5 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets.

SELECT PLAYERS

Agnisys Inc.; Aldec, Inc.; ANSYS, Inc.; Cadence Design Systems, Inc.; JEDA Technologies, Inc.; Mentor Graphics Corporation; MunEDA GmbH; Synopsys, Inc.; Zuken

SEGMENTS

» Application (Military/Defense, Aerospace, Telecom, Automotive, Other Applications) » Product Segment (CAE, SIP (Semiconductor Intellectual Property), IC Physical Design and Verification, Printed Circuit Board (PCB) and Multi-chip Module (MCM)))

GEOGRAPHIES

» World » United States » Canada » Japan » China » Europe » France » Germany » Italy » United Kingdom » and Rest of Europe » Asia-Pacific » Rest of World

TABLE OF CONTENTS

1. MARKET OVERVIEW
Influencer Market Insights
World Market Trajectories
Impact of Covid-19 and a Looming Global Recession
2. FOCUS ON SELECT PLAYERS
3. MARKET TRENDS & DRIVERS
4. GLOBAL MARKET PERSPECTIVE
World Current & Future Analysis for Cloud EDA by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2018 through 2027 and % CAGR
World Historic Review for Cloud EDA by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
World 15-Year Perspective for Cloud EDA by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2012, 2018 & 2027
World Current & Future Analysis for CAE by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2018 through 2027 and % CAGR
World Historic Review for CAE by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
World 15-Year Perspective for CAE by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2018 & 2027
World Current & Future Analysis for SIP (Semiconductor Intellectual Property) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2018 through 2027 and % CAGR
World Historic Review for SIP (Semiconductor Intellectual Property) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
World 15-Year Perspective for SIP (Semiconductor Intellectual Property) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2018 & 2027
World Current & Future Analysis for IC Physical Design & Verification by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2018 through 2027 and % CAGR
World Historic Review for IC Physical Design & Verification by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
World 15-Year Perspective for IC Physical Design & Verification by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2018 & 2027
World Current & Future Analysis for Printed Circuit Board (PCB) & Multi-chip Module (MCM)) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2018 through 2027 and % CAGR
World Historic Review for Printed Circuit Board (PCB) & Multi-chip Module (MCM)) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
World 15-Year Perspective for Printed Circuit Board (PCB) & Multi-chip Module (MCM)) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2018 & 2027
World Current & Future Analysis for Military/Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2018 through 2027 and % CAGR
World Historic Review for Military/Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
World 15-Year Perspective for Military/Defense by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2018 & 2027
World Current & Future Analysis for Aerospace by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2018 through 2027 and % CAGR
World Historic Review for Aerospace by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
World 15-Year Perspective for Aerospace by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2018 & 2027
World Current & Future Analysis for Telecom by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2018 through 2027 and % CAGR
World Historic Review for Telecom by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
World 15-Year Perspective for Telecom by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2018 & 2027
World Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2018 through 2027 and % CAGR
World Historic Review for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
World 15-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2018 & 2027
World Current & Future Analysis for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2018 through 2027 and % CAGR
World Historic Review for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
World 15-Year Perspective for Other Applications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2018 & 2027
UNITED STATES
USA Current & Future Analysis for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
USA Historic Review for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
USA 15-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Sales for CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) for the Years 2012, 2018 & 2027
USA Current & Future Analysis for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
USA Historic Review for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
USA 15-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Sales for Military/Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2012, 2018 & 2027
CANADA
Canada Current & Future Analysis for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
Canada Historic Review for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Canada 15-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Sales for CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) for the Years 2012, 2018 & 2027
Canada Current & Future Analysis for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
Canada Historic Review for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Canada 15-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Sales for Military/Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2012, 2018 & 2027
JAPAN
Japan Current & Future Analysis for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
Japan Historic Review for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Japan 15-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Sales for CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) for the Years 2012, 2018 & 2027
Japan Current & Future Analysis for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
Japan Historic Review for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Japan 15-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Sales for Military/Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2012, 2018 & 2027
CHINA
China Current & Future Analysis for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
China Historic Review for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
China 15-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Sales for CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) for the Years 2012, 2018 & 2027
China Current & Future Analysis for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
China Historic Review for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
China 15-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Sales for Military/Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2012, 2018 & 2027
EUROPE
Europe Current & Future Analysis for Cloud EDA by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2018 through 2027 and % CAGR
Europe Historic Review for Cloud EDA by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Europe 15-Year Perspective for Cloud EDA by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2012, 2018 & 2027
Europe Current & Future Analysis for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
Europe Historic Review for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Europe 15-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Sales for CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) for the Years 2012, 2018 & 2027
Europe Current & Future Analysis for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
Europe Historic Review for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Europe 15-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Sales for Military/Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2012, 2018 & 2027
FRANCE
France Current & Future Analysis for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
France Historic Review for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
France 15-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Sales for CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) for the Years 2012, 2018 & 2027
France Current & Future Analysis for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
France Historic Review for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
France 15-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Sales for Military/Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2012, 2018 & 2027
GERMANY
Germany Current & Future Analysis for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
Germany Historic Review for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Germany 15-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Sales for CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) for the Years 2012, 2018 & 2027
Germany Current & Future Analysis for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
Germany Historic Review for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Germany 15-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Sales for Military/Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2012, 2018 & 2027
ITALY
Italy Current & Future Analysis for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
Italy Historic Review for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Italy 15-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Sales for CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) for the Years 2012, 2018 & 2027
Italy Current & Future Analysis for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
Italy Historic Review for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Italy 15-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Sales for Military/Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2012, 2018 & 2027
UNITED KINGDOM
UK Current & Future Analysis for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
UK Historic Review for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
UK 15-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Sales for CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) for the Years 2012, 2018 & 2027
UK Current & Future Analysis for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
UK Historic Review for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
UK 15-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Sales for Military/Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2012, 2018 & 2027
REST OF EUROPE
Rest of Europe Current & Future Analysis for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
Rest of Europe Historic Review for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Rest of Europe 15-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Sales for CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) for the Years 2012, 2018 & 2027
Rest of Europe Current & Future Analysis for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
Rest of Europe Historic Review for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Rest of Europe 15-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Sales for Military/Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2012, 2018 & 2027
ASIA-PACIFIC
Asia-Pacific Current & Future Analysis for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
Asia-Pacific Historic Review for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Asia-Pacific 15-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Sales for CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) for the Years 2012, 2018 & 2027
Asia-Pacific Current & Future Analysis for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
Asia-Pacific Historic Review for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Asia-Pacific 15-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Sales for Military/Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2012, 2018 & 2027
REST OF WORLD
Rest of World Current & Future Analysis for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
Rest of World Historic Review for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Rest of World 15-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Sales for CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) for the Years 2012, 2018 & 2027
Rest of World Current & Future Analysis for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
Rest of World Historic Review for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Rest of World 15-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Sales for Military/Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2012, 2018 & 2027
Total Companies Profiled: 9

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