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BONDING WIRE PACKAGING MATERIAL

Global Market Trajectory & Analytics

MCP10767

VALIDATED EXECUTIVE ENGAGEMENTS

Number of executives repeatedly engaged by snail & email outreach*

POOL + OUTREACH

479

Interactions with Platform & by Email *

INTERACTIONS

96

Unique # Participated *

PARTICIPANTS

19

Responses Validated *

VALIDATIONS

9

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  •  DATE

    JUNE 2020

  •  TABLES

    114

  •  PAGES

    188

  •  EDITION

    9

  •  PRICE

    US$4950

COVID-19 IMPACT SURVEY MAY 2020
Amid the COVID-19 crisis and the looming economic recession, the Bonding Wire Packaging Material market worldwide will grow by a projected US$272.2 Million, during the analysis period, driven by a revised compounded annual growth rate (CAGR) of 1.3%. Gold, one of the segments analyzed and sized in this study, is forecast to grow at over 1.4% and reach a market size of US$703.3 Million by the end of the analysis period. An unusual period in history, the coronavirus pandemic has unleashed a series of unprecedented events affecting every industry. The Gold market will be reset to a new normal which going forwards in a post COVID-19 era will be continuously redefined and redesigned. Staying on top of trends and accurate analysis is paramount now more than ever to manage uncertainty, change and continuously adapt to new and evolving market conditions.

As part of the new emerging geographic scenario, the United States is forecast to readjust to a 0.7% CAGR. Within Europe, the region worst hit by the pandemic, Germany will add over US$4 Million to the region's size over the next 7 to 8 years. In addition, over US$6.1 Million worth of projected demand in the region will come from Rest of European markets. In Japan, the Gold segment will reach a market size of US$25.8 Million by the close of the analysis period. Blamed for the pandemic, significant political and economic challenges confront China. Amid the growing push for decoupling and economic distancing, the changing relationship between China and the rest of the world will influence competition and opportunities in the Bonding Wire Packaging Material market. Against this backdrop and the changing geopolitical, business and consumer sentiments, the world's second largest economy will grow at 3.2% over the next couple of years and add approximately US$111 Million in terms of addressable market opportunity. Continuous monitoring for emerging signs of a possible new world order post-COVID-19 crisis is a must for aspiring businesses and their astute leaders seeking to find success in the now changing Bonding Wire Packaging Material market landscape. All research viewpoints presented are based on validated engagements from influencers in the market, whose opinions supersede all other research methodologies.

Competitors identified in this market include, among others, AMETEK Electronic Components & Packaging; California Fine Wire Co.; Heraeus Deutschland GmbH & Co. KG; Inseto Ltd.; MK Electron Co., Ltd.; Palomar Technologies, Inc.; RED Micro Wire Pte., Ltd.; Shinkawa Electric Co., Ltd.; Sumitomo Metal Mining Co., Ltd.; TANAKA Holdings Co., Ltd.; Tatsuta Electric Wire & Cable Co., Ltd.

SEGMENTS

» Material (Gold, PCC, Copper, Silver)

GEOGRAPHIES

» World » United States » Canada » Japan » China » Europe » France » Germany » Italy » United Kingdom » Spain » Russia » and Rest of Europe » Asia-Pacific » Australia » India » South Korea » and Rest of Asia-Pacific » Latin America » Argentina » Brazil » Mexico » and Rest of Latin America » Middle East » Iran » Israel » Saudi Arabia » United Arab Emirates » and Rest of Middle East » and Africa
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