VALIDATED EXECUTIVE ENGAGEMENTS Number of executives repeatedly engaged by snail & email outreach* 
POOL + OUTREACH
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The World of Advanced Electronic Packaging is Changing Fast!It's Time to Identify Upcoming Revenue Pockets & Growth Areas. |
COVID-19 IMPACT SURVEYMonitor Market Dynamics!Early March 2020, we reached out to senior enterprise executives who are driving strategy, business development, marketing, sales, product management, technology and operations at competitive firms worldwide. Our ongoing survey is focused on how this will this affect their business ecosystems. We invite you to participate in our survey and add to collective perspectives. Market movements are tracked for 2020, 2021 and broadly for the period of 2022 through 2025. Critical changes are monitored dynamically for the rest of this year. Updated analytics will reflect new and evolving market realities. Our first update scheduled for May 2020 and another in the Fall. Clients receive complimentary updates during 2020. If your company is a recent client for this project, we may have already reached out to your colleagues to participate in our program. If you're an active player in the space but hasn't yet subscribed to our project, we invite you to participate and share your perspectives. Please sign-up here. Amid the COVID-19 crisis, the global market for Advanced Electronic Packaging estimated at US$4 Billion in the year 2020, is projected to reach a revised size of US$7.3 Billion by 2027, growing at a CAGR of 9.1% over the period 2020-2027.Wafer-Level Chip-Scale Packaging, one of the segments analyzed in the report, is projected to grow at a 8.5% CAGR to reach US$4.2 Billion by the end of the analysis period. After an early analysis of the business implications of the pandemic and its induced economic crisis, growth in the Through Silicon via (Tsv) Packaging segment is readjusted to a revised 9.9% CAGR for the next 7-year period. This segment currently accounts for a 40% share of the global Advanced Electronic Packaging market. The Advanced Electronic Packaging market in the U.S. is estimated at US$1.1 Billion in the year 2020. The country currently accounts for a 27.05% share in the global market. China, the world second largest economy, is forecast to reach an estimated market size of US$1.5 Billion in the year 2027 trailing a CAGR of 12% through 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 6.2% and 7.7% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 7% CAGR while Rest of European market (as defined in the study) will reach US$1.5 Billion by the year 2027.We bring years of research experience to this 15th edition of our report. The 179-page report presents concise insights into how the pandemic has impacted production and the buy side for 2020 and 2021. A short-term phased recovery by key geography is also addressed. Competitors identified in this market include, among others, Amkor Technology, Inc.; Analog Devices, Inc.; ASE Technology Holding, Co., Ltd.; Fujitsu Ltd.; Hitachi Ltd.; Ibiden Co., Ltd.; Infineon Technologies AG; Intel Corporation; Micron Technology, Inc.; Microsemi Corporation; Molex LLC; NXP Semiconductors NV; Orient Semiconductor Electronics Ltd.; Samsung Electronics Co., Ltd.; Semiconductor Manufacturing International Corporation (SMIC); Semtech Corporation; STATS ChipPAC Pte., Ltd.; Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC); Texas Instruments, Inc.; Thomas & Betts Corporation; Toshiba America Electronic Components, Inc.; TSI Group Ltd. |
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