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ADVANCED ELECTRONIC PACKAGING

Global Market Trajectory & Analytics

MCP-1203

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  •  DATE

    JULY 2020

  •  TABLES

    72

  •  PAGES

    179

  •  EDITION

    15

  •  PRICE

    USD $5600


COVID-19 IMPACT SURVEY
Amid the COVID-19 crisis, the global market for Advanced Electronic Packaging estimated at US$4 Billion in the year 2020, is projected to reach a revised size of US$7.3 Billion by 2027, growing at a CAGR of 9.1% over the period 2020-2027.Wafer-Level Chip-Scale Packaging, one of the segments analyzed in the report, is projected to grow at a 8.5% CAGR to reach US$4.2 Billion by the end of the analysis period. After an early analysis of the business implications of the pandemic and its induced economic crisis, growth in the Through Silicon via (Tsv) Packaging segment is readjusted to a revised 9.9% CAGR for the next 7-year period. This segment currently accounts for a 40% share of the global Advanced Electronic Packaging market.
The Advanced Electronic Packaging market in the U.S. is estimated at US$1.1 Billion in the year 2020. The country currently accounts for a 27.05% share in the global market. China, the world second largest economy, is forecast to reach an estimated market size of US$1.5 Billion in the year 2027 trailing a CAGR of 12% through 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 6.2% and 7.7% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 7% CAGR while Rest of European market (as defined in the study) will reach US$1.5 Billion by the year 2027.We bring years of research experience to this 15th edition of our report. The 179-page report presents concise insights into how the pandemic has impacted production and the buy side for 2020 and 2021. A short-term phased recovery by key geography is also addressed.
Competitors identified in this market include, among others, Amkor Technology, Inc.; Analog Devices, Inc.; ASE Technology Holding, Co., Ltd.; Fujitsu Ltd.; Hitachi Ltd.; Ibiden Co., Ltd.; Infineon Technologies AG; Intel Corporation; Micron Technology, Inc.; Microsemi Corporation; Molex LLC; NXP Semiconductors NV; Orient Semiconductor Electronics Ltd.; Samsung Electronics Co., Ltd.; Semiconductor Manufacturing International Corporation (SMIC); Semtech Corporation; STATS ChipPAC Pte., Ltd.; Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC); Texas Instruments, Inc.; Thomas & Betts Corporation; Toshiba America Electronic Components, Inc.; TSI Group Ltd.
» Technology [Wafer-Level Chip-Scale Packaging, and Through Silicon via (TSV) Packaging]
» World » United States » Canada » Japan » China » Europe » France » Germany » Italy » United Kingdom » Spain » Russia » and Rest of Europe » Asia-Pacific » Australia » India » South Korea » and Rest of Asia-Pacific » Latin America » Argentina » Brazil » Mexico » and Rest of Latin America » Middle East » Iran » Israel » Saudi Arabia » United Arab Emirates » and Rest of Middle East » and Africa

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