EXECUTIVE ENGAGEMENTS
POOL
4313
Number of executives repeatedly engaged by snail & email outreach
INTERACTIONS
776
Interactions with Platform & by Email
PARTICIPANTS
129
Unique # Participated
VALIDATIONS
37
Responses Validated*
COMPANIES
38
Responses Validated*
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DATE
APR 2021
TABLES
72
PAGES
140
EDITION
15
PRICE
USD 5600
CODE
MCP-1203
*Engagement stats are ongoing and dynamic
HIGHLIGHTS & REPORT INDEX
Amid the COVID-19 crisis, the global market for Advanced Electronic Packaging estimated at US$4 Billion in the year 2020, is projected to reach a revised size of US$7.3 Billion by 2027, growing at aCAGR of 9.1% over the period 2020-2027. Wafer-Level Chip-Scale Packaging, one of the segments analyzed in the report, is projected to record 8.5% CAGR and reach US$4.2 Billion by the end of the analysis period. After an early analysis of the business implications of the pandemic and its induced economic crisis, growth in the Through Silicon via (Tsv) Packaging segment is readjusted to a revised 9.9% CAGR for the next 7-year period.
The Advanced Electronic Packaging market in the U.S. is estimated at US$1.1 Billion in the year 2020. China, the world`s second largest economy, is forecast to reach a projected market size of US$1.5 Billion by the year 2027 trailing a CAGR of 12% over the analysis period 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 6.2% and 7.7% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 7% CAGR.
SELECT PLAYERS
Amkor Technology, Inc.; Analog Devices, Inc.; ASE Technology Holding, Co., Ltd.; Fujitsu Ltd.; Hitachi Ltd.; Ibiden Co., Ltd.; Infineon Technologies AG; Intel Corporation; Micron Technology, Inc.; Microsemi Corporation; Molex LLC; NXP Semiconductors NV; Orient Semiconductor Electronics Ltd.; Samsung Electronics Co., Ltd.; Semiconductor Manufacturing International Corporation (SMIC); Semtech Corporation; STATS ChipPAC Pte., Ltd.; Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC); Texas Instruments, Inc.; Thomas & Betts Corporation; Toshiba America Electronic Components, Inc.; TSI Group Ltd.
SEGMENTS
» Technology [Wafer-Level Chip-Scale Packaging, and Through Silicon via (TSV) Packaging]
GEOGRAPHIES
» World » United States » Canada » Japan » China » Europe » France » Germany » Italy » United Kingdom » Spain » Russia » and Rest of Europe » Asia-Pacific » Australia » India » South Korea » and Rest of Asia-Pacific » Latin America » Argentina » Brazil » Mexico » and Rest of Latin America » Middle East » Iran » Israel » Saudi Arabia » United Arab Emirates » and Rest of Middle East » and Africa
TABLE OF CONTENTS
| I. METHODOLOGY |
| II. EXECUTIVE SUMMARY |
| 1. MARKET OVERVIEW |
| Influencer Market Insights |
| World Market Trajectories |
| Impact of Covid-19 and a Looming Global Recession |
| 2. FOCUS ON SELECT PLAYERS |
| 3. MARKET TRENDS & DRIVERS |
| 4. GLOBAL MARKET PERSPECTIVE |
| World Current & Future Analysis for Advanced Electronic Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR |
| World 7-Year Perspective for Advanced Electronic Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets for Years 2020 & 2027 |
| World Current & Future Analysis for Wafer-Level Chip-Scale Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR |
| World 7-Year Perspective for Wafer-Level Chip-Scale Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2020 & 2027 |
| World Current & Future Analysis for Through Silicon via (Tsv) Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR |
| World 7-Year Perspective for Through Silicon via (Tsv) Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2020 & 2027 |
| III. MARKET ANALYSIS |
| UNITED STATES |
| USA Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| USA 7-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2020 & 2027 |
| CANADA |
| Canada Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Canada 7-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2020 & 2027 |
| JAPAN |
| Japan Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Japan 7-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2020 & 2027 |
| CHINA |
| China Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| China 7-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2020 & 2027 |
| EUROPE |
| Europe Current & Future Analysis for Advanced Electronic Packaging by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR |
| Europe 7-Year Perspective for Advanced Electronic Packaging by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets for Years 2020 & 2027 |
| Europe Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Europe 7-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2020 & 2027 |
| FRANCE |
| France Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| France 7-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2020 & 2027 |
| GERMANY |
| Germany Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Germany 7-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2020 & 2027 |
| ITALY |
| Italy Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Italy 7-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2020 & 2027 |
| UNITED KINGDOM |
| UK Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| UK 7-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2020 & 2027 |
| SPAIN |
| Spain Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Spain 7-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2020 & 2027 |
| RUSSIA |
| Russia Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Russia 7-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2020 & 2027 |
| REST OF EUROPE |
| Rest of Europe Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Rest of Europe 7-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2020 & 2027 |
| ASIA-PACIFIC |
| Asia-Pacific Current & Future Analysis for Advanced Electronic Packaging by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR |
| Asia-Pacific 7-Year Perspective for Advanced Electronic Packaging by Geographic Region - Percentage Breakdown of Value Sales for Australia, India, South Korea and Rest of Asia-Pacific Markets for Years 2020 & 2027 |
| Asia-Pacific Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Asia-Pacific 7-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2020 & 2027 |
| AUSTRALIA |
| Australia Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Australia 7-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2020 & 2027 |
| INDIA |
| India Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| India 7-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2020 & 2027 |
| SOUTH KOREA |
| South Korea Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| South Korea 7-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2020 & 2027 |
| REST OF ASIA-PACIFIC |
| Rest of Asia-Pacific Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Rest of Asia-Pacific 7-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2020 & 2027 |
| LATIN AMERICA |
| Latin America Current & Future Analysis for Advanced Electronic Packaging by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR |
| Latin America 7-Year Perspective for Advanced Electronic Packaging by Geographic Region - Percentage Breakdown of Value Sales for Argentina, Brazil, Mexico and Rest of Latin America Markets for Years 2020 & 2027 |
| Latin America Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Latin America 7-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2020 & 2027 |
| ARGENTINA |
| Argentina Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Argentina 7-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2020 & 2027 |
| BRAZIL |
| Brazil Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Brazil 7-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2020 & 2027 |
| MEXICO |
| Mexico Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Mexico 7-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2020 & 2027 |
| REST OF LATIN AMERICA |
| Rest of Latin America Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Rest of Latin America 7-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2020 & 2027 |
| MIDDLE EAST |
| Middle East Current & Future Analysis for Advanced Electronic Packaging by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR |
| Middle East 7-Year Perspective for Advanced Electronic Packaging by Geographic Region - Percentage Breakdown of Value Sales for Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets for Years 2020 & 2027 |
| Middle East Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Middle East 7-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2020 & 2027 |
| IRAN |
| Iran Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Iran 7-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2020 & 2027 |
| ISRAEL |
| Israel Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Israel 7-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2020 & 2027 |
| SAUDI ARABIA |
| Saudi Arabia Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Saudi Arabia 7-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2020 & 2027 |
| UNITED ARAB EMIRATES |
| UAE Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| UAE 7-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2020 & 2027 |
| REST OF MIDDLE EAST |
| Rest of Middle East Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Rest of Middle East 7-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2020 & 2027 |
| AFRICA |
| Africa Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR |
| Africa 7-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2020 & 2027 |
| IV. COMPETITION |
| Total Companies Profiled: 38 |
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