3D Semiconductor Packaging

Global Market Trajectory & Analytics

MCP10022

EXECUTIVE ENGAGEMENTS

POOL

373
Number of executives repeatedly engaged by snail & email outreach

INTERACTIONS

73
Interactions with Platform & by Email

PARTICIPANTS

13
Unique # Participated

VALIDATIONS

6
Responses Validated*

COMPANIES

44
Responses Validated*
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DATE

APR 2021

TABLES

82

PAGES

156

EDITION

9

PRICE

USD 4950

CODE

MCP10022


COMPETITIVE METRICS

COMPANY

D S N T

% *

Amkor Technology, Inc.

Hadean Supercomputing Limited

SEMES Co., Ltd.

Suss MicroTec AG

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HIGHLIGHTS & REPORT INDEX

Global 3D Semiconductor Packaging Market to Reach $14.4 Billion by 2026

Amid the COVID-19 crisis, the global market for 3D Semiconductor Packaging estimated at US$6.3 Billion in the year 2020, is projected to reach a revised size of US$14.4 Billion by 2026, growing at a CAGR of 14.7% over the analysis period. 3D package-on-package, one of the segments analyzed in the report, is projected to record a 14.4% CAGR and reach US$2.9 Billion by the end of the analysis period. After a thorough analysis of the business implications of the pandemic and its induced economic crisis, growth in the 3D wire-bonded segment is readjusted to a revised 16% CAGR for the next 7-year period.

The U.S. Market is Estimated at $1.9 Billion in 2021, While China is Forecast to Reach $2.5 Billion by 2026

The 3D Semiconductor Packaging market in the U.S. is estimated at US$1.9 Billion in the year 2021. China, the world`s second largest economy, is forecast to reach a projected market size of US$2.5 Billion by the year 2026 trailing a CAGR of 14.1% over the analysis period. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 12.9% and 12.6% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 10.8% CAGR.

3D Fan-out based Segment to Reach $2.2 Billion by 2026

In the global 3D Fan-out based segment, USA, Canada, Japan, China and Europe will drive the 14.7% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$690.3 Million in the year 2020 will reach a projected size of US$1.8 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$510.6 Million by the year 2026.

SELECT PLAYERS

Amkor Technology, Inc.; EV Group; Rudolph Technologies, Inc.; Semes Co., Ltd.; Suss MicroTec AG; Ulvac, Inc.

SEGMENTS

» End-Use (Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense, Other End-Uses) » Segment (3D package-on-package, 3D wire-bonded, 3D Fan-out based, 3D through-silicon-via, Other Segments)

GEOGRAPHIES

» World » United States » Canada » Japan » China » Europe » France » Germany » Italy » United Kingdom » and Rest of Europe » Asia-Pacific » Rest of World

TABLE OF CONTENTS

1. MARKET OVERVIEW
Influencer Market Insights
World Market Trajectories
Impact of Covid-19 and a Looming Global Recession
2. FOCUS ON SELECT PLAYERS
3. MARKET TRENDS & DRIVERS
4. GLOBAL MARKET PERSPECTIVE
World Current & Future Analysis for 3D Semiconductor Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World 7-Year Perspective for 3D Semiconductor Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2020 & 2027
World Current & Future Analysis for 3D package-on-package by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World 7-Year Perspective for 3D package-on-package by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2020 & 2027
World Current & Future Analysis for 3D wire-bonded by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World 7-Year Perspective for 3D wire-bonded by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2020 & 2027
World Current & Future Analysis for 3D fan-out based by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World 7-Year Perspective for 3D fan-out based by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2020 & 2027
World Current & Future Analysis for 3D through-silicon-via by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World 7-Year Perspective for 3D through-silicon-via by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2020 & 2027
World Current & Future Analysis for Other Segments by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World 7-Year Perspective for Other Segments by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2020 & 2027
World Current & Future Analysis for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World 7-Year Perspective for Industrial by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2020 & 2027
World Current & Future Analysis for Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World 7-Year Perspective for Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2020 & 2027
World Current & Future Analysis for Healthcare by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World 7-Year Perspective for Healthcare by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2020 & 2027
World Current & Future Analysis for IT & telecommunication by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World 7-Year Perspective for IT & telecommunication by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2020 & 2027
World Current & Future Analysis for Automotive & transport by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World 7-Year Perspective for Automotive & transport by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2020 & 2027
World Current & Future Analysis for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World 7-Year Perspective for Aerospace & Defense by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2020 & 2027
World Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World 7-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2020 & 2027
UNITED STATES
USA Current & Future Analysis for 3D Semiconductor Packaging by Segment - 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
USA 7-Year Perspective for 3D Semiconductor Packaging by Segment - Percentage Breakdown of Value Sales for 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments for the Years 2020 & 2027
USA Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
USA 7-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses for the Years 2020 & 2027
CANADA
Canada Current & Future Analysis for 3D Semiconductor Packaging by Segment - 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Canada 7-Year Perspective for 3D Semiconductor Packaging by Segment - Percentage Breakdown of Value Sales for 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments for the Years 2020 & 2027
Canada Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Canada 7-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses for the Years 2020 & 2027
JAPAN
Japan Current & Future Analysis for 3D Semiconductor Packaging by Segment - 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Japan 7-Year Perspective for 3D Semiconductor Packaging by Segment - Percentage Breakdown of Value Sales for 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments for the Years 2020 & 2027
Japan Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Japan 7-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses for the Years 2020 & 2027
CHINA
China Current & Future Analysis for 3D Semiconductor Packaging by Segment - 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
China 7-Year Perspective for 3D Semiconductor Packaging by Segment - Percentage Breakdown of Value Sales for 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments for the Years 2020 & 2027
China Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
China 7-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses for the Years 2020 & 2027
EUROPE
Europe Current & Future Analysis for 3D Semiconductor Packaging by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
Europe 7-Year Perspective for 3D Semiconductor Packaging by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2020 & 2027
Europe Current & Future Analysis for 3D Semiconductor Packaging by Segment - 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Europe 7-Year Perspective for 3D Semiconductor Packaging by Segment - Percentage Breakdown of Value Sales for 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments for the Years 2020 & 2027
Europe Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Europe 7-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses for the Years 2020 & 2027
FRANCE
France Current & Future Analysis for 3D Semiconductor Packaging by Segment - 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
France 7-Year Perspective for 3D Semiconductor Packaging by Segment - Percentage Breakdown of Value Sales for 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments for the Years 2020 & 2027
France Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
France 7-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses for the Years 2020 & 2027
GERMANY
Germany Current & Future Analysis for 3D Semiconductor Packaging by Segment - 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Germany 7-Year Perspective for 3D Semiconductor Packaging by Segment - Percentage Breakdown of Value Sales for 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments for the Years 2020 & 2027
Germany Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Germany 7-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses for the Years 2020 & 2027
ITALY
Italy Current & Future Analysis for 3D Semiconductor Packaging by Segment - 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Italy 7-Year Perspective for 3D Semiconductor Packaging by Segment - Percentage Breakdown of Value Sales for 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments for the Years 2020 & 2027
Italy Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Italy 7-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses for the Years 2020 & 2027
UNITED KINGDOM
UK Current & Future Analysis for 3D Semiconductor Packaging by Segment - 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
UK 7-Year Perspective for 3D Semiconductor Packaging by Segment - Percentage Breakdown of Value Sales for 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments for the Years 2020 & 2027
UK Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
UK 7-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses for the Years 2020 & 2027
REST OF EUROPE
Rest of Europe Current & Future Analysis for 3D Semiconductor Packaging by Segment - 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Rest of Europe 7-Year Perspective for 3D Semiconductor Packaging by Segment - Percentage Breakdown of Value Sales for 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments for the Years 2020 & 2027
Rest of Europe Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Rest of Europe 7-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses for the Years 2020 & 2027
ASIA-PACIFIC
Asia-Pacific Current & Future Analysis for 3D Semiconductor Packaging by Segment - 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Asia-Pacific 7-Year Perspective for 3D Semiconductor Packaging by Segment - Percentage Breakdown of Value Sales for 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments for the Years 2020 & 2027
Asia-Pacific Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Asia-Pacific 7-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses for the Years 2020 & 2027
REST OF WORLD
Rest of World Current & Future Analysis for 3D Semiconductor Packaging by Segment - 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Rest of World 7-Year Perspective for 3D Semiconductor Packaging by Segment - Percentage Breakdown of Value Sales for 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments for the Years 2020 & 2027
Rest of World Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Rest of World 7-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses for the Years 2020 & 2027
Total Companies Profiled: 44

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