3D IC and 2.5D IC Packaging

World Market Report

MCP21006

EXECUTIVE ENGAGEMENTS

POOL

879
Number of executives repeatedly engaged by snail & email outreach

INTERACTIONS

176
Interactions with Platform & by Email

PARTICIPANTS

33
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VALIDATIONS

12
Responses Validated*

COMPANIES

13
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DATE

OCT 2022

TABLES

22

PAGES

79

EDITION

5

PRICE

USD 5600

CODE

MCP21006


COMPETITIVE METRICS

COMPETITORS (ALPHABETICAL)

RANK

(S/A/N/T)

%

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HIGHLIGHTS & REPORT INDEX

What's New for 2022?

» Global competitiveness and key competitor percentage market shares
» Market presence across multiple geographies - Strong/Active/Niche/Trivial
» Online interactive peer-to-peer collaborative bespoke updates
» Access to our digital archives and MarketGlass Research Platform
» Complimentary updates for one year

Global 3D IC and 2.5D IC Packaging Market to Reach $5.7 Billion by 2027
In the changed post COVID-19 business landscape, the global market for 3D IC and 2.5D IC Packaging estimated at US$3.1 Billion in the year 2020, is projected to reach a revised size of US$5.7 Billion by 2027, growing at a CAGR of 9.2% over the analysis period 2020-2027. 3D Wafer-level Chip-Scale Packaging, one of the segments analyzed in the report, is projected to record a 9.1% CAGR and reach US$2.5 Billion by the end of the analysis period. Taking into account the ongoing post pandemic recovery, growth in the 3D TSV segment is readjusted to a revised 9.9% CAGR for the next 7-year period.

The U.S. Market is Estimated at $901 Million, While China is Forecast to Grow at 8.8% CAGR
The 3D IC and 2.5D IC Packaging market in the U.S. is estimated at US$901 Million in the year 2020. China, the world`s second largest economy, is forecast to reach a projected market size of US$997.7 Million by the year 2027 trailing a CAGR of 8.8% over the analysis period 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 8% and 7.7% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 6.6% CAGR.

2.5D Segment to Record 7.9% CAGR
In the global 2.5D segment, USA, Canada, Japan, China and Europe will drive the 7.9% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$462.1 Million in the year 2020 will reach a projected size of US$778.2 Million by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets.

SELECT PLAYERS

Amkor Technology: ASE Group; Broadcom Ltd.; Intel Corporation; Jiangsu Changjiang Electronics Technology Co., Ltd.; Samsung Electronics Co., Ltd.; Stmicroelectronics Nv; Taiwan Semiconductor Manufacturing Company Limited; Toshiba Corp.; United Microelectronics Corp.

SEGMENTS

» Packaging Technology (3D Wafer-level Chip-Scale Packaging, 3D TSV, 2.5D) » Application (Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, Other Applications) » End-Use (Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies, Other End-Uses)

GEOGRAPHIES

» World » United States » Canada » Japan » China » Europe » France » Germany » Italy » United Kingdom » and Rest of Europe » Asia-Pacific » Rest of World

TABLE OF CONTENTS

1. MARKET OVERVIEW
Impact of Covid-19 and a Looming Global Recession
Influencer Market Insights
World Market Trajectories
3D IC and 2.5D IC Packaging – Global Key Competitors Percentage Market Share in 2022 (E)
3D IC and 2.5D IC Packaging Competitor Market Share Scenario Worldwide (in %): 2018E
Competitive Market Presence - Strong/Active/Niche/Trivial for 13 Players Worldwide in 2022 (E)
2. FOCUS ON SELECT PLAYERS
3. MARKET TRENDS & DRIVERS
4. GLOBAL MARKET PERSPECTIVE
World 3D IC and 2.5D IC Packaging Market Analysis of Annual Sales in US$ Million for Years 2012 through 2027
World Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for 3D IC and 2.5D IC Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for 3D IC and 2.5D IC Packaging by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for 3D Wafer-level Chip-Scale Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for 3D Wafer-level Chip-Scale Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for 3D Wafer-level Chip-Scale Packaging by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for 3D TSV by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for 3D TSV by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for 3D TSV by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for 2.5D by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for 2.5D by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for 2.5D by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for Logic by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Logic by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Logic by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for Imaging & Optoelectronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Imaging & Optoelectronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Imaging & Optoelectronics by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for Memory by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Memory by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Memory by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for MEMS / Sensors by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for MEMS / Sensors by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for MEMS / Sensors by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for LED by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for LED by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for LED by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Other Applications by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for Telecommunication by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Telecommunication by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Telecommunication by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Industrial by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for Smart Technologies by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Smart Technologies by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Smart Technologies by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
UNITED STATES
Market Facts & Figures
US 3D IC and 2.5D IC Packaging Market Share (in %) by Company: 2018 & 2027
3D Wafer-level Chip-Scale Packaging (Packaging Technology) Market Share Analysis (in %) of Leading Players in the US for 2018 & 2027
3D TSV (Packaging Technology) Competitor Revenue Share (in %) in the US: 2018 & 2027
2.5D (Packaging Technology) Market Share Breakdown (in %) of Major Players in the US: 2018 & 2027
3D IC and 2.5D IC Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2022 (E)
USA Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
USA Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
USA 15-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2012, 2021 & 2027
USA Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
USA Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
USA 15-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications for the Years 2012, 2021 & 2027
USA Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
USA Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
USA 15-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2012, 2021 & 2027
CANADA
Canada Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Canada Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Canada 15-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2012, 2021 & 2027
Canada Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Canada Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Canada 15-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications for the Years 2012, 2021 & 2027
Canada Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Canada Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Canada 15-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2012, 2021 & 2027
JAPAN
3D IC and 2.5D IC Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2022 (E)
Japan Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Japan Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Japan 15-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2012, 2021 & 2027
Japan Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Japan Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Japan 15-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications for the Years 2012, 2021 & 2027
Japan Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Japan Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Japan 15-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2012, 2021 & 2027
CHINA
3D IC and 2.5D IC Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2022 (E)
China Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
China Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
China 15-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2012, 2021 & 2027
China Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
China Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
China 15-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications for the Years 2012, 2021 & 2027
China Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
China Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
China 15-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2012, 2021 & 2027
EUROPE
Market Facts & Figures
European 3D IC and 2.5D IC Packaging Market: Competitor Market Share Scenario (in %) for 2018 & 2027
3D Wafer-level Chip-Scale Packaging (Packaging Technology) Market Share (in %) by Company in Europe: 2018 & 2027
3D TSV (Packaging Technology) Market Share (in %) of Major Players in Europe: 2018 & 2027
2.5D (Packaging Technology) Competitor Market Share Analysis (in %) in Europe: 2018 & 2027
3D IC and 2.5D IC Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2022 (E)
Europe Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
Europe Historic Review for 3D IC and 2.5D IC Packaging by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Europe 15-Year Perspective for 3D IC and 2.5D IC Packaging by Geographic Region - Percentage Breakdown of Value Revenues for France, Germany, Italy, UK and Rest of Europe Markets for Years 2012, 2021 & 2027
Europe Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Europe Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Europe 15-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2012, 2021 & 2027
Europe Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Europe Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Europe 15-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications for the Years 2012, 2021 & 2027
Europe Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Europe Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Europe 15-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2012, 2021 & 2027
FRANCE
3D IC and 2.5D IC Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2022 (E)
France Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
France Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
France 15-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2012, 2021 & 2027
France Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
France Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
France 15-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications for the Years 2012, 2021 & 2027
France Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
France Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
France 15-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2012, 2021 & 2027
GERMANY
3D IC and 2.5D IC Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2022 (E)
Germany Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Germany Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Germany 15-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2012, 2021 & 2027
Germany Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Germany Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Germany 15-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications for the Years 2012, 2021 & 2027
Germany Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Germany Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Germany 15-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2012, 2021 & 2027
ITALY
Italy Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Italy Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Italy 15-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2012, 2021 & 2027
Italy Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Italy Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Italy 15-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications for the Years 2012, 2021 & 2027
Italy Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Italy Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Italy 15-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2012, 2021 & 2027
UNITED KINGDOM
3D IC and 2.5D IC Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2022 (E)
UK Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
UK Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
UK 15-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2012, 2021 & 2027
UK Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
UK Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
UK 15-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications for the Years 2012, 2021 & 2027
UK Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
UK Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
UK 15-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2012, 2021 & 2027
REST OF EUROPE
Rest of Europe Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Rest of Europe Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Rest of Europe 15-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2012, 2021 & 2027
Rest of Europe Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Rest of Europe Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Rest of Europe 15-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications for the Years 2012, 2021 & 2027
Rest of Europe Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Rest of Europe Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Rest of Europe 15-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2012, 2021 & 2027
ASIA-PACIFIC
3D IC and 2.5D IC Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2022 (E)
Asia-Pacific Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Asia-Pacific Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Asia-Pacific 15-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2012, 2021 & 2027
Asia-Pacific Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Asia-Pacific Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Asia-Pacific 15-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications for the Years 2012, 2021 & 2027
Asia-Pacific Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Asia-Pacific Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Asia-Pacific 15-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2012, 2021 & 2027
REST OF WORLD
Rest of World Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Rest of World Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Rest of World 15-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2012, 2021 & 2027
Rest of World Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Rest of World Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Rest of World 15-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications for the Years 2012, 2021 & 2027
Rest of World Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
Rest of World Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Rest of World 15-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2012, 2021 & 2027

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