3D IC and 2.5D IC Packaging

Global Market Trajectory & Analytics

MCP21006

EXECUTIVE ENGAGEMENTS

POOL

879
Number of executives repeatedly engaged by snail & email outreach

INTERACTIONS

176
Interactions with Platform & by Email

PARTICIPANTS

33
Unique # Participated

VALIDATIONS

12
Responses Validated*

COMPANIES

42
Responses Validated*
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DATE

APR 2021

TABLES

171

PAGES

243

EDITION

5

PRICE

USD 5600

CODE

MCP21006


COMPETITIVE METRICS

COMPANY

D S N T

% *

3M Company

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Amkor Technology, Inc.

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ASE Technology Holding Co., Ltd.

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BeSang, Inc.

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Broadcom Inc.

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IBM Corporation

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Intel Corporation

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Jiangsu Changjiang Electronics Technology Co., Ltd.

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MonolithIC 3D Inc.

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Samsung Group

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SUBMIT
* D = Dominant; S = Strong; N = Niche; T = Trivial
* Validated respondents are incentivized with cluster data
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VIEW ENTIRE POOL OF 42 COMPETITORS

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HIGHLIGHTS & REPORT INDEX

Amid the COVID-19 crisis, the global market for 3D IC and 2.5D IC Packaging estimated at US$86.3 Billion in the year 2020, is projected to reach a revised size of US$729 Billion by 2027, growing at a CAGR of 35.7% over the analysis period 2020-2027. 3D Wafer-level Chip-Scale Packaging, one of the segments analyzed in the report, is projected to record a 32.9% CAGR and reach US$278 Billion by the end of the analysis period. After an early analysis of the business implications of the pandemic and its induced economic crisis, growth in the 3D TSV segment is readjusted to a revised 40.3% CAGR for the next 7-year period.
The 3D IC and 2.5D IC Packaging market in the U.S. is estimated at US$26 Billion in the year 2020. China, the world`s second largest economy, is forecast to reach a projected market size of US$124.1 Billion by the year 2027 trailing a CAGR of 34.6% over the analysis period 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 32.6% and 30.6% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 25% CAGR.
In the global 2.5D segment, USA, Canada, Japan, China and Europe will drive the 30.8% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$12.8 Billion in the year 2020 will reach a projected size of US$83.6 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$89.1 Billion by the year 2027.

SELECT PLAYERS

Amkor Technology: ASE Group; Broadcom Ltd.; Intel Corporation; Jiangsu Changjiang Electronics Technology Co., Ltd.; Samsung Electronics Co., Ltd.; Stmicroelectronics Nv; Taiwan Semiconductor Manufacturing Company Limited; Toshiba Corp.; United Microelectronics Corp.

SEGMENTS

» Packaging Technology (3D Wafer-level Chip-Scale Packaging, 3D TSV, 2.5D) » Application (Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, Other Applications) » End-Use (Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies, Other End-Uses)

GEOGRAPHIES

» World » United States » Canada » Japan » China » Europe » France » Germany » Italy » United Kingdom » and Rest of Europe » Asia-Pacific » Rest of World

TABLE OF CONTENTS

1. MARKET OVERVIEW
Influencer Market Insights
World Market Trajectories
Impact of Covid-19 and a Looming Global Recession
2. FOCUS ON SELECT PLAYERS
3. MARKET TRENDS & DRIVERS
4. GLOBAL MARKET PERSPECTIVE
World Current & Future Analysis for 3D IC and 2.5D IC Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for 3D IC and 2.5D IC Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for 3D IC and 2.5D IC Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2012, 2020 & 2027
World Current & Future Analysis for 3D Wafer-level Chip-Scale Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for 3D Wafer-level Chip-Scale Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for 3D Wafer-level Chip-Scale Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
World Current & Future Analysis for 3D TSV by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for 3D TSV by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for 3D TSV by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
World Current & Future Analysis for 2.5D by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for 2.5D by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for 2.5D by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
World Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
World Current & Future Analysis for Telecommunication by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Telecommunication by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Telecommunication by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
World Current & Future Analysis for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Industrial by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
World Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
World Current & Future Analysis for Smart Technologies by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Smart Technologies by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Smart Technologies by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
World Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
World Current & Future Analysis for Logic by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Logic by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Logic by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
World Current & Future Analysis for Imaging & Optoelectronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Imaging & Optoelectronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Imaging & Optoelectronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
World Current & Future Analysis for Memory by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Memory by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Memory by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
World Current & Future Analysis for MEMS/Sensors by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for MEMS/Sensors by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for MEMS/Sensors by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
World Current & Future Analysis for LED by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for LED by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for LED by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
World Current & Future Analysis for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
World Historic Review for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
World 15-Year Perspective for Other Applications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
UNITED STATES
USA Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
USA Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
USA 15-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Sales for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2012, 2020 & 2027
USA Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
USA Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
USA 15-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2012, 2020 & 2027
USA Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
USA Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
USA 15-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Sales for Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED and Other Applications for the Years 2012, 2020 & 2027
CANADA
Canada Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Canada Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Canada 15-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Sales for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2012, 2020 & 2027
Canada Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Canada Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Canada 15-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2012, 2020 & 2027
Canada Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Canada Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Canada 15-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Sales for Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED and Other Applications for the Years 2012, 2020 & 2027
JAPAN
Japan Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Japan Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Japan 15-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Sales for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2012, 2020 & 2027
Japan Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Japan Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Japan 15-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2012, 2020 & 2027
Japan Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Japan Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Japan 15-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Sales for Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED and Other Applications for the Years 2012, 2020 & 2027
CHINA
China Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
China Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
China 15-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Sales for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2012, 2020 & 2027
China Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
China Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
China 15-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2012, 2020 & 2027
China Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
China Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
China 15-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Sales for Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED and Other Applications for the Years 2012, 2020 & 2027
EUROPE
Europe Current & Future Analysis for 3D IC and 2.5D IC Packaging by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
Europe Historic Review for 3D IC and 2.5D IC Packaging by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Europe 15-Year Perspective for 3D IC and 2.5D IC Packaging by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2012, 2020 & 2027
Europe Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Europe Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Europe 15-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Sales for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2012, 2020 & 2027
Europe Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Europe Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Europe 15-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2012, 2020 & 2027
Europe Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Europe Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Europe 15-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Sales for Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED and Other Applications for the Years 2012, 2020 & 2027
FRANCE
France Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
France Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
France 15-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Sales for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2012, 2020 & 2027
France Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
France Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
France 15-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2012, 2020 & 2027
France Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
France Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
France 15-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Sales for Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED and Other Applications for the Years 2012, 2020 & 2027
GERMANY
Germany Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Germany Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Germany 15-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Sales for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2012, 2020 & 2027
Germany Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Germany Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Germany 15-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2012, 2020 & 2027
Germany Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Germany Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Germany 15-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Sales for Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED and Other Applications for the Years 2012, 2020 & 2027
ITALY
Italy Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Italy Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Italy 15-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Sales for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2012, 2020 & 2027
Italy Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Italy Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Italy 15-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2012, 2020 & 2027
Italy Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Italy Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Italy 15-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Sales for Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED and Other Applications for the Years 2012, 2020 & 2027
UNITED KINGDOM
UK Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
UK Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
UK 15-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Sales for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2012, 2020 & 2027
UK Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
UK Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
UK 15-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2012, 2020 & 2027
UK Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
UK Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
UK 15-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Sales for Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED and Other Applications for the Years 2012, 2020 & 2027
REST OF EUROPE
Rest of Europe Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Rest of Europe Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Rest of Europe 15-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Sales for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2012, 2020 & 2027
Rest of Europe Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Rest of Europe Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Rest of Europe 15-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2012, 2020 & 2027
Rest of Europe Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Rest of Europe Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Rest of Europe 15-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Sales for Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED and Other Applications for the Years 2012, 2020 & 2027
ASIA-PACIFIC
Asia-Pacific Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Asia-Pacific Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Asia-Pacific 15-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Sales for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2012, 2020 & 2027
Asia-Pacific Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Asia-Pacific Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Asia-Pacific 15-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2012, 2020 & 2027
Asia-Pacific Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Asia-Pacific Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Asia-Pacific 15-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Sales for Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED and Other Applications for the Years 2012, 2020 & 2027
REST OF WORLD
Rest of World Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Rest of World Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Rest of World 15-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Sales for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2012, 2020 & 2027
Rest of World Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Rest of World Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Rest of World 15-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2012, 2020 & 2027
Rest of World Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
Rest of World Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
Rest of World 15-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Sales for Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED and Other Applications for the Years 2012, 2020 & 2027
Total Companies Profiled: 42

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