User: Guest

  



DOMAIN EXPERT ENGAGEMENTS

Number of executives repeatedly engaged by snail & email outreach*

POOL + OUTREACH

1695

Interactions with Platform & by Email *

INTERACTIONS

305

Unique # Participated *

PARTICIPANTS

68

Responses Validated *

VALIDATIONS

15

* Platform engagements are dynamic. Stats are published quarterly.


  •  CODE

  •  PAGES

  •  DATE

  •  PRICE

    $

  •  DATA EXHIBITS

    125


TABLE OF CONTENTS


   Pages :    | $

   Study Reliability and Reporting Limitations.....I-1  
   Disclaimers.....I-2  
   Data Interpretation & Reporting Level.....I-3
Quantitative Techniques & Analytics.....I-3
Product Definitions and Scope of Study.....I-3
  
   Metal Extruded Heat Sinks.....I-4
Stamped Heat Sinks.....I-4
Bonded or Fabricated Fin Heat sinks.....I-4
Folded fin Heat Sinks.....I-4
  
   Computers.....I-5
Telecommunication.....I-5
Medical.....I-5
Industrial Electronics.....I-5
Aerospace/Military.....I-5
  
   Consumer Electronics.....I-6
Automotive.....I-6
  
   Thermal Management – A Critical Function.....II-1
Global Thermal Management Solutions Market: An Overview.....II-1
1$100
   Heat Sinks - Market Outlook.....II-2
Heat Sinks Market Estimates and Forecasts by Region.....II-2
Heat Sinks Market Estimates and Forecasts by Product Segment.....II-2
Heat Sinks Market Estimates and Forecasts by End-use Segment.....II-2
1$100
   Technological Advancements Drive Growth in Heat sink Market.....II-3
PC Market Stimulates Growth.....II-3
Pricing Trends in the Heat sinks Market.....II-3
1$100
   Hybrid Technologies Gaining Popularity Over Traditional Heat Sinks.....II-4
Polymers: The Future in Heat Sink Technology.....II-4
Liquid Cooling: The Next Big Thing in Thermal Technology.....II-4
2$200
   New Aluminum Silicon Carbide (AlSiC) Heat Sinks.....II-6
Heat sink System for Circuit Boards.....II-6
Heat Sink BGA Package.....II-6
New Mounting Assembly for Heat Sink.....II-6
1$100
   Dual Material Heat Sinks.....II-7
New Heat Sink, Interfacing Multiple Components.....II-7
Heat Sinks with Fins.....II-7
New Fastening Structure Method For Heat Sinks.....II-7
1$100
   New Heat Sink Attached to the Module with Adhesive.....II-8
New Method to Set Up Posts on Heat Sinks.....II-8
New Heat Sink System for Circuit Boards Developed.....II-8
New Bi-level Heat Sinks.....II-8
1$100
   New Ceramic-based Heat Sink.....II-9
Heat Sink Attached to Two Separate PCBs.....II-9
New Heat Sink Bonds with Dielectric Material.....II-9
1$100
   Heat Sinks.....II-10
Composition and Structure of a Heat Sink:.....II-10
1$100
   Comparison between Aluminum and Copper by Physical Parameters – Thermal Conductivity,
  Cost, Weight, Production Method and Pressure on mounting devise.....II-11
Usage Criteria for a Heat sink.....II-11
1$100
   Necessity of a Heat Sink:.....II-12
Characteristics of an Ideal Heat Sink.....II-12
Measuring and Boosting the Thermal Performance of a Heat Sink.....II-12
1$100
   Classification of Heat Sinks.....II-13
Active Heat Sink.....II-13
Characteristics of an active Heat Sink.....II-13
1$100
   Passive Heat Sink.....II-14
Extruded Heat Sinks.....II-14
Stamped Heat sinks.....II-14
1$100
   Bonded or Fabricated Fins.....II-15
Folded Fins.....II-15
Castings.....II-15
Comparing Active and Passive Heat Sinks.....II-15
1$100
   Computers.....II-161$100
   Telecommunication.....II-17
Medical .....II-17
Industrial Electronics.....II-17
Aerospace/Military.....II-17
1$100
   Consumer Electronics.....II-18
Automotive.....II-18
1$100
   Hardware.....II-19
Heat Pipes.....II-19
Micro Channels.....II-19
Spray Cooling.....II-19
Electronic Cooling Fans.....II-19
1$100
   Metal Backplanes.....II-20
BGAs .....II-20
1$100
   Table 1: Leading Players in the Worldwide Thermal Management Hardware Market (2006 & 2007) - Percentage Share Breakdown by Value Sales for Aavid Thermalloy, Thermacore, Lytron, and Others (includes corresponding Graph/Chart).....II-21
Software.....II-21
Computational Methods of Heat Transfer (CHT) and Fluid Dynamics (CFD).....II-21
Electronic Design Automation (EDA) Software, Electronic Computer Aided Design (ECAD)
  Software, and Technology Computer Aided Design (TCAD) Software.....II-21
1$300
   Interfaces and Substrates.....II-22
Thermal Compounds and Thermal Interface Materials.....II-22
2$200
   Thermacore Awarded Research Contract by DARPA (US).....II-24
Celsia Technologies Inks Strategic Deal with Thermapower (Taiwan).....II-24
Modine to Shut Down Pemberville and Other Manufacturing Unit (USA).....II-24
1$100
   Modine Sells Thermacore (USA).....II-25
Furukawa America to Merge with Furukawa Electric (USA).....II-25
Alexandria Extrusion Takes Over M&M Metals (USA).....II-25
1$100
   Waytronx Takes Over CUI (USA).....II-26
Avnet Electronics Enters into Agreement with Nuventix (America).....II-26
Graphics Product and Celsia Form Partnership (US).....II-26
1$100
   Modine Sets up Production Unit (India).....II-27
Wakefield Acquires Simon Industries (NA).....II-27
Celsia Launches Next Generation NanoSpreader (USA).....II-27
1$100
   ATS Launched the New Star™ Series Heat Sinks (USA).....II-28
New Improved Heat Sinks from Hitachi (Japan).....II-28
Honeywell to Extend Its Research and Development Center (USA).....II-28
1$100
   Vette Corp. Forms Allies with Asia Aluminum (China).....II-29
OnScreen Inks a Licensing and Royalty Deal with Thermaltake Technologies
  (Taiwan).....II-29
ONSC Inks a Licensing Deal with CUI (US).....II-29
Modine to Construct Second Facility (Hungary).....II-29
1$100
   Onscreen Technologies Revamps Business Strategy (US).....II-30
Digi-Key Inks Global Distribution Agreement with ATS.....II-30
1$100
   Mouser Signs Distribution Agreement with Comair Rotron (US).....II-31
Laird Expands Distribution Agreement with Sager (US).....II-31
Denki Kagaku Plans Capacity Expansion for Ceramic Heat Sinks (Japan).....II-31
1$100
   Vette Corp Announces Production Expansion (North America).....II-32
ANSYS, Inc to acquire Aavid Thermal Technologies (US).....II-32
Celsia Technologies Enters Into a Collaboration Yeh- Chiang Technology
  (Taiwan).....II-32
1$100
   CPS Enters Into Partnership with Diamond Technologies (US).....II-33
Vette Takes Over ERM Thermal Technologies (USA).....II-33
Celsia Technologies Sign Strategic Contract with Kubo Kinzoku (Japan).....II-33
OnScreen™ Acquires Proprietary Rights for WayCool™ (US).....II-33
1$100
   iCurie Re-named as Celsia Technologies (US).....II-34
AET Receives Approval on HS-400 Heat Sink Design (US).....II-34
Thermal Solutions Acquires Woven Electronics (USA).....II-34
Laird Announces Acquisition of Supercool (Sweden).....II-34
1$100
   Intel Acquires 5% Stake in Neng Tyi (Taiwan).....II-35
Modine Acquires Radiadores (Brazil).....II-35
Celsia Unveils Web Portal.....II-35
AET’s eGRAF® HS-400 Heat Sinks to Feature in LS/X Supercomputer (USA).....II-35
1$100
   Vette Announces New BGA Thermal Solutions for Integrated Circuits (US).....II-36
Vette Acquires EUMAX (China).....II-36
Wakefield Extends Bonded Fin Heat Sink Line (US).....II-36
1$100
   Wakefield Expands DC/DC Converter Heat Sink Line (US).....II-37
1$100
   Thermalright Unveils T-RAD2 (US).....II-38
Alpha Launches FS/FSR Series Active Heat Sinks (Japan).....II-38
Alpha Unveils Heat Sinks with 3.45mm Attachment Holes (Japan).....II-38
Alpha Releases New Push Pin Tabs Integrated Heat Sinks (Japan).....II-38
1$100
   Alpha Launches Low Profile LPD Series Heat Sinks (Japan).....II-39
Alpha Unveils Heat Sinks with Incorporated Attachment Tabs (Japan).....II-39
Alpha Releases UB13070 Heat Sink (Japan).....II-39
Alpha Expands LPD Series Heat Sinks with LPD90 (Japan).....II-39
ASUS Expands Triton Family with New Triton 81 CPU Coolers (Taiwan).....II-39
1$100
   Vantec Unveils New AeroFlow FX Series CPU Coolers (US).....II-40
Thermalright Launches HR-09 Type 4 Mosfet Cooler (US).....II-40
Thermalright Rolls Out TRUE Copper (US).....II-40
Spire Announced Plans to Launch New Thermax Cooling Solutions (US).....II-40
1$100
   ATS Offers Two New Heat Sinks for BGA Packages (US).....II-41
ATS Launches ATS-552 Heat Sink Cooling Solution for Freescale Processors (US).....II-41
1$100
   ATS Offers New Heat Sink Cooling Solutions for Linear LED Lighting Products
  (US).....II-42
Ohmite Offers Heat Sinks to Combat Overtorque Issues (US).....II-42
ASUS Launches Silent Cooling Solutions (Taiwan).....II-42
Alpha Replaces SB Series Heat Sinks with LT Series Heat Sinks (Japan).....II-42
1$100
   Alpha Launches ST Series Heat Sinks (Japan).....II-43
Thermalright Launches HR-03 GT VGA Cooler (US).....II-43
Thermalright Announces Availability of HR-03 Plus VGA Cooler (US).....II-43
Thermalright Unveils HR-07 Duo Ram Cooler (US).....II-43
1$100
   Thermalright Launches HR-01 X CPU Cooler (US).....II-44
Thermalright Launches HR-11 Backside Cooler (US).....II-44
Thermalright Rolls Out IFX-14 CPU Cooler (US).....II-44
1$100
   Thermalright Unveils HR-09 Mosfet Cooler (US).....II-45
ATS Rolls out maxiFLOW Heat Sinks (US).....II-45
ATS’s maxiGRIP™ Clears Stringent Military Testing (US).....II-45
1$100
   ATS Offers Passive and Active Heat Sinks for Freescale’s Processors (US).....II-46
MEC International to Offer Heat sinks From Seifert (UK).....II-46
New Heatsink from Advanced Thermal for BGA Components (US).....II-46
Tyco Launches CardBus Connector Technology Integrated Heatsink (US).....II-46
1$100
   Schaffner Expands Product Line with Seifert Electronics Products (Switzerland).....II-47
ATS Unveils New Thermal Management Design Kit (US).....II-47
Andigilog® Unveils New Thermal Management System Controllers (US).....II-47
1$100
   THERMALTAKE Presents Two Turion CPU Coolers (US).....II-48
GlacialTech Rolls Out Igloo 7210 M CPU Coolers (US).....II-48
ATS Launches HFC-100™ Heat Flux Controller (US).....II-48
1$100
   ATS Offers Online Tutorials for Thermal Management (US).....II-49
Cooler Master Unveils New Hyper Z600 CPU Cooler (Taiwan).....II-49
Advanced Thermal Solutions (ATS) Launches New Three Devices (US).....II-49
1$100
   Emulation Technology Launches Heat Sinks with Elliptical Fin BGA Chipset (US).....II-501$100
   Advanced Thermal Solutions Launches blackDIAMOND Heat Sink (US).....II-51
1$100
   Aavid Thermalloy, LLC (USA).....II-52
Aerocool Advanced Technologies Corp. (Taiwan).....II-52
ADDA Corp. (Taiwan).....II-52
Advanced Thermal Solutions, Inc. (USA).....II-52
1$100
   Ajigo Corp. (USA).....II-53
Akasa Group (UK).....II-53
Alpha Company Ltd. (Japan).....II-53
1$100
   Asia Vital Components Co. Ltd. (Taiwan).....II-54
ASUSTeK Computer Inc. (Taiwan).....II-54
Chaun Choung Technology Corp. (Taiwan).....II-54
1$100
   Cooler Master Co. Ltd. (Taiwan).....II-55
Dynatron Corp. (USA).....II-55
Enertron Inc. (USA).....II-55
1$100
   GlacialTech, Inc. (Taiwan).....II-56
JMC Products, Inc. (USA).....II-56
Melcor Corp. (USA).....II-56
1$100
   Neng Tyi Co. Ltd (Taiwan).....II-57
Polo Tech Co. Ltd. (Taiwan).....II-57
Plansee SE (Austria).....II-57
1$100
   R-Theta Thermal Solutions, Inc. (Canada).....II-58
Radian Heat Sinks (US).....II-58
Sumitomo Electric Industries, Ltd. (Japan).....II-58
Swiftech (US).....II-58
1$100
   Taisol Electronics Co. Ltd. (China).....II-59
TennMax United (USA).....II-59
Thermal Integration Technology, Inc (Taiwan).....II-59
1$100
   Thermacore (USA).....II-60
Thermalright, Inc. (USA).....II-60
Thermaltake Technology Co., Ltd (Taiwan).....II-60
1$100
   Titan Computer Co. Ltd (Taiwan).....II-61
Verax Ventilatoren GmbH (Germany).....II-61
Vette Corp. (USA).....II-61
Wakefield Thermal Solutions, Inc. (US).....II-61
2$200
   Table 2: World Recent Past, Current & Future Analysis for Heat Sinks Market by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....II-631$300
   Table 3: World 10-year Perspective for Heat Sinks Market by Geographic Region – Percentage Share of Dollar Sales for North America, Japan, Europe, Asia-Pacific and Rest of World for 2006, 2009, and 2015 (includes corresponding Graph/Chart).....II-641$300
   Analysis by Product Segment.....II-65
Table 4: World Recent Past, Current & Future Analysis for Metal Extruded Heat Sinks Market by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....II-65
1$300
   Table 5: World 10-year Perspective for Metal Extruded Heat Sinks Market by Geographic Region – Percentage Share Breakdown of Dollar Sales for North America, Japan, Europe, Asia-Pacific and Rest of World for 2006, 2009, and 2015 (includes corresponding Graph/Chart).....II-661$300
   Table 6: World Recent Past, Current & Future Analysis for Stamped Heat Sinks Market by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....II-671$300
   Table 7: World 10-year Perspective for Stamped Heat Sinks Market by Geographic Region – Percentage Share Breakdown of Dollar Sales for North America, Japan, Europe, Asia-Pacific and Rest of World for 2006, 2009, and 2015 (includes corresponding Graph/Chart).....II-681$300
   Table 8: World Recent Past, Current & Future Analysis for Bonded Fins Heat Sinks Market by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....II-691$300
   Table 9: World 10-year Perspective for Bonded Fins Heat Sinks Market by Geographic Region – Percentage Share Breakdown of Dollar Sales for North America, Japan, Europe, Asia-Pacific and Rest of World for 2006, 2009, and 2015 2015 (includes corresponding Graph/Chart).....II-701$300
   Table 10: World Recent Past, Current & Future Analysis for Folded Fins Heat Sinks Market by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....II-711$300
   Table 11: World 10-year Perspective for Folded Fins Heat Sinks Market by Geographic Region – Percentage Share Breakdown of Dollar Sales for North America, Japan, Europe, Asia-Pacific and Rest of World for 2006, 2009, and 2015 2015 (includes corresponding Graph/Chart).....II-721$300
   Analysis By End-Use Market.....II-73
Table 12: World Recent Past, Current & Future Analysis for Heat Sinks in Computers Sector by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....II-73
1$300
   Table 13: World 10-year Perspective for Heat Sinks in Computers Sector by Geographic Region – Percentage Share of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets for 2006, 2009 & 2015 (includes corresponding Graph/Chart).....II-741$300
   Table 14: World Recent Past, Current & Future Analysis for Heat Sinks in Telecom Sector by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....II-751$300
   Table 15: World 10-year Perspective for Heat Sinks in Telecom Sector by Geographic Region – Percentage Share of Dollar Sales for US, Canada, Japan, Europe, Asia- Pacific and Rest of World Markets for 2006, 2009 & 2015 (includes corresponding Graph/Chart).....II-761$300
   Table 16: World Recent Past, Current & Future Analysis for Heat Sinks in Consumer Electronics Sector by Geographic Region – US, Canada, Japan, Europe, Asia- Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....II-771$300
   Table 17: World 10-year Perspective for Heat Sinks in Consumer Electronics Sector by Geographic Region – Percentage Share of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets for 2006, 2009 & 2015 (includes corresponding Graph/Chart).....II-781$300
   Table 18: World Recent Past, Current & Future Analysis for Heat Sinks in Medical Electronics and Office Equipment Sectors by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....II-791$300
   Table 19: World 10-year Perspective for Heat Sinks in Medical and Office Equipment Sectors by Geographic Region – Percentage Share of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets for 2006, 2009 & 2015 (includes corresponding Graph/Chart).....II-801$300
   Table 20: World Recent Past, Current & Future Analysis for Heat Sinks in Industrial and Military Sector by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....II-811$300
   Table 21: World 10-year Perspective for Heat Sinks in Industrial and Military Sector by Geographic Region – Percentage Share of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets for 2006, 2009 & 2015 (includes corresponding Graph/Chart).....II-821$300
   Table 22: World Recent Past, Current & Future Analysis for Heat Sinks in Automotive Sector by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....II-831$300
   Table 23: World 10-year Perspective for Heat Sinks in Automotive Sector by Geographic Region – Percentage Share of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets for 2006, 2009 & 2015 (includes corresponding Graph/Chart).....II-841$300
   A. Market Analysis.....III-1
Market Overview.....III-1
1$75
   Product Innovations.....III-22$150
   Product Launches/Developments.....III-410$575
   Strategic Corporate Developments.....III-1410$575
   Select Players.....III-24
Aavid Thermalloy, LLC (USA).....III-24
Advanced Thermal Solutions, Inc. (USA).....III-24
Ajigo Corp. (USA).....III-24
1$75
   CTS Corp. (USA).....III-25
Cool Innovations, Inc. (USA).....III-25
Dynatron Corp. (USA).....III-25
1$75
   Enertron, Inc. (USA).....III-26
JMC Products, Inc. (USA).....III-26
Melcor Corp. (USA).....III-26
Radian Heat sinks (US).....III-26
1$75
   Swiftech (US).....III-27
Tennmax United (USA).....III-27
Thermacore (USA).....III-27
1$75
   Thermalright, Inc. (USA).....III-28
United Thermal Engineering Corp. (USA).....III-28
1$75
   Vantec Thermal Technologies, Inc. (US).....III-29
Vette Corp. (USA).....III-29
Wakefield Thermal Solutions, Inc. (US).....III-29
1$75
   B. Market Analytics.....III-30
Table 24: US Recent Past, Current & Future Analysis for Heat Sinks Market by Product Segment – Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....III-30
1$150
   Table 25: US 10-year Perspective for Heat Sinks Market by Product Segment – Percentage Share Breakdown of Dollar Sales for Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks for 2006, 2009, and 2015 (includes corresponding Graph/Chart).....III-311$150
   Table 26: US Recent Past, Current & Future Analysis for Heat Sinks by End-Use Sector – Computers, Telecom, Consumer Electronics, Medical and Office Equipment, Industrial and Military, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....III-321$150
   Table 27: US 10-Year Perspective for Heat Sinks by End-Use Sector: Percentage Share Breakdown of Dollar Sales for Computers, Telecom, Consumer Electronics, Medical and Office Equipment, Industrial and Military and Automotive Markets for 2006, 2009 & 2015 (includes corresponding Graph/Chart).....III-33
1$150
   A. Market Analysis.....III-34
Current and Future Analysis.....III-34
Select Player.....III-34
1$75
   B. Market Analytics.....III-35
Table 28: Canadian Recent Past, Current & Future Analysis for Heat Sinks Market by Product Segment – Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....III-35
1$150
   Table 29: Canadian 10-year Perspective for Thermal Management Heat Sinks Market by Product Segment – Percentage Share Breakdown of Dollar Sales for Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks for 2006, 2009, and 2015 (includes corresponding Graph/Chart).....III-361$150
   Table 30: Canadian Recent Past, Current & Future Analysis for Heat Sinks by End-Use Sector – Computers, Telecom, Consumer Electronics, Medical/Office Equipment, Industrial and Military, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....III-371$150
   Table 31: Canadian 10-Year Perspective for Heat Sinks by End-Use Sector: Percentage Share Breakdown of Dollar Sales for Computers, Telecom, Consumer Electronics, Medical and Office Equipment, Industrial/ Military, and Automotive Markets for 2006, 2009 & 2015 (includes corresponding Graph/Chart).....III-38
1$150
   A. Market Analysis.....III-39
Current and Future Analysis.....III-39
Product Innovations.....III-39
2$150
   Strategic Corporate Developments.....III-411$75
   Select Players.....III-42
Alpha Company Ltd. (Japan).....III-42
1$75
   Sumitomo Electric Industries, Ltd. (Japan).....III-43
B. Market Analytics.....III-43
Table 32: Japanese Recent Past, Current & Future Analysis for Thermal Management Heat sinks Market by Product Segment – Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....III-43
1$150
   Table 33: Japanese 10-year Perspective for Heat Sinks Market by Product Segment – Percentage Share Breakdown of Dollar Sales for Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks for 2006, 2009, and 2015 (includes corresponding Graph/Chart).....III-441$150
   Table 34: Japanese Recent Past, Current & Future Analysis for Heat Sinks by End-Use Sector – Computers, Telecom, Consumer Electronics, Medical/Office Equipment, Industrial and Military, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....III-451$150
   Table 35: Japanese 10-Year Perspective for Heat Sinks by End-Use Segment – Percentage Share Breakdown of Dollar Sales for Computers, Telecom, Consumer Electronics, Medical and Office Equipment, Industrial and Military, and Automotive Markets for 2006, 2009 & 2015 (includes corresponding Graph/Chart).....III-46
1$150
   A. Market Analysis.....III-47
Current and Future Analysis.....III-47
Product Launches/Developments.....III-47
1$75
   Strategic Corporate Developments.....III-48
Select Players.....III-48
Akasa Group (UK).....III-48
1$75
   Plansee SE (Austria).....III-49
Verax Ventilatoren GmbH (Germany).....III-49
1$75
   B. Market Analytics.....III-50
Table 36: European Recent Past, Current & Future Analysis for Heat Sinks Market by Product Segment – Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....III-50
1$150
   Table 37: European 10-year Perspective for Heat Sinks Market by Product Segment – Percentage Share Breakdown of Dollar Sales for Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks for 2006, 2009, and 2015 (includes corresponding Graph/Chart).....III-511$150
   Table 38: European Recent Past, Current & Future Analysis for Heat Sinks by End-Use Sector – Computers, Telecom, Consumer Electronics, Medical/Office Equipment, Industrial and Military, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....III-521$150
   Table 39: European 10-Year Perspective for Heat Sinks by End-Use Sector: Percentage Share Breakdown of Dollar Sales for Computers, Telecom, Consumer Electronics, Medical and Office Equipment, Industrial/ Military, and Automotive Markets for 2006, 2009 & 2015 (includes corresponding Graph/Chart).....III-53
1$150
   A. Market Analysis.....III-54
Current and Future Analysis.....III-54
Mainland China Heat Sinks Market.....III-54
Taiwan Market Scenario.....III-54
1$75
   Product Innovations.....III-551$75
   Product Launches/Developments.....III-561$75
   Strategic Corporate Developments.....III-572$150
   Select Players.....III-59
Act-Rx Technology Corp. (Taiwan).....III-59
1$75
   Aerocool Advanced Technologies Corp. (Taiwan).....III-60
ADDA Corp. (Taiwan).....III-60
Arkua Technology Co., Ltd (Taiwan).....III-60
Asia Vital Components Co. Ltd. (Taiwan).....III-60
1$75
   ASUSTeK Computer, Inc. (Taiwan).....III-61
Chaun Choung Technology Corp. (Taiwan).....III-61
1$75
   Cooler Master Co. Ltd. (Taiwan).....III-62
EVERCOOL Thermal Co., Ltd. (Taiwan).....III-62
GlacialTech, Inc. (Taiwan).....III-62
Kuang Thousand Technology Co., Ltd. (Taiwan).....III-62
1$75
   Neng Tyi Co. Ltd (Taiwan).....III-63
Polo Tech Co. Ltd (Taiwan).....III-63
Taisol Electronics Co. Ltd. (China).....III-63
1$75
   Thermal Integration Technology, Inc (Taiwan).....III-64
Thermaltake Technology Co., Ltd (Taiwan).....III-64
Titan Computer Co. Ltd. (Taiwan).....III-64
1$75
   B. Market Analytics.....III-65
Table 40: Asia Pacific Recent Past, Current & Future Analysis for Heat Sinks Market by Product Segment – Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....III-65
1$150
   Table 41: Asia Pacific 10-year Perspective for Heat Sinks Market by Product Segment – Percentage Share Breakdown of Dollar Sales for Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks for 2006, 2009, and 2015 (includes corresponding Graph/Chart).....III-661$150
   Table 42: Asia Pacific Recent Past, Current & Future Analysis for Heat Sinks by End-Use Sector – Computers, Telecom, Consumer Electronics, Medical/Office Equipment, Industrial and Military, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....III-671$150
   Table 43: Asia Pacific 10-Year Perspective for Heat Sinks by End-Use Sector: Percentage Share Breakdown of Dollar Sales for Computers, Telecom, Consumer Electronics, Medical and Office Equipment, Industrial/ Military, and Automotive Markets for 2006, 2009 & 2015 (includes corresponding Graph/Chart).....III-68
1$150
   A. Market Analysis.....III-69
Current and Future Analysis.....III-69
Strategic Corporate Developments.....III-69
1$75
   B. Market Analytics.....III-70
Table 44: Rest of World Recent Past, Current & Future Analysis for Heat Sinks Market by Product Segment – Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....III-70
1$150
   Table 45: Rest of World 10-year Perspective for Heat Sinks Market by Product Segment – Percentage Share Breakdown of Dollar Sales for Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks for 2006, 2009, and 2015 (includes corresponding Graph/Chart).....III-711$150
   Table 46: Rest of World Recent Past, Current & Future Analysis for Heat Sinks by End-Use Sector – Computers, Telecom, Consumer Electronics, Medical/ Office Equipment, Industrial and Military, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....III-721$150
   Table 47: Rest of World 10-Year Perspective for Heat Sinks by End-Use Sector: Percentage Share Breakdown of Dollar Sales for Computers, Telecom, Consumer Electronics, Medical and Office Equipment, Industrial/ Military, and Automotive Markets for 2006, 2009 & 2015 (includes corresponding Graph/Chart).....III-731$150