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DOMAIN EXPERT ENGAGEMENTS

Number of executives repeatedly engaged by snail & email outreach*

POOL + OUTREACH

6126

Interactions with Platform & by Email *

INTERACTIONS

980

Unique # Participated *

PARTICIPANTS

184

Responses Validated *

VALIDATIONS

40

* Platform engagements are dynamic. Stats are published quarterly.


  •  CODE

  •  PAGES

  •  DATE

  •  PRICE

    $

  •  DATA EXHIBITS

    125


TABLE OF CONTENTS


   Pages :    | $

   Study Reliability and Reporting Limitations.....I-1  
   Disclaimers.....I-2
Data Interpretation & Reporting Level.....I-2
  
   Product Definitions and Scope of Study.....I-3  
   Introduction.....II-1
Moving Beyond Silicon.....II-1
1$100
   Outlook.....II-2
Table 1: World Recent Past, Current & Future Analysis for Strained Silicon - Independently Analyzed with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....II-2
1$350
   Understanding Semiconductors.....II-3
The Heart of Any Electronic Device.....II-3
Keeping Pace with Moore’s Law.....II-3
And Going Beyond .....II-3
1$100
   Key Factors Influencing the Market.....II-4
The Cyclical Growth Demand Within the Industry.....II-4
Industry Keeping Pace with Gordon Moore’s Predictions.....II-4
End-Market Demand Characteristics.....II-4
1$100
   Increasing Content Within the Semiconductor.....II-5
Environmental Factors.....II-5
Key Market Drivers.....II-5
Technology Migration: A Pre-requisite to Survive Competition.....II-5
New Materials hold the Key.....II-5
1$100
   Copper for Superior Electrical Conductivity.....II-6
Key Market Constraints.....II-6
Growing Payback Periods on Invested Capital: A Prime Concern.....II-6
Lack of Standards Acts Spoilsport.....II-6
1$100
   Need for Greater Collaboration Among the Players.....II-7
Technological Innovations.....II-7
The 32-nm Generation Processor is Here.....II-7
Target ‘22-nm Generation Microprocessors’, by 2011.....II-7
1$100
   UMC Announces the Validation of High-K/Metal- Gate Technology.....II-8
FEI Unveils the New TrueCrystal Package for Error-Free Strain Profiling.....II-8
The Revolutionary Smart Cut™ Layer Transfer Technology From SOITEC.....II-8
1$100
   Smart Cut™ in the Manufacturing of Strained Silicon on Insulator (sSOI).....II-9
NGS (Next-Generation Strain): A Technology Revolution By SiGen.....II-9
New Process for Epitaxial Germanium Growth on Silicon Oxide.....II-9
New Technique to Evaluate the Degree of Strain.....II-9
1$100
   Technological Barriers.....II-10
Faster Adaptation of holistic manufacturing practices: A Challenge.....II-10
Controlling Threading Dislocation: A Major Barrier.....II-10
1$100
   Future Directions: The Shape of Things to Come.....II-11
To Spearhead the Future Advances in Ultra High-Speed Computing.....II-11
Put a Firm Check on Investment Requirements.....II-11
Strained Silicon Technology To Spearhead the Future in High-Performance
  Devices.....II-11
1$100
   Project DECISIF.....II-12
Consolidation Gets Underway.....II-12
1$100
   Landmark Deals Announced or Completed by Companies Engaged in Strained Silicon and
  Semiconductor devices, During the Year 2007 & 2008.....II-13
Competition Scenario.....II-13
The Historical Intel-IBM Rivalry.....II-13
1$100
   Intel and AMD Battle it out in the 45-nm Processor Servers Market.....II-14
SiGen: The Leader in Silicon-on-Insulator (SOI) Technology.....II-14
1$100
   Strain Engineering: A Primer.....II-15
Uni-Axial Strain and Bi-Axial Strain.....II-15
Straining Methods.....II-15
1$100
   Strained Silicon Based Technologies.....II-16
Strained Silicon-Germanium (sSiGe).....II-16
1$100
   Hand in Hand with the Wireless Revolution.....II-17
Simplified Manufacturing Process.....II-17
Silicon on Insulator (SOI)/ Strained Silicon on Insulator (sSOI).....II-17
1$100
   Strained Silicon-on-Insulator (sSOI): The New Industry Benchmark.....II-18
SOI Technology Acts as a Complementary to Strained Silicon Technology.....II-18
1$100
   SOI Tests China Waters.....II-19
Fabricating Methods of Strained Silicon Transistors.....II-19
Strained Silicon Multi-layer Structures.....II-19
1$100
   Advantage of Strained Silicon Multi-layered structure Over Others.....II-201$100
   Maxim’s Single-Conversion Silicon Tuner Replaces Canned Tuner for Hybrid
  Applications.....II-21
IQE Expands Manufacturing Processes Portfolio.....II-21
1$100
   International Rectifier Launches DirectFET® MOSFET Chipset.....II-22
Jazz Semiconductor Introduces SiGe BiCMOS Tech for Next-Generation Green Analog
  ICs.....II-22
1$100
   AWR and austriamicrosystems Launch Process Design Kit for SiGe BiCMOS Process
  Technology.....II-23
StrataLight Develops Silicon Germanium (SiGe) Chipset for 100GbE Transponders.....II-23
Tokyo Instruments Develops Basic Technology for Non-Destructive Strain-Measuring
  Instrument.....II-23
1$100
   Silicon Genesis Unveils the First 20 ?m Solar Cell Foils.....II-24
Silicon Genesis Unveils the New PolyMax™ Process Technology.....II-24
Fujitsu Unveils New Power-Saving CMOS Technology.....II-24
UMC Announces the Launch of 65nm Customer Silicon, Using the Proprietary URAM
  Technology.....II-24
1$100
   Renesas Launches New Affordable Fabrication Technology.....II-25
Renesas Unveils New Technology for SRAM Implementation in 45nm Generation
  Devices.....II-25
Epson Commences Large-Scale Production of 0.7inch Full HD HTPS Panels.....II-25
1$100
   Intel and UC Santa Barbara Develops the First Hybrid Silicon Laser.....II-26
Maxim Integrated Products Launches DS1091L Silicon EconOscillator™.....II-26
Oki Electric Creates Extremely Low Cost- Effective µBOSA Chips for FTTH
  Modules.....II-26
1$100
   Texas Instruments Launches SiGe Process Based Op-Amps.....II-27
Sony, Toshiba and NEC Electronics Releases High Performance System LSI.....II-27
Epson and JSR Pioneers Micro-Liquid Processes.....II-27
1$100
   SiGen Presents Single Crystal Silicon Film Transfer on Substrate.....II-281$100
   Silicon Genesis Enters into Agreement with REC.....II-29
Silicon Genesis and NorSun Enter into Agreement.....II-29
1$100
   Soitec Inaugurates New Fab Facility in Singapore.....II-30
AMCC Enters into Strategic Alliance with Silicon Image.....II-30
CopperGate Communication Acquires the HomePlug AV Business from Conexant.....II-30
1$100
   AMG Invest Acquires Stakes in Graphit Kropfmühl.....II-31
Globe Specialty Metals Acquires Stakes in Solsil.....II-31
Intrinsiq Materials Takes Over pSiNutria from pSiVida.....II-31
Permatex Acquires Anaerobicos.....II-31
AmberWave Acquires Aonex Technologies.....II-31
1$100
   IBM Adopts the QuickCap NX Parasitic Extraction Software from Magma.....II-32
IMEC Selects SOI MEMS Technology From Tronics Microsytems.....II-32
1$100
   Silex System to Acquire Minority Stake in Translucent Photonics.....II-33
LSI Corp Takes Over Tarari.....II-33
E-Ton Solar Tech Takes Over ADEMA Technologies.....II-33
Gintech and MEMC Completes Agreement for Solar Wafer Supply.....II-33
1$100
   MEMC, Suntech Signs Letter of Intent for Solar Wafer Supply.....II-34
AmberWave Signs License Agreement with LG Siltron on Strained Silicon IP.....II-34
ARM Acquires Soisic.....II-34
Sumco to Takeover KEM.....II-34
Samsung and Siltronic to Construct New Fab Facility.....II-34
1$100
   ARM Collaborates with Soitec (France).....II-351$100
   Advanced Micro Devices, Inc. (USA).....II-36
Applied Materials, Inc. (USA).....II-36
ASM International NV (Netherlands).....II-36
1$100
   Atmel Corporation (USA).....II-37
AmberWave Systems Corporation (USA).....II-37
1$100
   Canon, Inc. (Japan).....II-38
CEVA, Inc. (USA).....II-38
Chartered Semiconductor Manufacturing Ltd (Singapore).....II-38
Honeywell International, Inc. (USA).....II-38
1$100
   International Business Machines Corp. (USA).....II-39
Isonics Corporation (USA).....II-39
Infineon Technologies, AG (Germany).....II-39
1$100
   Intel Corp. (USA).....II-40
International Rectifier Corp. (USA).....II-40
1$100
   KLA Tencor Corporation (USA).....II-41
Maxim Integrated Products, Inc. (USA).....II-41
1$100
   MEMC Electronic Materials, Inc. (USA).....II-42
Micron Technology Inc. (USA).....II-42
Mitsubishi Materials Corporation. (Japan).....II-42
1$100
   NEC Electronics Corporation (Japan).....II-43
Oki Semiconductor Company Co. Ltd. (Japan).....II-43
1$100
   Peregrine Semiconductor Corp. (USA).....II-44
Renesas Technology Corporation (Japan).....II-44
Sandia National Laboratories (USA).....II-44
Soitec S. A. (France).....II-44
1$100
   STMicroelectronics N.V. (Switzerland).....II-45
Shanghai Simgui Technology Co., Ltd (China).....II-45
Shin-Etsu Handotai Co., Ltd (Japan).....II-45
Silicon Genesis Corporation (USA).....II-45
1$100
   Siltronic AG (Germany).....II-46
Texas Instruments Incorporated (USA).....II-46
Toshiba Corporation (Japan).....II-46
1$100
   Taiwan Semiconductor Manufacturing Company Limited (Taiwan).....II-47
United Microelectronic Corporation (Taiwan).....II-47
Vitesse Semiconductor Corporation (USA).....II-47
1$100
    
 
 


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