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DOMAIN EXPERT ENGAGEMENTS

Number of executives repeatedly engaged by snail & email outreach*

POOL + OUTREACH

1930

Interactions with Platform & by Email *

INTERACTIONS

347

Unique # Participated *

PARTICIPANTS

77

Responses Validated *

VALIDATIONS

17

* Platform engagements are dynamic. Stats are published quarterly.


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    $

  •  DATA EXHIBITS

    125


TABLE OF CONTENTS


   Pages :    | $

   Table 1: World Market for Semiconductor Processing Equipment (2000-2010): Geographic Regions Ranked by Growth- Asia-Pacific, Rest of World, Canada, US, Japan, and Europe (includes corresponding Graph/Chart).....II-11$400
   Table 2: World Market for Semiconductor Processing Equipment (2000-2010): Product Segments Ranked by Growth - CMP Equipment, Test and Metrology Equipment, Packaging Equipment, Epitaxy Equipment, Furnace and RTP, Dielectric CVD Equipment, Lithography Equipment, Ion Implant Equipment, Wafer Deposition Equipment, Others, and Etch Equipment (includes corresponding Graph/Chart).....II-2
1$400
   Historical Perspective.....II-31$100
   Worldwide Semiconductor Market – An Overview.....II-4
Factors Influencing the Market.....II-4
Semiconductor Growth Declines Due to US Economic Slowdown.....II-4
Semiconductor Industry Benefits from Growth in Telecommunications.....II-4
1$100
   Outlook for Semiconductor Market.....II-5
1$100
   Market Snapshots.....II-6
Moving to 300 Millimeter Wafer Equipment.....II-6
2001 – A Year of Mixed Fortunes .....II-6
1$100
   Competitive Landscape.....II-7
Table 3: Leading Players in the Worldwide Semiconductor Equipment Manufacturing Market (2003 & 2004): Annual Sales in US$ Thousand for Applied Materials, Tokyo Electron Ltd., Nikon Corporation, KLA-Tencor, ASML, Dainippon Screen Mfg., Novellus Systems, Hitachi High-Tech., and Advantest (includes corresponding Graph/Chart).....II-7
1$400
   Table 4: Leading Players in the Worldwide Etch Market (2003 & 2004): Percentage Breakdown of Value Sales for Lam Research, Tokyo Electron, Applied Materials, Hitachi and Others (includes corresponding Graph/Chart).....II-8

Table 5: Leading Players in the Worldwide Chemical Mechanical Planarization (CMP) Market (2003 & 2004): Percentage Breakdown of Value Sales for Applied Materials, Ebara Corp, Novellus Systems and Others (includes corresponding Graph/Chart).....II-8
1$400
   Table 6: Leading Players in the Worldwide Plasma Deposition Market (2003 & 2004): Percentage Breakdown of Value Sales for Applied Materials, Novellus Systems and Others (includes corresponding Graph/Chart).....II-9
Convergence of Four Major Wafer-Processing Technology Transitions.....II-9
Table 7: Growth of the Four Transitions Over the Next Few Years (includes corresponding Graph/Chart).....II-9
1$400
   Table 8: Worldwide Leading Suppliers of Wafer Processing Equipment (2003-2004) – Market Shares for Varian Semiconductor Equipment, Axcelis Technologies, Inc, ASML, Dainippon Screen Mfg. Co., Ltd, Tokyo Electron Limited, Novellus Systems, Inc, ASM International, Canon Inc, Nikon Corp, Applied Materials and Others (includes corresponding Graph/Chart).....II-10
Industry Structure of Semiconductor Equipment.....II-10
1$400
   Wafer Cleaning: A Significant Manufacturing Process.....II-111$100
   New Challenges for Wafer Cleaning.....II-12
Processing Steps: FEOL and BEOL.....II-12
FEOL to the Rescue.....II-12
3$150
   Semiconductor Processing Equipment.....II-15
Chemical Mechanical Planarization (CMP) Equipment.....II-15
Other Planarization Techniques.....II-15
1$100
   CMP Vs. Conventional Techniques.....II-16
Damascene CMP.....II-16
1$100
   Dielectric CVD Equipment.....II-17
Epitaxy Equipment.....II-17
Etch Equipment.....II-17
Fundamentals of Etching.....II-17
1$100
   Ion Beam Etch Equipment.....II-181$100
   Rapid Thermal Processing (RTP) Equipment.....II-19
Ion Implant Equipment.....II-19
1$100
   High Current Implantation.....II-20
Lithography Equipment .....II-20
1$100
   Lithography Technology.....II-21
Lithography Process Equipment.....II-21
1$100
   SCALPEL Lithography Equipment.....II-22
Wafer Deposition Equipment.....II-22
Semiconductor Packaging Equipment.....II-22
1$400
   Table 9: Leading Vendors for Semiconductor Packaging/Assembly Equipment (2000-2001) – Market Shares for Kulicke & Soffa, Tokyo Seimitsu, ASM Pacific, Advantest, Tokyo Electron Limited, Shinkawa, BE Semiconductor, Fico, ESEC, Delta D esign, Dai-Ichi Seiko, and Others (includes corresponding Graph/Chart).....II-231$400
   Test and Metrology Equipment.....II-24
Others .....II-24
1$100
   Semiconductor Equipment and Materials International (SEMI).....II-25
Growth Prospects from MEMS Fabrication Sector.....II-25
2$200
   MKS Instruments Develops LIQUOZON® Smart Ozonated Water Delivery System.....II-27
Stratus Vertical Wafer Electro-Deposition System.....II-27
WS-600 - Single Wafer Spin Processing Equipment .....II-27
Ingenio – An Advanced Process Control (APC) System .....II-27
1$100
   TEL and Clariant Develop Surfactant Rinse Solutions .....II-28
SUSS Unveils Nano PREP Technology .....II-28
Roll-to-Roll Manufacturing (R2R) – A Continuous Production Process.....II-28
Ultra Stress Free Copper Polishing Technology.....II-28
1$100
   Varian Semiconductor Releases VIISta HC Ion Implanter.....II-29
Varan Semiconductor Unleashes VIISta 810XE Ion Implanter.....II-29
Applied Materials Introduces New SEMVision™ G2 Family.....II-29
1$100
   SUSS MicroTec AG Unveils SUSS PM8WLR ProbeShield System.....II-30
Advantest Launches New T5501 Memory Test System.....II-30
Advantest Introduces New T6372 LCD Driver Test System.....II-30
Advantest Unveils Advanced Mixed-Signal Test System T7722.....II-30
Advantest Launches Memory Test System T5377S.....II-30
1$100
   Applied Materials Unveils Applied Endura® CuBS II.....II-31
Applied Materials Introduces Quantum™ X ion implanter.....II-31
MKS Unleashes RGAs of IP Series.....II-31
KLA-Tencor Launches the eS31.....II-31
KLA-Tencor Unveils SpectraCD™100.....II-31
1$100
   Wafer Level Test Solution from Advantest and SUSS MicroTec .....II-32
ESI Launches Model 9830 Laser Semiconductor Processing System.....II-32
Unaxis Semiconductors Rolls Out MASK ETCHER IV.....II-32
SUSS Introduces New Wafer Level LED Test System.....II-32
Varian Releases Three New Ion Implanters.....II-32
1$100
   Nanometrics Offers OCD Metrology Capability on Nanometrics 9300 Advanced Metrology
  System.....II-33
Wafer-Processing Components and Equipment from Secure & Pure.....II-33
SUSS Unveils New Bonding System.....II-33
1$100
   Next-Generation 300mm Process Etching Chamber from TEL.....II-34
New 300mm Wafer Prober from TEL.....II-34
TEL and IBM Jointly Develop TERA.....II-34
1$100
   TEL and Teseda Introduce DFT System.....II-35
New Products for Advanced Packaging Metrology from Foothill.....II-35
Applied Epi Announces Introduction of 2G Molecular Beam Epitaxy Tools.....II-35
1$100
   New Orion Family of CVD from Trikon.....II-36
Nanometrics Introduces an Automated Film Metrology System.....II-36
1$100
   Nanometrics Launches NanoUDI™ Technology.....II-37
Trikon Launches Delta fxP™.....II-37
Trikon Widens Plasma Etch Kitty with Two New Products.....II-37
1$100
   Thomas West Unveils New Generation CMP Pads.....II-38
SpeedFam-IPEC Introduces New Rotational CMP System.....II-38
1$100
   SpeedFam-IPEC Releases New Universal CMP System.....II-39
New Lithography Systems from Silicon Valley Group.....II-39
1$100
   Trikon Unveils New Electrostatic Chuck.....II-40
1$100
   MKS Instruments to Acquire Ion Systems.....II-41
Applied Materials Acquires IP and Technology of SCP Global.....II-41
ASM International Join Hands with IMEC.....II-41
ASM Pacific in Alliance with Microbonds.....II-41
Genus Merges with AIXTRON.....II-41
1$100
   Trikon to Merge with Aviza Technology.....II-42
Genus Merges with AIXTRON ADS.....II-42
Aviza Technology and Trikon Technologies Enter into Merger Agreement.....II-42
WaferMasters Inc. Acquires the Intellectual Property Rights to SRTF
  Technology.....II-42
Applied Materials Collaborates with IMEC .....II-42
1$100
   ASM Inks a Licensing Agreement with Veeco.....II-43
ASML Signs a Licensing Agreement with Toshiba.....II-43
ESI Selects KVD.....II-43
Applied Materials Acquires Treatment Systems Business of ATMI.....II-43
Applied Material Takes Over Metron Technology.....II-43
1$100
   ASM International Completes Synergistic Purchase of NuTool, Inc......II-44
ASM International Acquires Ginitech, Ltd......II-44
Novellus Takes Over Angstron Systems, Inc......II-44
Mattson Technology, Inc. Snaps Up Vortek Industries, Ltd......II-44
1$100
   MKS Forms a Strategic Alliance with Umetrics.....II-45
Mattson Alliances with TEL.....II-45
Applied Materials Collaborates with DuPont Photomasks.....II-45
IMEC Collaborates with ASML.....II-45
IBM Enters into an Agreement with SUSS.....II-45
1$100
   Varian Semiconductor Inks an Agreement with ISE.....II-46
Cadence Enters into a Licensing Agreement with ASML.....II-46
SUSS MicroTec Inks Agreement with Unitive.....II-46
ASM International Plans to Establish Wafer Processing Equipment Plant in
  Singapore.....II-46
Lam Research Stops CMP Systems Development.....II-46
1$100
   SensoNor Awards Contract to SUSS MicroTec.....II-47
Adventest Sets Up New Company, Adventest (Thailand) Ltd.....II-47
Applied Materials Bags Order from UMCi.....II-47
Mattson Strikes Additional Orders from Samsung.....II-47
UMCi Selects Varian Semiconductor as High Current Ion Implant Supplier.....II-47
1$100
   ITRI Opts New SUSS NPS 200.....II-48
Tegal Delivers 6510 Series Critical Silicon Etch System.....II-48
Varian Ships VIISta™ 80HP to a Major Taiwanese 300mm Fab.....II-48
Oxford Instruments Analytical Acquires Assets of Thermo VG Semicon.....II-48
TEL forms Strategic Alliance with ASML.....II-48
1$100
   Tegal Concludes Purchase Agreement with Simplus Systems.....II-49
Fairchild Semiconductor Inks Agreements with Lite- On Technology.....II-49
Oregon Micro Systems Signs a Supply Agreement.....II-49
Dainippon Screen Enters into an Agreement with ASML Holding.....II-49
TEL and Nikon Sign Agreement.....II-49
1$100
   Adept Technology Receives Wafer Handling Contract from MSP Corporation.....II-50
SUSS Bags Lithography/Bonding Package Order from microFAB Bremen.....II-50
Mattson Wins Orders from a Major Taiwanese Foundry.....II-50
Mattson Receives Additional Orders for Strip Systems.....II-50
1$100
   International Sematech Assigns Order for RTP System.....II-51
Varian Strikes Multiple Orders from Samsung.....II-51
Axcelis Technologies Bags $18 million Contract from Inotera Memories.....II-51
Mattson Wins Follow-on Orders for Strip Systems from Tower Semiconductor.....II-51
Varian Obtains Ion Implant Order.....II-51
Mattson Strikes Multi-Million Dollar Orders from a Leading European Chipmaker.....II-51
1$100
   Varian Receives High and Medium Current Ion Implanter Orders.....II-52
Electro Scientific Industries Wins Order from a Major Taiwanese 300mm DRAM
  manufacturer.....II-52
Genus Gains Purchase Order from a Major US Data Storage Manufacturer.....II-52
Mattson Receives Multi-Million Order for Strip Systems.....II-52
Varian Bags Orders from Seven Asian Customers.....II-52
1$100
   Implant Sciences Enhances Semiconductor Processing Business to Foray into Chip
  Production Market.....II-53
TEL Cuts Workforce.....II-53
Swagelok Restructures Sales and Service Division.....II-53
Varian Offers Productivity Plus Upgrade.....II-53
TEL Consolidates Service and Support Divisions.....II-53
Tegal Widens Patent Portfolio.....II-53
1$100
   TEL Dissolves Consolidated Subsidiary.....II-54
Tegal Sells EndeavorEUV™ PVD Cluster Tool.....II-54
Varian Ships High-Energy and Medium Current Systems to ASMC.....II-54
Tegal Sells Endeavor PVD Cluster Tool.....II-54
SUSS MicroTec Completes Installation of Wafer Bonder.....II-54
1$100
   SECAP Completes Installation of 300 mm Electroplated Wafer Bumping Line.....II-55
Mattson Installs RTP Systems at Elpida Memory’s 300 mm Fab.....II-55
ASE Commences Installation of SUSS Multiple 300 mm Lithography Systems.....II-55
IMEC Installs New SUSS PAV150 System.....II-55
AmberWave Signs a Licensing and Development Agreement with Aixtron.....II-55
1$100
   Mattson Technology Signs an Agreement with Metron.....II-56
Lam Research Signs Multi-Million Contract with SMIC.....II-56
SpeedFam-IPEC Receives Order for its 300-mm CMP Tool.....II-56
SpeedFam Receives Order for 200-mm Momentum™ System .....II-56
1$100
   ESI Obtains Order for Laser Processing Equipment from GTC.....II-57
MKS Bags RGA Purchase Order from Dominion.....II-57
1$100
   Therma-Wave Establishes a New Sales and Service Office in China.....II-58
Sela Installs MC600 MicroCleaving System at Hitachi.....II-58
Nanometrics Releases New Version of its NanoNet Technology.....II-58
1$100
   PRI Acquires WaferState Controls, Inc .....II-59
TEL Acquires Timbre technologies.....II-59
Isonics Acquires Silicon-On-Insulator Wafer Business of SEI.....II-59
1$100
   CFM Merges with Mattson Technology.....II-60
Trikon Inks Commercial Supply Agreements with ASM.....II-60
Nanometrics Receives a Patent for Integrated Metrology.....II-60
1$100
   Tegal Bags Follow-On Order from GCT.....II-61
Inficon Supplies FabGuard Sensor Integration and Analysis System to Sematech.....II-61
ESI Gains Order for Model 9350 from Dominion.....II-61
1$100
   Mattson Receives Multi-Million Orders from European Semiconductor
  Manufacturer.....II-62
Applied Materials Establishes a New Facility and Training Center in Shanghai.....II-62
Tru-Si Gains an Order for its ADP Chemical Dry Etch Equipment.....II-62
1$100
   Trikon Bags a New Order from COM DEV for Etch Equipment.....II-63
Veeco Forms Strategic Alliance with Seagate II-63 CVC Merges with Veeco.....II-63
1$100
   Knights Technology Enters Distribution Agreement with SingaTrust.....II-64
Lam Grabs a US$33 Million Contract from SSMC.....II-64
SpeedFam Bags Multiple System Order.....II-64
Trikon Attains PVD and Etch Equipment Orders from TriQuint.....II-64
1$100
   Varian Expands Manufacturing Capacity at its UK- Based Plant.....II-65
SpeedFam-IPEC Expands its Manufacturing Facility in Arizona.....II-65
1$100
   Advantest (Japan) .....II-66
Applied Materials, Inc. (USA).....II-66
ASM International N.V. (The Netherlands).....II-66
1$100
   ASM Pacific Technology Ltd (China) .....II-67
ASML Holding NV (The Netherlands).....II-67
Canon Inc. (Japan).....II-67
Dainippon Screen Mfg.(Japan).....II-67
1$100
   Electro Scientific Industries Inc (USA).....II-68
Genus, Inc (USA).....II-68
Hitachi High-Technologies Corporation (Japan).....II-68
KLA-Tencor Corporation (USA) .....II-68
1$100
   Lam Research Corporation (USA).....II-69
Mattson Technology, Inc (USA).....II-69
MKS Instruments, Inc. (USA) .....II-69
Nikon Corporation (Japan).....II-69
1$100
   Novellus Systems, Inc. (USA) .....II-70
STMicroelectronics (Switzerland).....II-70
SUSS MicroTec AG (Germany).....II-70
Tegal Corporation (USA).....II-70
Tokyo Electron Limited (Japan).....II-70
1$100
   Trikon Technologies (UK).....II-71
Varian Semiconductor Equipment Associates, Inc (USA).....II-71
1$100
   Table 10: World Recent Past, Current & Future Analysis for Semiconductor Processing Equipment by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart).....II-72

Table 11: World 10-Year Perspective for Semiconductor Processing Equipment by Geographic Region – Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2000, 2005 & 2010 (includes corresponding Graph/Chart).....II-72
1$400
   Table 12: World Recent Past, Current & Future Analysis for CMP Equipment by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart).....II-73

Table 13: World 10-Year Perspective for CMP Equipment by Geographic Region – Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2000, 2005 & 2010 (includes corresponding Graph/Chart).....II-73
1$400
   Table 14: World Recent Past, Current & Future Analysis for Dielectric CVD Equipment by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart).....II-74

Table 15: World 10-Year Perspective for Dielectric CVD Equipment by Geographic Region – Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2000, 2005 & 2010 (includes corresponding Graph/Chart).....II-74
1$400
   Table 16: World Recent Past, Current & Future Analysis for Epitaxy Equipment by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart).....II-75

Table 17: World 10-Year Perspective for Epitaxy Equipment by Geographic Region – Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2000, 2005 & 2010 (includes corresponding Graph/Chart).....II-75
1$400
   Table 18: World Recent Past, Current & Future Analysis for Etch Equipment by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart).....II-76

Table 19: World 10-Year Perspective for Etch Equipment by Geographic Region – Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2000, 2005 & 2010 (includes corresponding Graph/Chart).....II-76
1$400
   Table 20: World Recent Past, Current & Future Analysis for Furnace and RTP Equipment by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart).....II-77

Table 21: World 10-Year Perspective for Furnace and RTP Equipment by Geographic Region – Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2000, 2005 & 2010 (includes corresponding Graph/Chart).....II-77
1$400
   Table 22: World Recent Past, Current & Future Analysis for Ion Implant Equipment by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart).....II-78

Table 23: World 10-Year Perspective for Ion Implant Equipment by Geographic Region – Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2000, 2005 & 2010 (includes corresponding Graph/Chart).....II-78
1$400
   Table 24: World Recent Past, Current & Future Analysis for Lithography Equipment by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart).....II-79

Table 25: World 10-Year Perspective for Lithography Equipment by Geographic Region – Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2000, 2005 & 2010 (includes corresponding Graph/Chart).....II-79
1$400
   Table 26: World Recent Past, Current & Future Analysis for Wafer Deposition Equipment by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart).....II-80

Table 27: World 10-Year Perspective for Wafer Deposition Equipment by Geographic Region – Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2000, 2005 & 2010 (includes corresponding Graph/Chart).....II-80
1$400
   Table 28: World Recent Past, Current & Future Analysis for Packaging Equipment by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart).....II-81

Table 29: World 10-Year Perspective for Packaging Equipment by Geographic Region – Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2000, 2005 & 2010 (includes corresponding Graph/Chart).....II-81
1$400
   Table 30: World Recent Past, Current & Future Analysis for Test and Metrology Equipment by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart).....II-82

Table 31: World 10-Year Perspective for Test and Metrology Equipment by Geographic Region – Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2000, 2005 & 2010 (includes corresponding Graph/Chart).....II-82
1$400
   Table 32: World Recent Past, Current & Future Analysis for Other Semiconductor Processing Equipment by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart).....II-83

Table 33: World 10-Year Perspective for Other Semiconductor Processing Equipment by Geographic Region – Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2000, 2005 & 2010 (includes corresponding Graph/Chart).....II-83
1$400
   A. Market Analysis.....III-1
Current and Future Analysis.....III-1
US–Second Largest Semiconductor Equipment Market.....III-1
Focus on Leading Players.....III-1
Applied Materials, Inc......III-1
Electro Scientific Industries Inc.....III-1
1$75
   Genus, Inc.....III-2
KLA-Tencor Corporation.....III-2
Lam Research Corporation.....III-2
1$75
   Mattson Technology, Inc.....III-3
MKS Instruments, Inc......III-3
Novellus Systems, Inc.....III-3
Tegal Corporation.....III-3
1$75
   Varian Semiconductor Equipment Associates, Inc.....III-4
Product Innovations/Developments.....III-4
7$275
   Strategic Developments .....III-1117$675
   B. Market Analytics.....III-28
Table 34: US Recent Past, Current & Future Analysis for Semiconductor Processing Equipment by Product Segment – CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart).....III-28
1$250
   Table 35: US 10-Year Perspective for Semiconductor Processing Equipment by Product Segment – Percentage Breakdown of Dollar Sales for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets for 2000, 2005 & 2010 (includes corresponding Graph/Chart).....III-29
1$250
   Market Analysis.....III-30
Current and Future Analysis.....III-30
Table 36: Canadian Recent Past, Current & Future Analysis for Semiconductor Processing Equipment by Product Segment – CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart).....III-30
1$250
   Table 37: Canadian 10-Year Perspective for Semiconductor Processing Equipment by Product Segment – Percentage Breakdown of Dollar Sales for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets for 2000, 2005 & 2010 (includes corresponding Graph/Chart).....III-31
1$250
   A. Market Analysis.....III-32
Current and Future Analysis.....III-32
Industry Overview.....III-32
Market Dynamics.....III-32
1$75
   Historic Review.....III-33
Competitive Factors.....III-33
1$75
   Focus on Leading Players.....III-34
Advantest.....III-34
Canon Inc.....III-34
Dainippon Screen Mfg.....III-34
Hitachi High-Technologies Corporation.....III-34
Nikon Corporation.....III-34
1$75
   Tokyo Electron Limited.....III-35
Product Innovations/Developments.....III-35
2$150
   Strategic Developments.....III-372$150
   B. Market Analytics.....III-39
Table 38: Japanese Recent Past, Current & Future Analysis for Semiconductor Processing Equipment by Product Segment – CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart).....III-39
1$250
   Table 39: Japanese 10-Year Perspective for Semiconductor Processing Equipment by Product Segment – Percentage Breakdown of Dollar Sales for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets for 2000, 2005 & 2010 (includes corresponding Graph/Chart).....III-40
1$250
   Market Analysis.....III-41
Current and Future Analysis.....III-41
Table 40: European Recent Past, Current & Future Analysis for Semiconductor Processing Equipment by Geographic Region – France, Germany, Italy, United Kingdom, Spain, Russia, and Rest of Europe Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart).....III-41
1$250
   Table 41: European Recent Past, Current & Future Analysis for Semiconductor Processing Equipment by Product Segment – CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart).....III-421$250
   Table 42: European 10-Year Perspective for Semiconductor Processing Equipment by Geographic Region – Percentage Breakdown of Dollar Sales for France, Germany, Italy, United Kingdom, Spain, Russia, and Rest of Europe Markets for Years 2000, 2005 & 2010 (includes corresponding Graph/Chart).....III-431$250
   Table 43: European 10-Year Perspective for Semiconductor Processing Equipment by Product Segment – Percentage Breakdown of Dollar Sales for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets for 2000, 2005 & 2010 (includes corresponding Graph/Chart).....III-44
1$250
   Market Analysis.....III-45
Current and Future Analysis .....III-45
Table 44: French Recent Past, Current & Future Analysis for Semiconductor Processing Equipment by Product Segment – CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart).....III-45
1$250
   Table 45: French 10-Year Perspective for Semiconductor Processing Equipment by Product Segment – Percentage Breakdown of Dollar Sales for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets for 2000, 2005 & 2010 (includes corresponding Graph/Chart).....III-46
1$250
   A. Market Analysis.....III-47
Current and Future Analysis.....III-47
SUSS MicroTec AG – A Key German Player.....III-47
Product Innovations/Developments .....III-47
1$75
   Strategic Developments .....III-482$150
   B. Market Analytics.....III-50
Table 46: German Recent Past, Current & Future Analysis for Semiconductor Processing Equipment by Product Segment – CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart).....III-50
1$250
   Table 47: German 10-Year Perspective for Semiconductor Processing Equipment by Product Segment – Percentage Breakdown of Dollar Sales for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets for 2000, 2005 & 2010 (includes corresponding Graph/Chart).....III-51
1$250
   Market Analysis.....III-52
Current and Future Analysis .....III-52
Table 48: Italian Recent Past, Current & Future Analysis for Semiconductor Processing Equipment by Product Segment – CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart).....III-52
1$250
   Table 49: Italian 10-Year Perspective for Semiconductor Processing Equipment by Product Segment – Percentage Breakdown of Dollar Sales for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets for 2000, 2005 & 2010 (includes corresponding Graph/Chart).....III-53
1$250
   A. Market Analysis.....III-54
Current and Future Analysis.....III-54
Trikon Technologies – A Key UK Stalwart.....III-54
Strategic Developments.....III-54
2$150
   B. Market Analytics.....III-56
Table 50: UK Recent Past, Current & Future Analysis for Semiconductor Processing Equipment by Product Segment – CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart).....III-56
1$250
   Table 51: UK 10-Year Perspective for Semiconductor Processing Equipment by Product Segment – Percentage Breakdown of Dollar Sales for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets for 2000, 2005 & 2010 (includes corresponding Graph/Chart).....III-57
1$250
   Market Analysis.....III-58
Current and Future Analysis.....III-58
Table 52: Spanish Recent Past, Current & Future Analysis for Semiconductor Processing Equipment by Product Segment – CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart).....III-58
1$250
   Table 53: Spanish 10-Year Perspective for Semiconductor Processing Equipment by Product Segment – Percentage Breakdown of Dollar Sales for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets for 2000, 2005 & 2010 (includes corresponding Graph/Chart).....III-59
1$250
   Market Analysis.....III-60
Current and Future Analysis.....III-60
Table 54: Russian Recent Past, Current & Future Analysis for Semiconductor Processing Equipment by Product Segment – CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart).....III-60
1$250
   Table 55: Russian 10-Year Perspective for Semiconductor Processing Equipment by Product Segment – Percentage Breakdown of Dollar Sales for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets for 2000, 2005 & 2010 (includes corresponding Graph/Chart).....III-61
1$250
   A. Market Analysis.....III-62
Current and Future Analysis.....III-62
Focus on Leading Players.....III-62
ASM International N.V. (The Netherlands).....III-62
ASML Holding NV (The Netherlands).....III-62
1$75
   STMicroelectronics (Switzerland).....III-63
Strategic Developments .....III-63
2$150
   B. Market Analytics.....III-65
Table 56: Rest of Europe Market for Semiconductor Processing Equipment – Recent Past, Current & Future Analysis by Product Segment for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart).....III-65
1$250
   Table 57: Rest of Europe10-Year Perspective for Semiconductor Processing Equipment by Product Segment – Percentage Breakdown of Dollar Sales for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets for 2000, 2005 & 2010 (includes corresponding Graph/Chart).....III-66
1$250
   A. Market Analysis.....III-67
Current and Future Analysis.....III-67
Asia-Pacific – Mirroring Growth.....III-67
Strategic Developments.....III-67
2$150
   B. Market Analytics.....III-69
Table 58: Asia-Pacific Market for Semiconductor Processing Equipment – Recent Past, Current & Future Analysis by Geographic Region for Taiwan, Korea, and Rest of Asia-Pacific Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart).....III-69
1$250
   Table 59: Asia-Pacific Market for Semiconductor Processing Equipment – Recent Past, Current & Future Analysis by Product Segment for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart).....III-701$250
   Table 60: Asia-Pacific 10-Year Perspective for Semiconductor Processing Equipment by Geographic Region – Percentage Breakdown of Dollar Sales for Taiwan, Korea, and Rest of Asia-Pacific Markets for 2000, 2005 & 2010 (includes corresponding Graph/Chart).....III-711$250
   Table 61: Asia-Pacific 10-Year Perspective for Semiconductor Processing Equipment by Product Segment – Percentage Breakdown of Dollar Sales for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets for 2000, 2005 & 2010 (includes corresponding Graph/Chart).....III-72
1$250
   Market Analysis.....III-73
Current and Future Analysis.....III-73
Table 62: Taiwanese Market for Semiconductor Processing Equipment – Recent Past, Current & Future Analysis by Product Segment for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart).....III-73
1$250
   Table 63: Taiwanese 10-Year Perspective for Semiconductor Processing Equipment by Product Segment – Percentage Breakdown of Dollar Sales for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets for 2000, 2005 & 2010 (includes corresponding Graph/Chart).....III-74
1$250
   A. Market Analysis.....III-75
Current and Future Analysis.....III-75
Korean Semiconductor Equipment Market.....III-75
Historical Background.....III-75
1$75
   Players in the Market.....III-761$75
   B. Market Analytics.....III-77
Table 64: Korean Market for Semiconductor Processing Equipment – Recent Past, Current & Future Analysis by Product Segment for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart).....III-77
1$250
   Table 65: Korean 10-Year Perspective for Semiconductor Processing Equipment by Product Segment – Percentage Breakdown of Dollar Sales for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets for 2000, 2005 & 2010 (includes corresponding Graph/Chart).....III-78
1$250
   A. Market Analysis.....III-79
Current and Future Analysis.....III-79
Developing Economies Spur Demand.....III-79
China – A Burgeoning Market.....III-79
1$75
   B. Market Analytics.....III-80 1$75
   Table 66: Rest of Asia-Pacific Market for Semiconductor Processing Equipment – Recent Past, Current & Future Analysis by Product Segment for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart).....III-81

Table 67: Rest of Asia-Pacific 10-Year Perspective for Semiconductor Processing Equipment by Product Segment – Percentage Breakdown of Dollar Sales for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets for 2000, 2005 & 2010 (includes corresponding Graph/Chart).....III-81
1$250
   Market Analysis.....III-82
Current and Future Analysis.....III-82
Table 68: Rest of World Market for Semiconductor Processing Equipment – Recent Past, Current & Future Analysis by Product Segment for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart).....III-82
1$250
   Table 69: Rest of World 10-Year Perspective for Semiconductor Processing Equipment by Product Segment – Percentage Breakdown of Dollar Sales for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets for 2000, 2005 & 2010 (includes corresponding Graph/Chart).....III-831$250
    
 
 


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