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DOMAIN EXPERT ENGAGEMENTS

Number of executives repeatedly engaged by snail & email outreach*

POOL + OUTREACH

861

Interactions with Platform & by Email *

INTERACTIONS

172

Unique # Participated *

PARTICIPANTS

34

Responses Validated *

VALIDATIONS

10

* Platform engagements are dynamic. Stats are published quarterly.


  •  CODE

  •  PAGES

  •  DATE

  •  PRICE

    $

  •  DATA EXHIBITS

    125


TABLE OF CONTENTS


   Pages :    | $

   Study Reliability and Reporting Limitations.....I-1  
   Disclaimers.....I-2
Data Interpretation & Reporting Level.....I-2
  
   Quantitative Techniques & Analytics.....I-3
Product Definitions and Scope of Study.....I-3
IC Sockets.....I-3
1. Dual In-Line Memory Module (DIMM) Sockets.....I-3
2. Production Sockets.....I-3
  
   3. Test/Burn-in Sockets.....I-4
4. Other Sockets.....I-4
  
   Preface.....II-1
Global Outlook.....II-1
Analysis by Region.....II-1
1$110
   Analysis by Product Segment.....II-2
Impact of Recession on IC Sockets Market.....II-2
Changing Market Dynamics.....II-2
1$110
   Evolving IC Sockets Market.....II-3
Evolving Production IC Sockets Segment.....II-3
Test and Burn-In Sockets Segment to Witness New Developments.....II-3
1$110
   IC Socket Industry Witnesses Growth of EMS Companies.....II-4
Connector Industry.....II-4
1$110
   Introduction.....II-5
IC Sockets.....II-5
Performance Specifications.....II-5
Components of IC Socket.....II-5
1$110
   Contact Designs Used in IC Sockets.....II-6
Types of IC Sockets.....II-6
1$110
   Dual In-Line Memory Module (DIMM) Sockets.....II-7
Production Sockets.....II-7
Plastic Leaded Chip Carrier (PLCC) Socket.....II-7
Pin Grid Array (PGA) Socket.....II-7
Land Grid Array (LGA) Socket.....II-7
1$110
   Test/Burn-in Sockets.....II-8
Other Sockets.....II-8
Dual In-Line Package (DIP) Socket.....II-8
Ball Grid Array (BGA) Socket.....II-8
Specialty Socket.....II-8
1$110
   Interposer.....II-9
Advantages of IC Sockets.....II-9
Cost Savings.....II-9
1$110
   Component Repair and Replacement.....II-10
Avoidance of Direct Soldering.....II-10
Flexibility in Assembly, IC Design, and Supply- Chain Management.....II-10
1$110
   Component Exchange and Upgrade.....II-11
Component Burn-in and Test.....II-11
Disadvantages of IC Sockets.....II-11
End-Use Applications of IC Sockets.....II-11
1$110
   Services and Products Associated with IC Sockets.....II-12
IC Sockets and Interconnect Components.....II-12
1$110
   IC Package Converters and Adapters.....II-13
PCB Pins and Receptacles.....II-13
IC Pin Probes.....II-13
1$110
   Ironwood Electronics Launches a Range of New BGA Sockets.....II-14
Ironwood Electronics Introduces New QFN Socket.....II-14
1$110
   Ironwood Electronics Launches High Performance BGA Socket.....II-15
Aries Electronics Expands CSP/ÁBGA Test/Burn- in Sockets Range.....II-15
1$110
   Plastronics Launches ES Socket System.....II-16
Thermaltake Unveils New CPU Cooler with Multiple Sockets.....II-16
Fujitsu Launches SMT DDR2 DIMM Socket.....II-16
1$110
   Emulation Unveils Novel Socket System.....II-17
MIPS Technologies Unveils Novel Instruction Set and Cores.....II-17
1$110
   Aries Electronics Launches CSP/BallNest Hybrid Socket.....II-18
MiniATE Systems Introduces ET 2300 Socket System.....II-18
Sullins Connector Solutions Extends Insulation Displacement Connector
  Portfolio.....II-18
1$110
   Fujitsu Asia Introduces PRIMERGY Dual Socket S5 Series.....II-19
Intel Launches Nehalem Based Processors and LGA Sockets.....II-19
Quadrant Rolls Out Semitron« MDS 100.....II-19
1$110
   Atmel Introduces New Expansion, Routing and Socket Cards.....II-20
Tyco Electronics Introduces New Range of RFI Filter Connectors.....II-20
1$110
   Molex Sockets Earn Intel« Validation.....II-21
Semiconductor Test Group Merges with Multitest elektronische Systeme and Harbor
  Electronics.....II-21
KLA Tencor Acquires ICOS Vision Systems.....II-21
2$220
   3M Company (US).....II-23
Aries Electronics, Inc. (US).....II-23
1$110
   Chupond Precision Co., Ltd. (Taiwan).....II-24
Enplas Corporation (Japan).....II-24
FCI (France).....II-24
Foxconn Technology Group (Taiwan).....II-24
1$110
   Johnstech International Corporation (US).....II-25
Loranger International Corporation (US).....II-25
Mill-Max Mfg. Corporation (US).....II-25
Molex, Inc. (US).....II-25
1$110
   Plastronics Socket Company, Inc. (US).....II-26
Sensata Technologies B.V. (The Netherlands).....II-26
Tyco Electronics Ltd. (Switzerland).....II-26
1$110
   Win Way Technology Co., Ltd. (Taiwan).....II-27
Yamaichi Electronics Co., Ltd. (Japan).....II-27
1$110
   Table 1: World Recent Past, Current and Future Analysis for IC Sockets by Geographic Region - North America, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....II-281$350
   Table 2: World 10-Year Perspective for IC Sockets by Geographic Region - Percentage Breakdown of Dollar Sales for North America, Japan, Europe, Asia-Pacific and Rest of World Markets for Years 2006, 2009 and 2015 (includes corresponding Graph/Chart).....II-291$350
   Table 3: World Recent Past, Current & Future Analysis for IC Sockets by Product Segment - Dual In-Line Memory Module Sockets, Production Sockets, Test/Burn-in Sockets, and Other IC Socket Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....II-301$350
   Table 4: World 10-Year Perspective for IC Sockets by Product Segment - Percentage Breakdown of Dollar Sales for Dual In-Line Memory Module Sockets, Production Sockets, Test/Burn-in Sockets, and Other IC Socket Markets for Years 2006, 2009 & 2015 (includes corresponding Graph/Chart).....II-311$350
   A. Market Analysis.....III-1
Current and Future Analysis.....III-1
Impact of Recession on IC Sockets Market.....III-1
Product Launches/Developments.....III-1
5$295
   Strategic Corporate Developments.....III-61$105
   Select US Players.....III-73$150
   B. Market Analytics.....III-10
Table 5: North American Recent Past, Current and Future Analysis for IC Sockets with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....III-10
1$200
   A. Market Analysis.....III-11
Current and Future Analysis.....III-11
Select Players.....III-11
1$105
   B. Market Analytics.....III-12
Table 6: Japanese Recent Past, Current and Future Analysis for IC Sockets with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....III-12
1$200
   A. Market Analysis.....III-13
Current and Future Analysis.....III-13
Product Launch.....III-13
Strategic Corporate Development.....III-13
1$105
   Select Players.....III-141$105
   B. Market Analytics.....III-15
Table 7: European Recent Past, Current and Future Analysis for IC Sockets with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....III-15
1$200
   A. Market Analysis.....III-16
Current and Future Analysis.....III-16
Product Launches/Developments.....III-16
1$105
   Select Players.....III-172$210
   B. Market Analytics.....III-19
Table 8: Asia-Pacific Recent Past, Current and Future Analysis for IC Sockets by Geographic Region - China and Rest of Asia-Pacific Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....III-19
1$200
   Table 9: Asia-Pacific 10-Year Perspective for IC Sockets by Geographic Region - Percentage Breakdown of Dollar Sales for China and Rest of Asia-Pacific Markets for Years 2006, 2009 and 2015 (includes corresponding Graph/Chart).....III-201$200
   Market Analysis.....III-21
Table 10: Rest of World Recent Past, Current and Future Analysis for IC Sockets with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....III-21
1$200
    
 
 


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