User: Guest

  



DOMAIN EXPERT ENGAGEMENTS

Number of executives repeatedly engaged by snail & email outreach*

POOL + OUTREACH

373

Interactions with Platform & by Email *

INTERACTIONS

75

Unique # Participated *

PARTICIPANTS

15

Responses Validated *

VALIDATIONS

6

* Platform engagements are dynamic. Stats are published quarterly.


  •  CODE

  •  PAGES

  •  DATE

  •  PRICE

    $

  •  DATA EXHIBITS

    125


TABLE OF CONTENTS


   Pages :    | $

   Study Reliability and Reporting Limitations.....I-1  
   Disclaimers.....I-2
Data Interpretation & Reporting Level.....I-2
  
   Quantitative Techniques & Analytics.....I-3
Product Definitions and Scope of Study.....I-3
  
   End-Use Segments.....I-4
1. Computers.....I-4
2. Telecom.....I-4
3. Medical/Office Equipment.....I-4
4. Industrial/Military.....I-4
  
   5. Consumer Electronics.....I-5
6. Automotive.....I-5
Product Segments.....I-5
1. Hardware.....I-5
2. Software.....I-5
3. Interfaces and Substrates.....I-5
  
   Sophisticated Technology Needs Effective Thermal Management.....II-6
Current and Future Analysis.....II-6
Regional Perspective.....II-6
End-Use Perspective.....II-6
1$100
   Product Segment Perspective.....II-71$100
   Recession Impacts the Market.....II-8
Rising Complexities Present Lucrative Opportunities for Electronic Thermal
  Management.....II-8
PC Market Stimulates Growth.....II-8
Thermal Management Subsystems Set for Robust Growth.....II-8
1$100
   New Technologies Under Development.....II-9
Liquid Cooling Gaining Foothold.....II-9
Semiconductor Manufacturers Look for Thermal Management Technology.....II-9
1$100
   Heat Pipe Gains Popularity among PC Manufacturers.....II-10
Imminent Growth for ICs.....II-10
1$100
   Thermal Management – A Critical Function.....II-11
Electronic Thermal Management Products.....II-11
Hardware.....II-11
Heat Sinks.....II-11
Heat Pipes.....II-11
1$100
   Micro Channels.....II-12
Spray Cooling.....II-12
Electronic Cooling Fans.....II-12
Metal Backplanes.....II-12
1$100
   BGAs.....II-13
Software.....II-13
Computational Methods of Heat Transfer (CHT) and Fluid Dynamics (CFD).....II-13
Electronic Design Automation (EDA) Software, Electronic Computer Aided Design (ECAD)
  Software, and Technology Computer Aided Design (TCAD) Software.....II-13
1$100
   Interfaces and Substrates.....II-14
Thermal Compounds and Thermal Interface Materials.....II-14
1$100
   Thermal Management Applications.....II-15
Computers.....II-15
Notebooks/Laptops.....II-15
Servers.....II-15
1$100
   Embedded PCs.....II-16
Telecom.....II-16
Medical.....II-16
Industrial Electronics.....II-16
Aerospace/Military.....II-16
1$100
   Consumer Electronics.....II-17
Automotive.....II-17
1$100
   Thermal Management - A Fragmented Market.....II-18
Table 1: Leading Vendors in the Worldwide Thermal Management Market (2006 & 2007) - Percentage Breakdown by Value Sales for Amkor, Aavid Thermalloy, Fluent, Chomerics, Kyocera, and Others (includes corresponding Graph/Chart).....II-18
1$350
   Thermal Management Hardware Market.....II-19
Table 2: Leading Players in the Worldwide Thermal Management Hardware Market (2006 & 2007) - Percentage Breakdown by Value Sales for Aavid Thermalloy, Thermacore, Lytron, and Others (includes corresponding Graph/Chart).....II-19
1$350
   Fluent – The Undisputed Thermal Management S/W Market Leader.....II-20
Table 3: Leading Players in the Worldwide Thermal Management Software Market (2006 & 2007) - Percentage Breakdown by Value Sales for Fluent, Ansys, Flomerics, Daat, and Others (includes corresponding Graph/Chart).....II-20
1$350
   Chomerics and Bergquist Lead Thermal Management Interface Market.....II-21
Table 4: Leading Players in the Worldwide Thermal Management Interface Market (2006 & 2007) - Percentage Breakdown by Value Sales for Chomerics, Bergquist, Aavid Thermalloy, Lytron, and Others (includes corresponding Graph/Chart).....II-21
1$350
   Amkor Dominates Thermal Management Substrate Market.....II-22
Table 5: Leading Players in the Worldwide Thermal Management Substrate Market (2006 & 2007) - Percentage Breakdown by Value Sales for Amkor, Kyocera, ST ChipPAC, OSE, ASAT, and Others (includes corresponding Graph/Chart).....II-22
1$350
   LORD Unveils MT-815 Low Modulus Increased Thermal Conductivity Adhesive.....II-23
Thermaltake Introduces Thermaltake SlimX3.....II-23
Honeywell Electronic Materials Launches Honeywell PCM45M-SP.....II-23
1$100
   AdaptivCool Develops HotSpotr HT-510.....II-24
Nuventix Introduces SynJet Spot Light Cooler.....II-24
1$100
   DSM Engineering Plastics Unveils Thermally Conductive PA46 Material.....II-25
Micropelt Launches MPC-D40x Thermoelectric Coolers.....II-25
1$100
   Pfannenberg Unveils New DTS 3000 Side-Mount Cooling Units.....II-26
California Micro Devices Launches LuxGuard™ CM1771.....II-26
Honeywell Unveils Pb-free Die Attach Solder.....II-26
1$100
   Nuventix Introduces New Line of SynJet Coolers.....II-27
Indium Launches Heat-Spring® Thermal Interface Material.....II-27
1$100
   Parker Hannifin Launches Two-Phase Liquid Cooling System.....II-28
Nuventix and National Semiconductor Launch Electronic Drive and Reference
  Design.....II-28
Honeywell International Unveils Honeywell PTM 3180.....II-28
1$100
   RS Components Unveils New Thermal Management Solutions.....II-291$100
   Arun Components Launches Alutronic Line of Heatsink Systems.....II-30
Nextreme Thermal Solutions Introduces New Series of OptoCooler High Voltage
  Modules.....II-30
Vette Introduces Aluma-Cop Liquid Cooling.....II-30
1$100
   SprayCool Launches Multi-Platform Enclosure.....II-31
Celsia Technologies Unveils Advanced NanoSpreader.....II-31
STABLCOR Introduces ST10-LC909 Products.....II-31
2$125
   SMART Releases Liquid-Cooled VLP DDR2 Registered DIMMs.....II-33
LORD Develops Materials for Thermal Management.....II-33
Dow Corning Introduces New Thermally Conductive Compound.....II-33
Astrosyn Unveils a Range of Slide-fit Heatsink Enclosures.....II-33
1$100
   Dell Develops a Liquid-Cooled Heat Sink.....II-34
Fujipoly America Develops an Innovative Thermal Interface Material.....II-34
Flomerics to Offer T3Ster Thermal Testing System.....II-34
Andigilog® Develops ThermalEdge™ Cooling Technology.....II-34
1$100
   Andigilog® Introduces Thermal Management Solutions.....II-35
Celsia Releases MicroSpreader™.....II-35
Sunon Develops Liquid Circulation Cooling System.....II-35
1$100
   EBM-PAPST Develops Advanced Liquid Cooling System.....II-36
EBM-PAPST Introduces New Fan-Cooling Technology.....II-36
Hybricon Introduces Liquid-Cooled ATR Chassis.....II-36
Ansoft Launches Latest Version of ePhysics as ePhysics v2.....II-36
1$100
   CTS Launches New Line of Low-Profile Forged Heat Sinks.....II-37
Honeywell Introduces Screen Printable Phase Change Material in Chip
  Manufacture.....II-37
Laird Launches Thermally Conductive, Electrically Insulating T-preg™ HTD for
  PCBs.....II-37
1$100
   Laird Introduces Deep Drawing Capability for Shielding Applications.....II-38
Laird Introduces Low-Cost T-Gard™ for SMPS Devices.....II-38
Laird Introduces T-Gard™ 500 High Performance Insulator for Automotive
  Industry.....II-38
1$100
   Jaro Develops 450 CFM AC Cooling Fan for Industrial Use.....II-39
Jaro Develops IC Cooling Fan With High Flow and Cooling Value.....II-39
Mathis Develops Mathis TCi™ For Improved Thermal Conductivity Testing.....II-39
Melcor Introduces Extrusion Heat Sinks With Improved Performance.....II-39
Fluent Launches New Environmental Thermal Audit Solution for Data Centers.....II-39
1$100
   Kooltronic Introduces Advanced Enclosure Accessories.....II-40
Pfannerberg Develops Filterfan®.....II-40
1$100
   Thermacore Snaps Up Pittsburgh Materials Technology.....II-41
Parker Hannifin Takes Over SprayCool.....II-41
Dow Kokam Acquires Societe de Vehicles Electriques.....II-41
1$100
   BorgWarner Establishes Manufacturing Plant.....II-42
MAHLE Acquires Majority Stake in BEHR Industry.....II-42
CoolIT Systems Takes Over Assets of Delphi Thermal Liquid Cooling.....II-42
1$100
   Curtiss-Wright Snaps Up EST Group.....II-43
Arlington Capital Partners Acquires J.A. Reinhardt.....II-43
Thermacore Takes Over k Technology.....II-43
1$100
   IBM Collaborates with Vette.....II-44
Bias Power Collaborates with Nuventix.....II-44
Roal Electronics Collaborates with Nuventix.....II-44
1$100
   Electronic Environments Inks Partnership Agreement with AdaptivCool.....II-45
Asetek Forms Alliance with Corsair.....II-45
AdaptivCool and Yamatake Sign Agreement.....II-45
1$100
   Toyal America forms Alliance with E.W. Kaufmann.....II-46
Stablcor and Elvia PCB Group Ink Licensing Agreement.....II-46
Weidmann Electrical Technology and LumaSense Technologies Ink Strategic Partnership
  Agreement.....II-46
Thermacore Bags Contract from Defense Advanced Research Projects Agency.....II-46
Waytronx Takes Over CUI.....II-46
1$100
   Photochemie Signs Licensing Agreement with Stablcor.....II-47
ON Semiconductor Establishes Research and Development Centre.....II-47
Stablcor and Graphic Ink Licensing Agreement.....II-47
1$100
   Texas Instruments Takes Over Commergy Technologies.....II-48
Thermal Energy International Takes Over Gardner Energy Management.....II-48
nCoat Inks Agreement with BSR Solar Technologies and Sunvention USA.....II-48
CSP Inc. MultiComputer Division Signs Agreement with SprayCool® Technologies.....II-48
1$100
   Mentor Graphics Takes Over Flomerics Group.....II-49
Modine Divests Thermacore.....II-49
1$100
   Moog Takes Over Thermal Control Products.....II-50
Rensselaer Teams Up with Varsities to Develop Cooling Techniques.....II-50
1$100
   Laird Partners with Sager Electronics.....II-51
Honeywell to Expand R&D Facility.....II-51
Vette Adds ERM.....II-51
Laird Takes Over Supercool.....II-51
1$100
   Arlington Capital Acquires Woven Electronics Through Thermal Solutions.....II-52
Parker Hannifin Purchases Acofab and Adecem.....II-52
Ametek Adds Land Instruments.....II-52
1$100
   Lytron Adds Lockhart Industries.....II-53
Seki Technotron Purchases 10% Interest in sp3 Inc......II-53
OnScreen Purchases Patent of WayCool Thermal Cooling Technology.....II-53
1$100
   Flomerics Acquires NIKA.....II-54
Aavid Merges with Ansys and Spins-Off Thermal Management Business.....II-54
Celsia and Yeh-Chiang Sign Agreement.....II-54
Nextreme Inks License Deal with Caltech.....II-54
Celsia Signs Sales & Development Pact with Lighting Science.....II-54
1$100
   Celsia Contracts with Kubo to Expand in Japan.....II-55
Hybricon and Parker Hannifin Sign Pact for Cooling Solutions.....II-55
Rogers and Thermal Transfer Composites Partner.....II-55
1$100
   sp3 Partners with CPS.....II-56
Celsia Teams Up with AET.....II-56
Mathis Forms Distribution Partnership with Setaram Instrumentation.....II-56
1$100
   II-VI, Incorporated (US).....II-57
Marlow Industries (US).....II-57
Aavid Thermalloy, LLC (US).....II-57
Advanced Thermal Solutions, Inc. (US).....II-57
1$100
   Alcoa, Inc. (US).....II-58
Alpha Technologies, Inc. (US).....II-58
Ametek, Inc. (US).....II-58
1$100
   Amkor Technology, Inc. (US).....II-59
Ansys, Inc. (US).....II-59
Ansoft Corporation (US).....II-59
1$100
   Fluent, Inc. (US).....II-60
ASAT Holdings Ltd. (Hong Kong).....II-60
1$100
   Brush Engineered Materials, Inc. (US).....II-61
Ceramics Process Systems Corporation (US).....II-61
Chomerics (US).....II-61
1$100
   Comair Rotron, Inc. (US).....II-62
Cookson Electronics Assembly Materials (US).....II-62
Cool Innovations, Inc. (US).....II-62
Cooler Master Co., Ltd. (UK).....II-62
1$100
   C-Therm Technologies Ltd. (Canada).....II-63
CTS Corporation (US).....II-63
Daat Research Corp. (US).....II-63
Degree Controls, Inc. (US).....II-63
1$100
   Dow Corning Corporation (US).....II-64
Dynatron Corporation (US).....II-64
Enertron, Inc. (US).....II-64
Ferraz Shawmut, LLC (Canada).....II-64
1$100
   Fujikura Ltd. (Japan).....II-65
Henkel Loctite Corporation (US).....II-65
Honeywell Electronic Materials (US).....II-65
1$100
   Intricast Company Inc (US).....II-66
ITW Vortec (US).....II-66
JARO Components, Inc. (US).....II-66
Kooltronic, Inc. (US).....II-66
Kyocera Corporation (Japan).....II-66
1$100
   Laird Technologies (US).....II-67
Liebert Corporation (US).....II-67
Lord Corporation (US).....II-67
Lytron Incorporated (US).....II-67
1$100
   Mentor Graphics Corporation (US).....II-68
Metal Matrix Cast Composites, LLC (US).....II-68
Micronel U.S. (US).....II-68
1$100
   Netzsch Instruments, Inc. (US).....II-69
Netzsch Thermal Analysis (Germany).....II-69
NMB Technologies Corporation (US).....II-69
Noren Products, Inc. (US).....II-69
1$100
   Orient Semiconductor Electronics Ltd. (Taiwan).....II-70
PC Power & Cooling, Inc. (US).....II-70
Pfannenberg, Inc. (US).....II-70
PLANSEE Thermal Management Solutions (US).....II-70
Sumitomo Electric Industries, Ltd. (Japan).....II-70
1$100
   Tech Spray, L. P. (UK).....II-71
Tellurex Corp. (US).....II-71
Tennmax United (US).....II-71
1$100
   The Bergquist Company (US).....II-72
The Filter Factory, Inc. (US).....II-72
Thermacore (US).....II-72
1$100
   Transene Company, Inc. (US).....II-73
U.S. Toyo Fan Corporation (US).....II-73
United Thermal Engineering Corporation (US).....II-73
Vette Corp. (US).....II-73
1$100
   Wakefield Thermal Solutions, Inc. (US).....II-741$100
   Table 6: World Recent Past, Current & Future Analysis for Electronic Thermal Management by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart).....II-751$350
   Table 7: World Historic Review for Electronic Thermal Management by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart).....II-761$350
   Table 8: World 11-Year Perspective for Electronic Thermal Management by Geographic Region - Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2005, 2010 & 2015 (includes corresponding Graph/Chart).....II-771$350
   Table 9: World Recent Past, Current & Future Analysis for Electronic Thermal Management by Product Segment - Hardware, Software, and Interfaces & Substrates Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart).....II-781$350
   Table 10: World Historic Review for Electronic Thermal Management by Product Segment - Hardware, Software, and Interfaces & Substrates Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart).....II-791$350
   Table 11: World 11-Year Perspective for Electronic Thermal Management by Product Segment - Percentage Breakdown of Dollar Sales for Hardware, Software, and Interfaces & Substrates Markets for Years 2005, 2010 & 2015 (includes corresponding Graph/Chart).....II-801$350
   Table 12: World Recent Past, Current & Future Analysis for Electronic Thermal Management in Computers by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart).....II-811$350
   Table 13: World Historic Review for Electronic Thermal Management in Computers by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart).....II-821$350
   Table 14: World 11-Year Perspective for Electronic Thermal Management in Computers by Geographic Region - Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2005, 2010 & 2015 (includes corresponding Graph/Chart).....II-831$350
   Table 15: World Recent Past, Current & Future Analysis for Electronic Thermal Management in Telecom by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart).....II-841$350
   Table 16: World Historic Review for Electronic Thermal Management in Telecom by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart).....II-851$350
   Table 17: World 11-Year Perspective for Electronic Thermal Management in Telecom by Geographic Region - Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2005, 2010 & 2015 (includes corresponding Graph/Chart).....II-861$350
   Table 18: World Recent Past, Current & Future Analysis for Electronic Thermal Management in Medical/Office Equipment by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart).....II-871$350
   Table 19: World Historic Review for Electronic Thermal Management in Medical/Office Equipment by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart).....II-881$350
   Table 20: World 11-Year Perspective for Electronic Thermal Management in Medical/Office Equipment by Geographic Region - Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2005, 2010 & 2015 (includes corresponding Graph/Chart).....II-891$350
   Table 21: World Recent Past, Current & Future Analysis for Electronic Thermal Management in Industrial/Military by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart).....II-901$350
   Table 22: World Historic Review for Electronic Thermal Management in Industrial/Military by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart).....II-911$350
   Table 23: World 11-Year Perspective for Electronic Thermal Management in Industrial/Military by Geographic Region - Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2005, 2010 & 2015 (includes corresponding Graph/Chart).....II-921$350
   Table 24: World Recent Past, Current & Future Analysis for Electronic Thermal Management in Consumer Electronics by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart).....II-931$350
   Table 25: World Historic Review for Electronic Thermal Management in Consumer Electronics by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart).....II-941$350
   Table 26: World 11-Year Perspective for Electronic Thermal Management in Consumer Electronics by Geographic Region - Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2005, 2010 & 2015 (includes corresponding Graph/Chart).....II-951$350
   Table 27: World Recent Past, Current & Future Analysis for Electronic Thermal Management in Automotive by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart).....II-961$350
   Table 28: World Historic Review for Electronic Thermal Management in Automotive by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart).....II-971$350
   Table 29: World 11-Year Perspective for Electronic Thermal Management in Automotive by Geographic Region - Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2005, 2010 & 2015 (includes corresponding Graph/Chart).....II-981$350
   A. Market Analysis.....II-99
Current and Future Analysis.....II-99
By End-Use Segment.....II-99
By Product Segment.....II-99
Rising Complexities Present Lucrative Opportunities for Electronic Thermal
  Management.....II-99
Price Pressures and Shifting of Manufacturing to Asia to Restrain Growth.....II-99
1$100
   B. Market Analytics.....II-100
Table 30: US Recent Past, Current & Future Analysis for Electronic Thermal Management by Product Segment - Hardware, Software, and Interfaces & Substrates Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart).....II-100
1$350
   Table 31: US Historic Review for Electronic Thermal Management by Product Segment - Hardware, Software, and Interfaces & Substrates Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart).....II-1011$350
   Table 32: US 11-Year Perspective for Electronic Thermal Management by Product Segment - Percentage Breakdown of Dollar Sales for Hardware, Software, and Interfaces & Substrates Markets for Years 2005, 2010 & 2015 (includes corresponding Graph/Chart).....II-1021$350
   Table 33: US Recent Past, Current & Future Analysis for Electronic Thermal Management by End-Use Segment - Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart).....II-1031$350
   Table 34: US Historic Review for Electronic Thermal Management by End-Use Segment - Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart).....II-1041$350
   Table 35: US 11-Year Perspective for Electronic Thermal Management by End-Use Segment - Percentage Breakdown of Dollar Sales for Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets for Years 2005, 2010 & 2015 (includes corresponding Graph/Chart).....II-1051$350
   Market Analysis.....II-106
Table 36: Canadian Recent Past, Current & Future Analysis for Electronic Thermal Management by End-Use Segment - Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart).....II-106
1$350
   Table 37: Canadian Historic Review for Electronic Thermal Management by End-Use Segment - Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart).....II-1071$350
   Table 38: Canadian 11-Year Perspective for Electronic Thermal Management by End-Use Segment - Percentage Breakdown of Dollar Sales for Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets for Years 2005, 2010 & 2015 (includes corresponding Graph/Chart).....II-1081$350
   Market Analysis.....II-109
Table 39: Japanese Recent Past, Current & Future Analysis for Electronic Thermal Management by End-Use Segment - Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart).....II-109
1$350
   Table 40: Japanese Historic Review for Electronic Thermal Management by End-Use Segment - Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart).....II-1101$350
   Table 41: Japanese 11-Year Perspective for Electronic Thermal Management by End-Use Segment - Percentage Breakdown of Dollar Sales for Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets for Years 2005, 2010 & 2015 (includes corresponding Graph/Chart).....II-1111$350
   Market Analysis.....II-112
Table 42: European Recent Past, Current & Future Analysis for Electronic Thermal Management by End-Use Segment - Computers, Telecom, Medical/ Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart).....II-112
1$350
   Table 43: European Historic Review for Electronic Thermal Management by End-Use Segment - Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart).....II-1131$350
   Table 44: European 11-Year Perspective for Electronic Thermal Management by End-Use Segment - Percentage Breakdown of Dollar Sales for Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets for Years 2005, 2010 & 2015 (includes corresponding Graph/Chart).....II-1141$350
   A. Market Analysis.....II-115
Current and Future Analysis.....II-115
Taiwan Market Scenario.....II-115
1$100
   B. Market Analytics.....II-116
Table 45: Asia-Pacific Recent Past, Current & Future Analysis for Electronic Thermal Management by End-Use Segment - Computers, Telecom, Medical/Office Equipment, Industrial/ Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart).....II-116
1$350
   Table 46: Asia-Pacific Historic Review for Electronic Thermal Management by End-Use Segment - Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart).....II-1171$350
   Table 47: Asia-Pacific 11-Year Perspective for Electronic Thermal Management by End-Use Segment - Percentage Breakdown of Dollar Sales for Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets for Years 2005, 2010 & 2015 (includes corresponding Graph/Chart).....II-1181$350
   Market Analysis.....II-119
Table 48: Rest of World Recent Past, Current & Future Analysis for Electronic Thermal Management by End-Use Segment - Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart).....II-119
1$350
   Table 49: Rest of World Historic Review for Electronic Thermal Management by End-Use Segment - Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart).....II-1201$350
   Table 50: Rest of World 11-Year Perspective for Electronic Thermal Management by End-Use Segment - Percentage Breakdown of Dollar Sales for Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets for Years 2005, 2010 & 2015 (includes corresponding Graph/Chart).....II-1211$350