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DOMAIN EXPERT ENGAGEMENTS

Number of executives repeatedly engaged by snail & email outreach*

POOL + OUTREACH

4639

Interactions with Platform & by Email *

INTERACTIONS

835

Unique # Participated *

PARTICIPANTS

139

Responses Validated *

VALIDATIONS

40

* Platform engagements are dynamic. Stats are published quarterly.


  •  CODE

  •  PAGES

  •  DATE

  •  PRICE

    $

  •  DATA EXHIBITS

    125


TABLE OF CONTENTS


   Pages :    | $

   Study Reliability and Reporting Limitations.....I-1  
   Disclaimers.....I-2
Data Interpretation & Reporting Level.....I-2
  
   Quantitative Techniques & Analytics.....I-3
Product Definitions and Scope of Study.....I-3
  
   Semiconductor Industry: An Overview.....II-1
Chip-Making Industry Reels Under the Economic Pressure.....II-1
1$100
   3D Chips: Market & Technology Overview.....II-2
A Quick Primer.....II-2
Transition from 2D Configuration to 3D IC.....II-2
1$100
   Appeal of 3D Chip Soars Among End- Use Sectors.....II-3
Rationale Behind the Growing Popularity of 3D IC.....II-3
1$100
   TSV Technology – Ensuring Success of 3D-IC Integration.....II-4
3D TSV: Technological Trends and Issues.....II-4
1$100
   Market Adoption of 3D IC Technology: Challenges.....II-51$100
   Semiconductor.....II-6
Discrete Devices.....II-6
Integrated Circuits (ICs).....II-6
Analog ICs.....II-6
1$100
   Digital ICs.....II-7
3D IC (Three-Dimensional Integrated Circuit) - An Introduction.....II-7
3D Packaging Vs 3D Ics.....II-7
Benefits of 3D IC.....II-7
1$100
   Manufacturing Technologies for 3D IC.....II-81$100
   Technological Challenges.....II-9
Manufacturing Costs.....II-9
Yield.....II-9
Heat.....II-9
Complexity of Design.....II-9
Lack of Clearly Defined Standards.....II-9
Lack of Relevance Post Insertion.....II-9
Supply Delay.....II-9
1$100
   TierLogic Announces the Launch of 3D FPGA.....II-10
Movidius Rolls Out 3D Chip for Smartphones.....II-10
STMicroelectronics Unveils 3D IC Chip for Digital TV Applications.....II-10
Applied Materials Launches Avila™ Technology.....II-10
STMicroelectronics Launches 3D IC for Enhanced Audio in Portable Media Players.....II-10
1$100
   BeSang Unleashes 3D IC Technology to Enable Low Cost Solutions.....II-11
Sound Design Technologies Rolls Out New 3D Chip Stacking Technology.....II-11
Toshiba to Develop 3D NAND Flash Chip.....II-11
NEC Develops New 3D Chip Stacked Flexible Memory for SoC.....II-11
1$100
   IMEC Introduces 3D SIC Technology.....II-12
Aviza Technology Launches Versalis fxP.....II-12
2$125
   CEA-Leti, SPTS Ally Over Next-Gen TSV Development.....II-14
EVG, IME Collaborate for 3D-IC Integration Technologies.....II-14
CMC, CMP, MOSIS Ally for 3D-IC Process.....II-14
Elpida Collaborate with PTI, UMC for 3D-IC Integration Development.....II-14
1$100
   Leti, R3Logic Partner for 3D-IC Methodologies and Designs.....II-15
NEC Electronics Merges with Renesas Technology.....II-15
Advanced Technology Investment Company Acquires Chartered Semiconductor
  Manufacturing.....II-15
ON Semiconductor Acquires Sound Design Technologies.....II-15
1$100
   SPP Acquires Key Assets of Aviza Technology.....II-16
IBM Partners with ETH and EPFL to Co-Develop Eco-Friendly 3D Microchips.....II-16
1$100
   S.E.T and IMEC Collaborate to Develop Processes for 3D Integration.....II-17
Industrial Technology Research Institute Collaborates with Applied Materials.....II-17
EV Group and Applied Materials Collaborate to Develop Wafer Bonding Process for 3D
  IC.....II-17
1$100
   Soitec Collaborates with CEA-Leti for 3D Integration.....II-18
Apple Acquires Stake in Imagination Technologies.....II-18
Applied Materials Acquires Semitool.....II-18
1$100
   KLA- Tencor Acquires Stake in ICOS Vision Systems.....II-19
Zoran Corporation Takes Over Let It Wave.....II-19
SanDisk Enters into Collaboration with Toshiba for Rewriteable 3D Chip
  Development.....II-19
BeSang Collaborates with National NanoFab Centre and Stanford NanoFab to Develop 3D
  IC.....II-19
1$100
   Singapore forms Novel Consortium to Boost 3D Adoption.....II-20
DDD and Samsung Collaborate for Development of 3D Chips.....II-20
1$100
   Amkor Technology (US).....II-21
GlobalFoundries, Inc. (US).....II-21
Hynix Semiconductor, Inc. (South Korea).....II-21
International Business Machines Corporation (US).....II-21
1$100
   Intel Corporation (US).....II-22
Micron Technology, Inc. (US).....II-22
Renesas Electronics Corporation (Japan).....II-22
1$100
   Samsung Electronics Co., Ltd. (South Korea).....II-23
Sony Corporation (Japan).....II-23
Tezzaron Semiconductor Corporation (US).....II-23
1$100
   Toshiba Semiconductors (Japan).....II-24
Ziptronix, Inc. (US).....II-24
1$100
   Table 1: World Recent Past, Current & Future Analysis for 3D Chips (3D IC) Analyzed with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....II-251$350
    
 
 


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