Increasing Complexity of PCBs Drives the Global Selective Soldering Equipment Market

The global market for Selective Soldering is projected to reach US$68.2 million by 2024, driven by the increasing complexity of PCBs, as well as shrinking footprint of electronic components.

Soldering, primarily of two types - Reflow soldering and Wave soldering, is the process of bonding the placed components to the printed circuit board, to facilitate electrical connections between them. Selection of soldering method depends on the mix of through-hole and surface mount components in the printed board assembly. Type I assemblies are reflow soldered using vapor phase or infrared rays, while type II and type III assemblies use both wave and reflow soldering for through-hole and surface mount components respectively. The technology of selective soldering is the result of a combination of factors including the drive towards miniaturization in electronic devices and the increase in temperature-sensitive and expensive components by the telecom equipment industry, among other factors. Selective soldering, which is a flexible and easily adaptable process, is being applied to an increasingly widening range of applications involving soldering tasks. In fact, selective soldering is rapidly entering into soldering production mainstream, moving beyond its original role of a solution for problem application.

Selective Soldering involves soldering of specific components to PCBs. Initial selective soldering processes were improvements over the process of hand soldering. In comparison with other processes of soldering, Selective Soldering has additional pre-requirements including preheating time and specified quantity of flux among others. Flux applicators and soldering nozzles are critical for selective soldering. Over the years, technologically advanced flux applicators and nozzles have paved the way for higher productivity. The application of selective soldering technology in aerospace, telecom, medical, and industrial segments holds enormous potential. In particular, the automotive segment is likely to fuel innovations in the field. Selective Soldering systems available in the market range from small bench-top versions with limited automated potential to expensive automated machines. Accordingly, the price range between low-end models and high-performance machines is also broad. Some users take the middle course, preferring semi-automatic models or machines featuring in-line capability or medium level of capability for product handling.

Asian countries dominate the market, owing to the agglomeration of electronics manufacturing in the region, with Japan, China, South Korea, and Taiwan accounting for more than three-fourths of the market. Taiwan, one of the leading destinations for contract electronics manufacturing represents the largest regional market worldwide, followed by South Korea. Taiwan and South Korea boast of a established value chains for electronics manufacturing right from semiconductor fabs to final assembly of electronics. China is forecast to witness the fastest growth among all regions, with a CAGR of 10.3% over the analysis period.

Major players in the market include ACE Production Technologies, DDM Novastar LLC, Ebso GmbH, epm Handels AG, ERSA GmbH, Hentec Industries, Inc., INERTEC Lottechnologien GmbH, ITW EAE, Japan Unix Co. Ltd., Juki Corporation, Juki Automation Systems, Inc. , Pillarhouse USA, Inc., SEHO Systems GmbH, Shenzhen JT Automation Equipment Co., Ltd., Tai'an Puhui Electric Technology Co., Ltd., and Tamura H.A. Machinery, Inc. among others.

View infographic | Report TOC