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  THERMAL MANAGEMENT TECHNOLOGIES (HEAT SINKS)
A Global Strategic Business Report

This report analyzes the worldwide markets for Thermal Management Technologies (Heat Sinks) in Millions of US$. The report on ‘Thermal Management Technologies (Heat Sinks)’ analyzes the Heat Sinks market by the following product segments: Metal Extruded Heat Sinks, Stamped Heat Sinks, Bonded or Fabricated Fin Heat Sinks, and Folded Fin Heat Sinks. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual forecasts are provided for each region for the period 2006 through 2015. The report profiles 181 companies including many key and niche players worldwide such as Aavid Thermalloy, LLC, Aerocool Advanced Technologies Corp., ADDA Corp., Advanced Thermal Solutions, Inc., Ajigo Corp., Akasa Group, Alpha Company Ltd., Asia Vital Components Co. Ltd., ASUSTeK Computer Inc., Chaun Choung Technology Corp., Cooler Master Co. Ltd., Dynatron Corp., Enertron Inc., GlacialTech, Inc.. JMC Products, Inc., Melcor Corp., Neng Tyi Co. Ltd., Polo Tech Co. Ltd., R-Theta Thermal Solutions, Inc., Radian Heat Sinks, Sumitomo Electric Industries, Ltd., Swiftech, Taisol Electronics Co. Ltd., TennMax United, Thermal Integration Technology, Inc., Thermacore, Thermalright, Inc., Thermaltake Technology Co., Ltd., Titan Computer Co. Ltd., Verax Ventilatoren GmbH, Vette Corp., and Wakefield Thermal Solutions, Inc. Market data and analytics are derived from primary and secondary research. Company profiles are mostly extracted from URL research and reported select online sources.

CODE:    MCP-1570  PAGES:    684
PRICE:    $3950  DATE:       July 2009
COMPANIES:  181  MARKET DATA TABLES:   129
Due to the proprietary nature, our previews are offered only to manufacturers, top-tier management consultants, investment banks, and investment research groups.

 TABLE OF CONTENTS  
  THERMAL MANAGEMENT TECHNOLOGIES (HEAT SINKS) (Complete Report) Pages : 684   | $3950
I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS6$100
   Study Reliability and Reporting Limitations.....I-1  
   Disclaimers.....I-2  
   Data Interpretation & Reporting Level.....I-3
Quantitative Techniques & Analytics.....I-3
Product Definitions and Scope of Study.....I-3
  
   Metal Extruded Heat Sinks.....I-4
Stamped Heat Sinks.....I-4
Bonded or Fabricated Fin Heat sinks.....I-4
Folded fin Heat Sinks.....I-4
  
   Computers.....I-5
Telecommunication.....I-5
Medical.....I-5
Industrial Electronics.....I-5
Aerospace/Military.....I-5
  
   Consumer Electronics.....I-6
Automotive.....I-6
  
II. EXECUTIVE SUMMARY84$2250
  1. INDUSTRY OVERVIEW.....II-12 $200  
   Thermal Management – A Critical Function.....II-1
Global Thermal Management Solutions Market: An Overview.....II-1
1$100
   Heat Sinks - Market Outlook.....II-2
Heat Sinks Market Estimates and Forecasts by Region.....II-2
Heat Sinks Market Estimates and Forecasts by Product Segment.....II-2
Heat Sinks Market Estimates and Forecasts by End-use Segment.....II-2
1$100
  2. MARKET TRENDS AND ISSUES.....II-33 $300  
   Technological Advancements Drive Growth in Heat sink Market.....II-3
PC Market Stimulates Growth.....II-3
Pricing Trends in the Heat sinks Market.....II-3
1$100
   Hybrid Technologies Gaining Popularity Over Traditional Heat Sinks.....II-4
Polymers: The Future in Heat Sink Technology.....II-4
Liquid Cooling: The Next Big Thing in Thermal Technology.....II-4
2$200
  3. INNOVATIONS IN HEAT SINK TECHNOLOGY.....II-64 $400  
   New Aluminum Silicon Carbide (AlSiC) Heat Sinks.....II-6
Heat sink System for Circuit Boards.....II-6
Heat Sink BGA Package.....II-6
New Mounting Assembly for Heat Sink.....II-6
1$100
   Dual Material Heat Sinks.....II-7
New Heat Sink, Interfacing Multiple Components.....II-7
Heat Sinks with Fins.....II-7
New Fastening Structure Method For Heat Sinks.....II-7
1$100
   New Heat Sink Attached to the Module with Adhesive.....II-8
New Method to Set Up Posts on Heat Sinks.....II-8
New Heat Sink System for Circuit Boards Developed.....II-8
New Bi-level Heat Sinks.....II-8
1$100
   New Ceramic-based Heat Sink.....II-9
Heat Sink Attached to Two Separate PCBs.....II-9
New Heat Sink Bonds with Dielectric Material.....II-9
1$100
  4. PRODUCT OVERVIEW.....II-106 $400  
   Heat Sinks.....II-10
Composition and Structure of a Heat Sink:.....II-10
1$100
   Comparison between Aluminum and Copper by Physical Parameters – Thermal Conductivity,
  Cost, Weight, Production Method and Pressure on mounting devise.....II-11
Usage Criteria for a Heat sink.....II-11
1$100
   Necessity of a Heat Sink:.....II-12
Characteristics of an Ideal Heat Sink.....II-12
Measuring and Boosting the Thermal Performance of a Heat Sink.....II-12
1$100
   Classification of Heat Sinks.....II-13
Active Heat Sink.....II-13
Characteristics of an active Heat Sink.....II-13
1$100
   Passive Heat Sink.....II-14
Extruded Heat Sinks.....II-14
Stamped Heat sinks.....II-14
1$100
   Bonded or Fabricated Fins.....II-15
Folded Fins.....II-15
Castings.....II-15
Comparing Active and Passive Heat Sinks.....II-15
1$100
  5. END USE APPLICATIONS OF HEAT SINKS.....II-163 $300  
   Computers.....II-161$100
   Telecommunication.....II-17
Medical .....II-17
Industrial Electronics.....II-17
Aerospace/Military.....II-17
1$100
   Consumer Electronics.....II-18
Automotive.....II-18
1$100
  6. THERMAL MANAGEMENT PRODUCTS - CLASSIFICATION.....II-195 $500  
   Hardware.....II-19
Heat Pipes.....II-19
Micro Channels.....II-19
Spray Cooling.....II-19
Electronic Cooling Fans.....II-19
1$100
   Metal Backplanes.....II-20
BGAs .....II-20
1$100
   Table 1: Leading Players in the Worldwide Thermal Management Hardware Market (2006 & 2007) - Percentage Share Breakdown by Value Sales for Aavid Thermalloy, Thermacore, Lytron, and Others (includes corresponding Graph/Chart).....II-21
Software.....II-21
Computational Methods of Heat Transfer (CHT) and Fluid Dynamics (CFD).....II-21
Electronic Design Automation (EDA) Software, Electronic Computer Aided Design (ECAD)
  Software, and Technology Computer Aided Design (TCAD) Software.....II-21
1$300
   Interfaces and Substrates.....II-22
Thermal Compounds and Thermal Interface Materials.....II-22
2$200
  7. RECENT INDUSTRY ACTIVITY.....II-2414 $800  
   Thermacore Awarded Research Contract by DARPA (US).....II-24
Celsia Technologies Inks Strategic Deal with Thermapower (Taiwan).....II-24
Modine to Shut Down Pemberville and Other Manufacturing Unit (USA).....II-24
1$100
   Modine Sells Thermacore (USA).....II-25
Furukawa America to Merge with Furukawa Electric (USA).....II-25
Alexandria Extrusion Takes Over M&M Metals (USA).....II-25
1$100
   Waytronx Takes Over CUI (USA).....II-26
Avnet Electronics Enters into Agreement with Nuventix (America).....II-26
Graphics Product and Celsia Form Partnership (US).....II-26
1$100
   Modine Sets up Production Unit (India).....II-27
Wakefield Acquires Simon Industries (NA).....II-27
Celsia Launches Next Generation NanoSpreader (USA).....II-27
1$100
   ATS Launched the New Star™ Series Heat Sinks (USA).....II-28
New Improved Heat Sinks from Hitachi (Japan).....II-28
Honeywell to Extend Its Research and Development Center (USA).....II-28
1$100
   Vette Corp. Forms Allies with Asia Aluminum (China).....II-29
OnScreen Inks a Licensing and Royalty Deal with Thermaltake Technologies
  (Taiwan).....II-29
ONSC Inks a Licensing Deal with CUI (US).....II-29
Modine to Construct Second Facility (Hungary).....II-29
1$100
   Onscreen Technologies Revamps Business Strategy (US).....II-30
Digi-Key Inks Global Distribution Agreement with ATS.....II-30
1$100
   Mouser Signs Distribution Agreement with Comair Rotron (US).....II-31
Laird Expands Distribution Agreement with Sager (US).....II-31
Denki Kagaku Plans Capacity Expansion for Ceramic Heat Sinks (Japan).....II-31
1$100
   Vette Corp Announces Production Expansion (North America).....II-32
ANSYS, Inc to acquire Aavid Thermal Technologies (US).....II-32
Celsia Technologies Enters Into a Collaboration Yeh- Chiang Technology
  (Taiwan).....II-32
1$100
   CPS Enters Into Partnership with Diamond Technologies (US).....II-33
Vette Takes Over ERM Thermal Technologies (USA).....II-33
Celsia Technologies Sign Strategic Contract with Kubo Kinzoku (Japan).....II-33
OnScreen™ Acquires Proprietary Rights for WayCool™ (US).....II-33
1$100
   iCurie Re-named as Celsia Technologies (US).....II-34
AET Receives Approval on HS-400 Heat Sink Design (US).....II-34
Thermal Solutions Acquires Woven Electronics (USA).....II-34
Laird Announces Acquisition of Supercool (Sweden).....II-34
1$100
   Intel Acquires 5% Stake in Neng Tyi (Taiwan).....II-35
Modine Acquires Radiadores (Brazil).....II-35
Celsia Unveils Web Portal.....II-35
AET’s eGRAF® HS-400 Heat Sinks to Feature in LS/X Supercomputer (USA).....II-35
1$100
   Vette Announces New BGA Thermal Solutions for Integrated Circuits (US).....II-36
Vette Acquires EUMAX (China).....II-36
Wakefield Extends Bonded Fin Heat Sink Line (US).....II-36
1$100
   Wakefield Expands DC/DC Converter Heat Sink Line (US).....II-37
1$100
  8. HEAT SINKS AND RELATED PRODUCT LAUNCHES AND DEVELOPMENTS.....II-3814 $800  
   Thermalright Unveils T-RAD2 (US).....II-38
Alpha Launches FS/FSR Series Active Heat Sinks (Japan).....II-38
Alpha Unveils Heat Sinks with 3.45mm Attachment Holes (Japan).....II-38
Alpha Releases New Push Pin Tabs Integrated Heat Sinks (Japan).....II-38
1$100
   Alpha Launches Low Profile LPD Series Heat Sinks (Japan).....II-39
Alpha Unveils Heat Sinks with Incorporated Attachment Tabs (Japan).....II-39
Alpha Releases UB13070 Heat Sink (Japan).....II-39
Alpha Expands LPD Series Heat Sinks with LPD90 (Japan).....II-39
ASUS Expands Triton Family with New Triton 81 CPU Coolers (Taiwan).....II-39
1$100
   Vantec Unveils New AeroFlow FX Series CPU Coolers (US).....II-40
Thermalright Launches HR-09 Type 4 Mosfet Cooler (US).....II-40
Thermalright Rolls Out TRUE Copper (US).....II-40
Spire Announced Plans to Launch New Thermax Cooling Solutions (US).....II-40
1$100
   ATS Offers Two New Heat Sinks for BGA Packages (US).....II-41
ATS Launches ATS-552 Heat Sink Cooling Solution for Freescale Processors (US).....II-41
1$100
   ATS Offers New Heat Sink Cooling Solutions for Linear LED Lighting Products
  (US).....II-42
Ohmite Offers Heat Sinks to Combat Overtorque Issues (US).....II-42
ASUS Launches Silent Cooling Solutions (Taiwan).....II-42
Alpha Replaces SB Series Heat Sinks with LT Series Heat Sinks (Japan).....II-42
1$100
   Alpha Launches ST Series Heat Sinks (Japan).....II-43
Thermalright Launches HR-03 GT VGA Cooler (US).....II-43
Thermalright Announces Availability of HR-03 Plus VGA Cooler (US).....II-43
Thermalright Unveils HR-07 Duo Ram Cooler (US).....II-43
1$100
   Thermalright Launches HR-01 X CPU Cooler (US).....II-44
Thermalright Launches HR-11 Backside Cooler (US).....II-44
Thermalright Rolls Out IFX-14 CPU Cooler (US).....II-44
1$100
   Thermalright Unveils HR-09 Mosfet Cooler (US).....II-45
ATS Rolls out maxiFLOW Heat Sinks (US).....II-45
ATS’s maxiGRIP™ Clears Stringent Military Testing (US).....II-45
1$100
   ATS Offers Passive and Active Heat Sinks for Freescale’s Processors (US).....II-46
MEC International to Offer Heat sinks From Seifert (UK).....II-46
New Heatsink from Advanced Thermal for BGA Components (US).....II-46
Tyco Launches CardBus Connector Technology Integrated Heatsink (US).....II-46
1$100
   Schaffner Expands Product Line with Seifert Electronics Products (Switzerland).....II-47
ATS Unveils New Thermal Management Design Kit (US).....II-47
Andigilog® Unveils New Thermal Management System Controllers (US).....II-47
1$100
   THERMALTAKE Presents Two Turion CPU Coolers (US).....II-48
GlacialTech Rolls Out Igloo 7210 M CPU Coolers (US).....II-48
ATS Launches HFC-100™ Heat Flux Controller (US).....II-48
1$100
   ATS Offers Online Tutorials for Thermal Management (US).....II-49
Cooler Master Unveils New Hyper Z600 CPU Cooler (Taiwan).....II-49
Advanced Thermal Solutions (ATS) Launches New Three Devices (US).....II-49
1$100
   Emulation Technology Launches Heat Sinks with Elliptical Fin BGA Chipset (US).....II-501$100
   Advanced Thermal Solutions Launches blackDIAMOND Heat Sink (US).....II-51
1$100
  9. FOCUS ON SELECT GLOBAL PLAYERS.....II-5211 $700  
   Aavid Thermalloy, LLC (USA).....II-52
Aerocool Advanced Technologies Corp. (Taiwan).....II-52
ADDA Corp. (Taiwan).....II-52
Advanced Thermal Solutions, Inc. (USA).....II-52
1$100
   Ajigo Corp. (USA).....II-53
Akasa Group (UK).....II-53
Alpha Company Ltd. (Japan).....II-53
1$100
   Asia Vital Components Co. Ltd. (Taiwan).....II-54
ASUSTeK Computer Inc. (Taiwan).....II-54
Chaun Choung Technology Corp. (Taiwan).....II-54
1$100
   Cooler Master Co. Ltd. (Taiwan).....II-55
Dynatron Corp. (USA).....II-55
Enertron Inc. (USA).....II-55
1$100
   GlacialTech, Inc. (Taiwan).....II-56
JMC Products, Inc. (USA).....II-56
Melcor Corp. (USA).....II-56
1$100
   Neng Tyi Co. Ltd (Taiwan).....II-57
Polo Tech Co. Ltd. (Taiwan).....II-57
Plansee SE (Austria).....II-57
1$100
   R-Theta Thermal Solutions, Inc. (Canada).....II-58
Radian Heat Sinks (US).....II-58
Sumitomo Electric Industries, Ltd. (Japan).....II-58
Swiftech (US).....II-58
1$100
   Taisol Electronics Co. Ltd. (China).....II-59
TennMax United (USA).....II-59
Thermal Integration Technology, Inc (Taiwan).....II-59
1$100
   Thermacore (USA).....II-60
Thermalright, Inc. (USA).....II-60
Thermaltake Technology Co., Ltd (Taiwan).....II-60
1$100
   Titan Computer Co. Ltd (Taiwan).....II-61
Verax Ventilatoren GmbH (Germany).....II-61
Vette Corp. (USA).....II-61
Wakefield Thermal Solutions, Inc. (US).....II-61
2$200
  10. GLOBAL MARKET PERSPECTIVE.....II-63   
   Table 2: World Recent Past, Current & Future Analysis for Heat Sinks Market by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....II-631$300
   Table 3: World 10-year Perspective for Heat Sinks Market by Geographic Region – Percentage Share of Dollar Sales for North America, Japan, Europe, Asia-Pacific and Rest of World for 2006, 2009, and 2015 (includes corresponding Graph/Chart).....II-641$300
   Analysis by Product Segment.....II-65
Table 4: World Recent Past, Current & Future Analysis for Metal Extruded Heat Sinks Market by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....II-65
1$300
   Table 5: World 10-year Perspective for Metal Extruded Heat Sinks Market by Geographic Region – Percentage Share Breakdown of Dollar Sales for North America, Japan, Europe, Asia-Pacific and Rest of World for 2006, 2009, and 2015 (includes corresponding Graph/Chart).....II-661$300
   Table 6: World Recent Past, Current & Future Analysis for Stamped Heat Sinks Market by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....II-671$300
   Table 7: World 10-year Perspective for Stamped Heat Sinks Market by Geographic Region – Percentage Share Breakdown of Dollar Sales for North America, Japan, Europe, Asia-Pacific and Rest of World for 2006, 2009, and 2015 (includes corresponding Graph/Chart).....II-681$300
   Table 8: World Recent Past, Current & Future Analysis for Bonded Fins Heat Sinks Market by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....II-691$300
   Table 9: World 10-year Perspective for Bonded Fins Heat Sinks Market by Geographic Region – Percentage Share Breakdown of Dollar Sales for North America, Japan, Europe, Asia-Pacific and Rest of World for 2006, 2009, and 2015 2015 (includes corresponding Graph/Chart).....II-701$300
   Table 10: World Recent Past, Current & Future Analysis for Folded Fins Heat Sinks Market by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....II-711$300
   Table 11: World 10-year Perspective for Folded Fins Heat Sinks Market by Geographic Region – Percentage Share Breakdown of Dollar Sales for North America, Japan, Europe, Asia-Pacific and Rest of World for 2006, 2009, and 2015 2015 (includes corresponding Graph/Chart).....II-721$300
   Analysis By End-Use Market.....II-73
Table 12: World Recent Past, Current & Future Analysis for Heat Sinks in Computers Sector by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....II-73
1$300
   Table 13: World 10-year Perspective for Heat Sinks in Computers Sector by Geographic Region – Percentage Share of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets for 2006, 2009 & 2015 (includes corresponding Graph/Chart).....II-741$300
   Table 14: World Recent Past, Current & Future Analysis for Heat Sinks in Telecom Sector by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....II-751$300
   Table 15: World 10-year Perspective for Heat Sinks in Telecom Sector by Geographic Region – Percentage Share of Dollar Sales for US, Canada, Japan, Europe, Asia- Pacific and Rest of World Markets for 2006, 2009 & 2015 (includes corresponding Graph/Chart).....II-761$300
   Table 16: World Recent Past, Current & Future Analysis for Heat Sinks in Consumer Electronics Sector by Geographic Region – US, Canada, Japan, Europe, Asia- Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....II-771$300
   Table 17: World 10-year Perspective for Heat Sinks in Consumer Electronics Sector by Geographic Region – Percentage Share of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets for 2006, 2009 & 2015 (includes corresponding Graph/Chart).....II-781$300
   Table 18: World Recent Past, Current & Future Analysis for Heat Sinks in Medical Electronics and Office Equipment Sectors by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....II-791$300
   Table 19: World 10-year Perspective for Heat Sinks in Medical and Office Equipment Sectors by Geographic Region – Percentage Share of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets for 2006, 2009 & 2015 (includes corresponding Graph/Chart).....II-801$300
   Table 20: World Recent Past, Current & Future Analysis for Heat Sinks in Industrial and Military Sector by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....II-811$300
   Table 21: World 10-year Perspective for Heat Sinks in Industrial and Military Sector by Geographic Region – Percentage Share of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets for 2006, 2009 & 2015 (includes corresponding Graph/Chart).....II-821$300
   Table 22: World Recent Past, Current & Future Analysis for Heat Sinks in Automotive Sector by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....II-831$300
   Table 23: World 10-year Perspective for Heat Sinks in Automotive Sector by Geographic Region – Percentage Share of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets for 2006, 2009 & 2015 (includes corresponding Graph/Chart).....II-841$300
III. MARKET73$1950
  1. THE UNITED STATES.....III-133 $1475  
   A. Market Analysis.....III-1
Market Overview.....III-1
1$75
   Product Innovations.....III-22$150
   Product Launches/Developments.....III-410$575
   Strategic Corporate Developments.....III-1410$575
   Select Players.....III-24
Aavid Thermalloy, LLC (USA).....III-24
Advanced Thermal Solutions, Inc. (USA).....III-24
Ajigo Corp. (USA).....III-24
1$75
   CTS Corp. (USA).....III-25
Cool Innovations, Inc. (USA).....III-25
Dynatron Corp. (USA).....III-25
1$75
   Enertron, Inc. (USA).....III-26
JMC Products, Inc. (USA).....III-26
Melcor Corp. (USA).....III-26
Radian Heat sinks (US).....III-26
1$75
   Swiftech (US).....III-27
Tennmax United (USA).....III-27
Thermacore (USA).....III-27
1$75
   Thermalright, Inc. (USA).....III-28
United Thermal Engineering Corp. (USA).....III-28
1$75
   Vantec Thermal Technologies, Inc. (US).....III-29
Vette Corp. (USA).....III-29
Wakefield Thermal Solutions, Inc. (US).....III-29
1$75
   B. Market Analytics.....III-30
Table 24: US Recent Past, Current & Future Analysis for Heat Sinks Market by Product Segment – Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....III-30
1$150
   Table 25: US 10-year Perspective for Heat Sinks Market by Product Segment – Percentage Share Breakdown of Dollar Sales for Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks for 2006, 2009, and 2015 (includes corresponding Graph/Chart).....III-311$150
   Table 26: US Recent Past, Current & Future Analysis for Heat Sinks by End-Use Sector – Computers, Telecom, Consumer Electronics, Medical and Office Equipment, Industrial and Military, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....III-321$150
   Table 27: US 10-Year Perspective for Heat Sinks by End-Use Sector: Percentage Share Breakdown of Dollar Sales for Computers, Telecom, Consumer Electronics, Medical and Office Equipment, Industrial and Military and Automotive Markets for 2006, 2009 & 2015 (includes corresponding Graph/Chart).....III-33
1$150
  2. CANADA.....III-345 $500  
   A. Market Analysis.....III-34
Current and Future Analysis.....III-34
Select Player.....III-34
1$75
   B. Market Analytics.....III-35
Table 28: Canadian Recent Past, Current & Future Analysis for Heat Sinks Market by Product Segment – Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....III-35
1$150
   Table 29: Canadian 10-year Perspective for Thermal Management Heat Sinks Market by Product Segment – Percentage Share Breakdown of Dollar Sales for Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks for 2006, 2009, and 2015 (includes corresponding Graph/Chart).....III-361$150
   Table 30: Canadian Recent Past, Current & Future Analysis for Heat Sinks by End-Use Sector – Computers, Telecom, Consumer Electronics, Medical/Office Equipment, Industrial and Military, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....III-371$150
   Table 31: Canadian 10-Year Perspective for Heat Sinks by End-Use Sector: Percentage Share Breakdown of Dollar Sales for Computers, Telecom, Consumer Electronics, Medical and Office Equipment, Industrial/ Military, and Automotive Markets for 2006, 2009 & 2015 (includes corresponding Graph/Chart).....III-38
1$150
  3. JAPAN.....III-398 $600  
   A. Market Analysis.....III-39
Current and Future Analysis.....III-39
Product Innovations.....III-39
2$150
   Strategic Corporate Developments.....III-411$75
   Select Players.....III-42
Alpha Company Ltd. (Japan).....III-42
1$75
   Sumitomo Electric Industries, Ltd. (Japan).....III-43
B. Market Analytics.....III-43
Table 32: Japanese Recent Past, Current & Future Analysis for Thermal Management Heat sinks Market by Product Segment – Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....III-43
1$150
   Table 33: Japanese 10-year Perspective for Heat Sinks Market by Product Segment – Percentage Share Breakdown of Dollar Sales for Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks for 2006, 2009, and 2015 (includes corresponding Graph/Chart).....III-441$150
   Table 34: Japanese Recent Past, Current & Future Analysis for Heat Sinks by End-Use Sector – Computers, Telecom, Consumer Electronics, Medical/Office Equipment, Industrial and Military, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....III-451$150
   Table 35: Japanese 10-Year Perspective for Heat Sinks by End-Use Segment – Percentage Share Breakdown of Dollar Sales for Computers, Telecom, Consumer Electronics, Medical and Office Equipment, Industrial and Military, and Automotive Markets for 2006, 2009 & 2015 (includes corresponding Graph/Chart).....III-46
1$150
  4. EUROPE.....III-477 $525  
   A. Market Analysis.....III-47
Current and Future Analysis.....III-47
Product Launches/Developments.....III-47
1$75
   Strategic Corporate Developments.....III-48
Select Players.....III-48
Akasa Group (UK).....III-48
1$75
   Plansee SE (Austria).....III-49
Verax Ventilatoren GmbH (Germany).....III-49
1$75
   B. Market Analytics.....III-50
Table 36: European Recent Past, Current & Future Analysis for Heat Sinks Market by Product Segment – Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....III-50
1$150
   Table 37: European 10-year Perspective for Heat Sinks Market by Product Segment – Percentage Share Breakdown of Dollar Sales for Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks for 2006, 2009, and 2015 (includes corresponding Graph/Chart).....III-511$150
   Table 38: European Recent Past, Current & Future Analysis for Heat Sinks by End-Use Sector – Computers, Telecom, Consumer Electronics, Medical/Office Equipment, Industrial and Military, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....III-521$150
   Table 39: European 10-Year Perspective for Heat Sinks by End-Use Sector: Percentage Share Breakdown of Dollar Sales for Computers, Telecom, Consumer Electronics, Medical and Office Equipment, Industrial/ Military, and Automotive Markets for 2006, 2009 & 2015 (includes corresponding Graph/Chart).....III-53
1$150
  5. ASIA PACIFIC.....III-5415 $975  
   A. Market Analysis.....III-54
Current and Future Analysis.....III-54
Mainland China Heat Sinks Market.....III-54
Taiwan Market Scenario.....III-54
1$75
   Product Innovations.....III-551$75
   Product Launches/Developments.....III-561$75
   Strategic Corporate Developments.....III-572$150
   Select Players.....III-59
Act-Rx Technology Corp. (Taiwan).....III-59
1$75
   Aerocool Advanced Technologies Corp. (Taiwan).....III-60
ADDA Corp. (Taiwan).....III-60
Arkua Technology Co., Ltd (Taiwan).....III-60
Asia Vital Components Co. Ltd. (Taiwan).....III-60
1$75
   ASUSTeK Computer, Inc. (Taiwan).....III-61
Chaun Choung Technology Corp. (Taiwan).....III-61
1$75
   Cooler Master Co. Ltd. (Taiwan).....III-62
EVERCOOL Thermal Co., Ltd. (Taiwan).....III-62
GlacialTech, Inc. (Taiwan).....III-62
Kuang Thousand Technology Co., Ltd. (Taiwan).....III-62
1$75
   Neng Tyi Co. Ltd (Taiwan).....III-63
Polo Tech Co. Ltd (Taiwan).....III-63
Taisol Electronics Co. Ltd. (China).....III-63
1$75
   Thermal Integration Technology, Inc (Taiwan).....III-64
Thermaltake Technology Co., Ltd (Taiwan).....III-64
Titan Computer Co. Ltd. (Taiwan).....III-64
1$75
   B. Market Analytics.....III-65
Table 40: Asia Pacific Recent Past, Current & Future Analysis for Heat Sinks Market by Product Segment – Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....III-65
1$150
   Table 41: Asia Pacific 10-year Perspective for Heat Sinks Market by Product Segment – Percentage Share Breakdown of Dollar Sales for Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks for 2006, 2009, and 2015 (includes corresponding Graph/Chart).....III-661$150
   Table 42: Asia Pacific Recent Past, Current & Future Analysis for Heat Sinks by End-Use Sector – Computers, Telecom, Consumer Electronics, Medical/Office Equipment, Industrial and Military, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....III-671$150
   Table 43: Asia Pacific 10-Year Perspective for Heat Sinks by End-Use Sector: Percentage Share Breakdown of Dollar Sales for Computers, Telecom, Consumer Electronics, Medical and Office Equipment, Industrial/ Military, and Automotive Markets for 2006, 2009 & 2015 (includes corresponding Graph/Chart).....III-68
1$150
  6. REST OF WORLD.....III-695 $475  
   A. Market Analysis.....III-69
Current and Future Analysis.....III-69
Strategic Corporate Developments.....III-69
1$75
   B. Market Analytics.....III-70
Table 44: Rest of World Recent Past, Current & Future Analysis for Heat Sinks Market by Product Segment – Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....III-70
1$150
   Table 45: Rest of World 10-year Perspective for Heat Sinks Market by Product Segment – Percentage Share Breakdown of Dollar Sales for Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks for 2006, 2009, and 2015 (includes corresponding Graph/Chart).....III-711$150
   Table 46: Rest of World Recent Past, Current & Future Analysis for Heat Sinks by End-Use Sector – Computers, Telecom, Consumer Electronics, Medical/ Office Equipment, Industrial and Military, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....III-721$150
   Table 47: Rest of World 10-Year Perspective for Heat Sinks by End-Use Sector: Percentage Share Breakdown of Dollar Sales for Computers, Telecom, Consumer Electronics, Medical and Office Equipment, Industrial/ Military, and Automotive Markets for 2006, 2009 & 2015 (includes corresponding Graph/Chart).....III-731$150
IV. COMPETITIVE LANDSCAPE 510$995
  
Total Companies Profiled: 180 (including Divisions/Subsidiaries - 207)

Region/Country                 Players


The United States                  91
Canada                              2
Japan                               5
Europe                             40
     France                         4
     Germany                        6
     The United Kingdom            17
     Italy                          6
     Spain                          1
     Rest of Europe                 6
Asia-Pacific (Excluding Japan)     69
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