NANOMEMORY - A GLOBAL MARKET REPORT   

Research Abstract

This report analyzes the Global Market for Nanomemory in Millions of US$. The types of Nanomemory technologies discussed in the report include: Ferroelectric Random Access Memory or FRAM, Magnetoresitive Random Access Memory or MRAM, Ovonic Unified Memory, Holographic Memory, Nano-RAM or NRAM, Molecular Memory, and Polymer memory. Annual forecasts are provided for the period 2010 through 2015. Market data and analytics are derived from primary and secondary research. Company profiles are primarily based upon search engine sources in the public domain. The report profiles 40 companies including many key and niche players worldwide such as -

Advanced Micro Devices, Inc.
California Molecular Electronics Corporation
Cavendish Kinetics
Colossal Storage Corporation
Cypress Semiconductor Corporation
Everspin Technologies, Inc.


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Code : MCP-1520
Price : $3950
Companies : 40
Pages : 558
Date : July 2009
Market Data Tables : 180

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 TABLE OF CONTENTS


 
   Study Reliability and Reporting Limitations.....I-1  
   Disclaimers.....I-2  
   Data Interpretation & Reporting Level.....I-3
Product Definitions and Scope of Study.....I-3
  
   Modern Day Storage Woes.....II-1
Nanomemory to the Rescue.....II-1
1$100
   Table 1: World Long Term Projections for Nanomemory Market- Annual Sales Figures in US$ Billion for the Years 2010 through 2015 (includes corresponding Graph/Chart).....II-2
Who Leads the Pack?.....II-2
1$300
   Conventional Vs Emerging Storage Options.....II-3
Comparison Between Traditional and Emerging Memory Types.....II-3
Nanotechnology to Alter Memory Storage in Electronics.....II-3
1$100
   MRAM: Pros and Cons.....II-4
What’s in Store for MRAM?.....II-4
Ovonic Memory Gathering Momentum.....II-4
1$100
   Holographic Memory in Future.....II-5
R&D in Nanomemory: A Sneak Peak.....II-5
Carbon Nanotubes Based Memory.....II-5
Nanodots.....II-5
1$100
   Nanocrystalline Memory.....II-6
Nano-Ionic Memory.....II-6
Patent Protection Vital for Investment.....II-6
1$100
   Table 2: Number of Patents Filed for Select Nanomemory Types from 2003 Onwards in the US, Japan, Europe, and WIPO (includes corresponding Graph/Chart).....II-7
1$300
   Nanotechnology: Breaking Conventional Size Barriers.....II-8
Volatile and Non-Volatile Memory.....II-8
1$100
   Nanomemory: An Introduction.....II-9
Select Nanomemory Types - Features, and Applications.....II-9
1$100
   Comparison of Select Nanomemory Technologies- FRAM, MRAM, and Ovonic Unified
  Memory.....II-10
FRAM.....II-10
1$100
   MRAM.....II-11
Ovonic Unified Memory.....II-11
1$100
   Holographic Memory.....II-121$100
   NRAM.....II-13
Molecular Memory.....II-13
Polymer Memory.....II-13
2$200
   Researchers Develop New Nanotube Flash Memory Design.....II-15
Researchers to Develop Graphene Memory.....II-15
1$100
   Physicists Succeed in Controlling Electron Spin.....II-16
Chemists Develop New Method to Synthesize Nanorods and Nanowires.....II-16
1$100
   Researchers Develop Nanowires to Store Data.....II-17
IBM Develops New Memory Device.....II-17
KAIST Develops 8nm NVM Flash Memory.....II-17
1$100
   University of Southampton Develops Optical Memory Element.....II-18
Researchers Develop the Largest Memory Bit Array.....II-18
Physicists Develop Optical Memory Using Single Gallium Nanoparticle.....II-18
1$100
   Toshiba Unveils New 16-Gigabit Memory Chip.....II-19
Micron Launches 8-Gb SLC high speed NAND.....II-19
AMD Launches New Stream Processor, AMD FireStream™ 9250.....II-19
1$100
   AMD Introduces Two New Graphics Card with TeraFlops Graphics Chip.....II-20
AMD to Use GDDR5 Memory in New Advanced ATI Radeon™ Graphics Systems.....II-20
1$100
   AMD Introduces New Graphics Accelerator, ATI FirePro™ V 8700.....II-21
AMD Releases New Graphic Processor, ATI Radeon™ E2400.....II-21
1$100
   Hitachi Announces Nanotechnology Milestone for Hard Disk Drives Capacity.....II-22
Ramtron’s New Integrated EDR Incorporates F-RAM Capabilities.....II-22
1$100
   Ramtron Unveils New Serial F-RAM with 2Mb Memory.....II-231$100
   Ramtron Unveils FM3135.....II-24
Samsung’s Sampling of Smallest-ever 2Gb DDR3 Utilizes 50nm Class Circuiting.....II-24
1$100
   Samsung’s New High-Performing Smart Card IC Utilizes 90nm Technology.....II-251$100
   SanDisk Releases a New WORM Digital Memory Card for Data-Write-Protection.....II-261$100
   SanDisk’s New Advanced Memory Stick PRO-HG Duo™, Ideal for SLR cameras.....II-27
Everspin Includes Small Footprint and byte-wide BGA Products into MRAM family.....II-27
1$100
   Infineon Technologies Launches X-GOLD™102.....II-28
Nanochip Unveils a Breakthrough Storage Technology.....II-28
1$100
   Ramtron Unveils FM25V05, Serial 512-Kilobit F-RAM.....II-29
Ramtron Releases High-Speed FM28V100.....II-29
1$100
   Ramtron Releases FM25V10, Flexible 1-Megabit Serial F-RAM.....II-301$100
   Ramtron Enhances Its Range of AEC-Q100-Specified F-RAM Memory Devices.....II-31
Samsung Introduces First 30nm Flash Memory in the World.....II-31
Virage Unveils New 65nm Product Lines.....II-31
1$100
   RIC Launches 4Mb FRAM.....II-321$100
   Samsung Launches 8GB Flash Memory.....II-33
Hewlett-Packard Launches Nanotechnology Based New Computer Chip.....II-33
Ramtron Unveils 4Mb Non-Volatile FRAM Memory.....II-33
1$100
   Samsung Develops a New Chip for Digital TVs.....II-34
Samsung Launches 8GB moviNAND for Mobiles.....II-34
Samsung Launches 30nm Process Node Based Primary Flash Memory Chip.....II-34
1$100
   Virage Expands the Range of Silicon Aware IP Line.....II-35
Toshiba Corp to Manufacture NAND Flash Memory Chips with 43nm Technology.....II-35
Impinj Releases AEON@OTP Nonvolatile Memory Cores.....II-35
1$100
   Scientists in South Korea Create the World’s First 8-nm Flash Memory Part.....II-36
Epson and Fujitsu Develop Next-Generation FRAM Technology.....II-36
Fujitsu Introduces Embedded FRAM for Digital Televisions.....II-36
1$100
   Ramtron Extends Grade 1 Automotive Devices Product Range.....II-371$100
   Ramtron Announces Expansion of +125ºC F-RAM-based Automotive Devices.....II-38
Ramtron Unveils a New 2Mb Parallel High-Density F-RAM memory device.....II-38
1$100
   Ramtron Expands Versa 8051Series by Unveiling a 2 KB F-RAM Microcontroller.....II-39
Ramtron Expands Nonvolatile State Saver Line by Unveiling a 4-bit F-RAM
  Device.....II-39
1$100
   Ramtron Expands F-RAM-based Grade 1 Automotive parts.....II-401$100
   FRAM Memory from Ramtron Incorporated in Car Audio Platform by Daesung-Eltec.....II-41
Ramtron Announces Upgrading of Grade 1 Automotive line.....II-41
1$100
   Ramtron Introduces Improved F-RAM-Enhanced™ Processor Companions.....II-42
Samsung Unveils GDDR5 Memory Chip Transfers data at Speeds of 6Gb/s.....II-42
1$100
   Samsung Introduces 64Gb MLC NAND Flash Memory for High Density Storage.....II-43
Samsung Unveils 60nm 2Gb DDR2 DRAM Using Class Processing Technology.....II-43
1$100
   Samsung Introduces a Multi-chip High-Density moviMCP Memory Package.....II-441$100
   Samsung Commences Sampling of 16Gb NAND Flash Utilizing 50nm Processing
  Technology.....II-45
Hitachi and Renesas Launch Circuit Technology for On-Chip Nonvolatile Memory
  Applications.....II-45
1$100
   Hitachi Launches 0.05mm x 0.05mm Contactless RFID IC Chip.....II-46
Infineon Unveils XE166 Family of Real-Time Signal Controllers.....II-46
1$100
   Impinj Releases AEON® for Production in TSMC.....II-47
Ramtron and TI to Launch 4-Mbit FRAM.....II-47
1$100
   Hynix to Acquire Stake in ProMOS.....II-48
Lockheed Martin Acquires Government Business Unit of Nantero.....II-48
1$100
   BAE Systems and MAST to Develop Nano-Sensor Technology.....II-49
Qimonda Partners with Elpida.....II-49
SVTC Partners with Nantero.....II-49
Hynix Partners with Nanosys.....II-49
1$100
   Qimonda AG in Partnership with Elpida Memory Inc. to Develop Nano-Chips.....II-50
Nantero Partners with SVTC Technologies to Develop Carbon Nanotube Process.....II-50
Aewin Technologies Enters into an Agreement with Ramtron.....II-50
Numonyx Commences Prototype Production of 45nm Wafers.....II-50
1$100
   Hynix to Commence Production of 50nm DRAM.....II-51
SanDisk to Commence Production of MLC NAND Flash Memory.....II-51
Crocus Technology Raises Funds to Develop MRAM Technology.....II-51
Samsung and Sun Microsystems Collaborate on SLC Flash Memory Development.....II-51
1$100
   ATMI and Ovonyx to Collaborate on High-Volume Manufacture of PCM Products.....II-52
SanDisk and Toshiba Co-Develop NAND Flash Memory.....II-52
1$100
   Energy Optimizers Enters into an Agreement with Ramtron.....II-531$100
   Freescale Forms New Company for MRAM Development.....II-54
Hynix Joins the Memory Technology Access Program (M-TAP) of Nanosys.....II-54
1$100
   Toshiba Develops 16-Gigabit NAND Flash Memory.....II-55
Ramtron International Selects Shanghai Welltech for FM25L16 Designing.....II-55
1$100
   AMD Partners with TSMC.....II-56
TSMC Announces Virage as IP Partner.....II-56
RIC Partners with TI.....II-56
1$100
   Samsung and Toshiba Collaborate on Premium NAND Memory Chips.....II-57
Ovonyx and Hynix Collaborate on PCM Products Development.....II-57
1$100
   Ovonyx and Qimonda Collaborate on PCRAM Technology.....II-58
IBM, Infineon, Freescale, Samsung & Chartered Cooperate on 32-nm
  Semiconductors.....II-58
1$100
   Spansion Inks Agreement with TSMC.....II-59
AMD Enters into an Agreement with SAMSUNG.....II-59
Infineon Enters into an Agreement with IBM.....II-59
Toshiba to Manufacture 43nm NAND Flash Memory Chips.....II-59
1$100
   Samsung Starts Production of 16-gigabit NAND Flash Memory.....II-60
Samsung Commences Production of 60nm DRAM Chips.....II-60
Intel Corp Receives Approval for New Computer Chip Plant.....II-60
NVE Corp to Receive New Patent.....II-60
Intel to Commence Mass Production of Alverstone.....II-60
1$100
   National Semiconductor to Qualify Cavendish Kinetics’ Nanomech Process.....II-61
Samsung Commences Mass Production of NAND Flash Memory Chips.....II-61
1$100
   Advanced Micro Devices, Inc. (US).....II-62
California Molecular Electronics Corporation (US).....II-62
Cavendish Kinetics (US).....II-62
1$100
   Colossal Storage Corporation (US).....II-63
Cypress Semiconductor Corporation (US).....II-63
Everspin Technologies, Inc. (US).....II-63
Fujitsu Limited (Japan).....II-63
1$100
   Hewlett-Packard Development Company, L.P. (US).....II-64
Hitachi, Ltd. (Japan).....II-64
Honeywell International Inc. (US).....II-64
1$100
   International Business Machines Corp. (US).....II-65
Infineon Technologies AG (Germany).....II-65
Intel (US).....II-65
1$100
   Nanochip, Inc. (US).....II-66
Nanosys, Inc. (US).....II-66
Nantero, Inc. (US).....II-66
1$100
   NVE Corporation (US).....II-67
Ovonyx, Inc. (US).....II-67
Ramtron International Corporation (US).....II-67
Samsung Electronics Co., Ltd. (Korea).....II-67
1$100
   SanDisk Corporation (US).....II-68
STMicroelectronics NV (Switzerland).....II-68
1$100
   Texas Instruments Inc (US).....II-69
ZettaCore, Inc. (US).....II-69
1$100
  
Total Companies Profiled: 40

Region/Country Players

The United States 26 Japan 5 Europe 6 Germany 2 The United Kingdom 2 Rest of Europe 2 Asia-Pacific (Excluding Japan) 3
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