ELECTRONIC THERMAL MANAGEMENT - A GLOBAL STRATEGIC BUSINESS REPORT   

Research Abstract

This report analyzes the worldwide markets for Electronic Thermal Management in US$ Million by the following end-use segments: Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive. Also, the report provides market analytics for the Global and US market for the product segments - Hardware, Software, and Interfaces & Substrates. Annual estimates and forecasts are provided for the period 2007 through 2015. A six-year historic analysis is also provided for these markets. The report profiles 158 companies including many key and niche players such as II-VI, Incorporated, Marlow Industries, Aavid Thermalloy, LLC, Advanced Thermal Solutions, Inc., Alcoa, Inc., Alpha Metals, Alpha Technologies Group, Inc., Ametek, Inc., Amkor Technology, Inc., Ansys, Inc., Ansoft Corporation, Fluent, Inc., ASAT Holdings Ltd., Brush Engineered Materials, Inc., Ceramics Process Systems Corporation, Chomerics, Comair Rotron, Inc., Cookson Electronics Assembly Materials, Cool Innovations, Inc., Cooler Master Co., Ltd., C-Therm Technologies Ltd., CTS Corporation, Daat Research Corp., Degree Controls, Inc., Dow Corning Corporation, Dynatron Corporation, Enertron, Inc., Ferraz Shawmut, LLC, Fujikura Ltd., Henkel Loctite Corporation, Honeywell Electronic Materials, Intricast Company Inc., ITW Vortec, JARO Components, Inc., Kooltronic, Inc., Kyocera Corporation, Laird Technologies, Liebert Corporation, Lord Corporation, Lytron Incorporated, Mentor Graphics Corporation, Metal Matrix Cast Composites, LLC, Micronel U.S., Netzsch Instruments, Inc.., Netzsch Thermal Analysis, NMB Technologies Corporation, Noren Products, Inc.., Orient Semiconductor Electronics Ltd., PC Power & Cooling, Inc.., Pfannenberg, Inc., PLANSEE Thermal Management Solutions, Sumitomo Electric Industries, Ltd., Tech Spray, L. P., Tellurex Corp., Tennmax United, The Bergquist Company, The Filter Factory, Inc., Thermacore, Transene Company, Inc., U.S. Toyo Fan Corporation, United Thermal Engineering Corporation, Vette Corp., and Wakefield Thermal Solutions, Inc. Market data and analytics are derived from primary and secondary research. Company profiles are mostly extracted from URL research and reported select online sources.

Code : MCP-1523
Price : $4950
Companies : 158
Pages : 557
Date : October 2010
Market Data Tables : 50

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 TABLE OF CONTENTS


 
   Study Reliability and Reporting Limitations.....I-1  
   Disclaimers.....I-2  
   Data Interpretation & Reporting Level.....I-3
Quantitative Techniques & Analytics.....I-3
Product Definitions and Scope of Study.....I-3
  
   End-Use Segments.....I-4
1. Computers.....I-4
2. Telecom.....I-4
3. Medical/Office Equipment.....I-4
4. Industrial/Military.....I-4
  
   5. Consumer Electronics.....I-5
6. Automotive.....I-5
Product Segments.....I-5
1. Hardware.....I-5
2. Software.....I-5
3. Interfaces and Substrates.....I-5
  
   Sophisticated Technology Needs Effective Thermal Management........6
Current and Future Analysis........6
Regional Perspective........6
End-Use Perspective........6
1$100
   Product Segment Perspective........7
1$100
   Recession Impacts the Market........8
Rising Complexities Present Lucrative Opportunities for Electronic Thermal
  Management........8
PC Market Stimulates Growth........8
Thermal Management Subsystems Set for Robust Growth........8
1$100
   New Technologies Under Development........9
Liquid Cooling Gaining Foothold........9
Semiconductor Manufacturers Look for Thermal Management Technology........9
1$100
   Heat Pipe Gains Popularity among PC Manufacturers........10
Imminent Growth for ICs........10
1$100
   Thermal Management – A Critical Function........11
Electronic Thermal Management Products........11
Hardware........11
Heat Sinks........11
Heat Pipes........11
1$100
   Micro Channels........12
Spray Cooling........12
Electronic Cooling Fans........12
Metal Backplanes........12
1$100
   BGAs........13
Software........13
Computational Methods of Heat Transfer (CHT) and Fluid Dynamics (CFD)........13
Electronic Design Automation (EDA) Software, Electronic Computer Aided Design (ECAD)
  Software, and Technology Computer Aided Design (TCAD) Software........13
1$100
   Interfaces and Substrates........14
Thermal Compounds and Thermal Interface Materials........14
1$100
   Thermal Management Applications........15
Computers........15
Notebooks/Laptops........15
1$100
   Servers........16
Embedded PCs........16
Telecom........16
Medical........16
1$100
   Industrial Electronics........17
Aerospace/Military........17
Consumer Electronics........17
Automotive........17
1$100
   Thermal Management - A Fragmented Market........18
Table 1: Leading Vendors in the Worldwide Thermal Management Market (2006 & 2007) - Percentage Breakdown by Value Sales for Amkor, Aavid Thermalloy, Fluent, Chomerics, Kyocera, and Others (includes corresponding Graph/Chart)........18
1$350
   Thermal Management Hardware Market........19
Table 2: Leading Players in the Worldwide Thermal Management Hardware Market (2006 & 2007) - Percentage Breakdown by Value Sales for Aavid Thermalloy, Thermacore, Lytron, and Others (includes corresponding Graph/Chart)........19
1$350
   Fluent – The Undisputed Thermal Management S/W Market Leader........20
Table 3: Leading Players in the Worldwide Thermal Management Software Market (2006 & 2007) - Percentage Breakdown by Value Sales for Fluent, Ansys, Flomerics, Daat, and Others (includes corresponding Graph/Chart)........20
1$350
   Chomerics and Bergquist Lead Thermal Management Interface Market........21
Table 4: Leading Players in the Worldwide Thermal Management Interface Market (2006 & 2007) - Percentage Breakdown by Value Sales for Chomerics, Bergquist, Aavid Thermalloy, Lytron, and Others (includes corresponding Graph/Chart)........21
1$350
   Amkor Dominates Thermal Management Substrate Market........22
Table 5: Leading Players in the Worldwide Thermal Management Substrate Market (2006 & 2007) - Percentage Breakdown by Value Sales for Amkor, Kyocera, ST ChipPAC, OSE, ASAT, and Others (includes corresponding Graph/Chart)........22
1$350
   LORD Unveils MT-815 Low Modulus Increased Thermal Conductivity Adhesive........23
Thermaltake Introduces Thermaltake SlimX3........23
Honeywell Electronic Materials Launches Honeywell PCM45M-SP........23
1$100
   AdaptivCool Develops HotSpotr HT-510........241$100
   Nuventix Introduces SynJet Spot Light Cooler........25
DSM Engineering Plastics Unveils Thermally Conductive PA46 Material........25
Micropelt Launches MPC-D40x Thermoelectric Coolers........25
1$100
   Pfannenberg Unveils New DTS 3000 Side-Mount Cooling Units........26
California Micro Devices Launches LuxGuard™ CM1771........26
Honeywell Unveils Pb-free Die Attach Solder........26
1$100
   Nuventix Introduces New Line of SynJet Coolers........27
Indium Launches Heat-Spring® Thermal Interface Material........27
1$100
   Parker Hannifin Launches Two-Phase Liquid Cooling System........28
Nuventix and National Semiconductor Launch Electronic Drive and Reference
  Design........28
1$100
   Honeywell International Unveils Honeywell PTM 3180........29
RS Components Unveils New Thermal Management Solutions........29
1$100
   Arun Components Launches Alutronic Line of Heatsink Systems........30
Nextreme Thermal Solutions Introduces New Series of OptoCooler High Voltage
  Modules........30
1$100
   Vette Introduces Aluma-Cop Liquid Cooling........31
SprayCool Launches Multi-Platform Enclosure........31
Celsia Technologies Unveils Advanced NanoSpreader........31
1$100
   STABLCOR Introduces ST10-LC909 Products........32
1$100
   SMART Releases Liquid-Cooled VLP DDR2 Registered DIMMs........33
LORD Develops Materials for Thermal Management........33
Dow Corning Introduces New Thermally Conductive Compound........33
1$100
   Astrosyn Unveils a Range of Slide-fit Heatsink Enclosures........34
Dell Develops a Liquid-Cooled Heat Sink........34
Fujipoly America Develops an Innovative Thermal Interface Material........34
Flomerics to Offer T3Ster Thermal Testing System........34
Andigilog® Develops ThermalEdge™ Cooling Technology........34
1$100
   Andigilog® Introduces Thermal Management Solutions........35
Celsia Releases MicroSpreader™........35
Sunon Develops Liquid Circulation Cooling System........35
1$100
   EBM-PAPST Develops Advanced Liquid Cooling System........36
EBM-PAPST Introduces New Fan-Cooling Technology........36
Hybricon Introduces Liquid-Cooled ATR Chassis........36
1$100
   Ansoft Launches Latest Version of ePhysics as ePhysics v2........37
CTS Launches New Line of Low-Profile Forged Heat Sinks........37
Honeywell Introduces Screen Printable Phase Change Material in Chip
  Manufacture........37
1$100
   Laird Launches Thermally Conductive, Electrically Insulating T-preg™ HTD for
  PCBs........38
Laird Introduces Deep Drawing Capability for Shielding Applications........38
Laird Introduces Low-Cost T-Gard™ for SMPS Devices........38
1$100
   Laird Introduces T-Gard™ 500 High Performance Insulator for Automotive
  Industry........39
Jaro Develops 450 CFM AC Cooling Fan for Industrial Use........39
Jaro Develops IC Cooling Fan With High Flow and Cooling Value........39
Mathis Develops Mathis TCi™ For Improved Thermal Conductivity Testing........39
Melcor Introduces Extrusion Heat Sinks With Improved Performance........39
1$100
   Fluent Launches New Environmental Thermal Audit Solution for Data Centers........40
Kooltronic Introduces Advanced Enclosure Accessories........40
Pfannerberg Develops Filterfan®........40
1$100
   Thermacore Snaps Up Pittsburgh Materials Technology........41
Parker Hannifin Takes Over SprayCool........41
Dow Kokam Acquires Societe de Vehicles Electriques........41
1$100
   BorgWarner Establishes Manufacturing Plant........42
MAHLE Acquires Majority Stake in BEHR Industry........42
CoolIT Systems Takes Over Assets of Delphi Thermal Liquid Cooling........42
1$100
   Curtiss-Wright Snaps Up EST Group........43
Arlington Capital Partners Acquires J.A. Reinhardt........43
Thermacore Takes Over k Technology........43
1$100
   IBM Collaborates with Vette........44
Bias Power Collaborates with Nuventix........44
1$100
   Roal Electronics Collaborates with Nuventix........45
Electronic Environments Inks Partnership Agreement with AdaptivCool........45
Asetek Forms Alliance with Corsair........45
1$100
   AdaptivCool and Yamatake Sign Agreement........46
Toyal America forms Alliance with E.W. Kaufmann........46
Stablcor and Elvia PCB Group Ink Licensing Agreement........46
Weidmann Electrical Technology and LumaSense Technologies Ink Strategic Partnership
  Agreement........46
1$100
   Thermacore Bags Contract from Defense Advanced Research Projects Agency........47
Waytronx Takes Over CUI........47
Photochemie Signs Licensing Agreement with Stablcor........47
1$100
   ON Semiconductor Establishes Research and Development Centre........48
Stablcor and Graphic Ink Licensing Agreement........48
Texas Instruments Takes Over Commergy Technologies........48
Thermal Energy International Takes Over Gardner Energy Management........48
nCoat Inks Agreement with BSR Solar Technologies and Sunvention USA........48
1$100
   CSP Inc. MultiComputer Division Signs Agreement with SprayCool® Technologies........49
Mentor Graphics Takes Over Flomerics Group........49
Modine Divests Thermacore........49
1$100
   Moog Takes Over Thermal Control Products........50
Rensselaer Teams Up with Varsities to Develop Cooling Techniques........50
1$100
   Laird Partners with Sager Electronics........51
Honeywell to Expand R&D Facility........51
Vette Adds ERM........51
1$100
   Laird Takes Over Supercool........52
Arlington Capital Acquires Woven Electronics Through Thermal Solutions........52
Parker Hannifin Purchases Acofab and Adecem........52
Ametek Adds Land Instruments........52
1$100
   Lytron Adds Lockhart Industries........53
Seki Technotron Purchases 10% Interest in sp3 Inc.........53
OnScreen Purchases Patent of WayCool Thermal Cooling Technology........53
1$100
   Flomerics Acquires NIKA........54
Aavid Merges with Ansys and Spins-Off Thermal Management Business........54
Celsia and Yeh-Chiang Sign Agreement........54
Nextreme Inks License Deal with Caltech........54
1$100
   Celsia Signs Sales & Development Pact with Lighting Science........55
Celsia Contracts with Kubo to Expand in Japan........55
Hybricon and Parker Hannifin Sign Pact for Cooling Solutions........55
1$100
   Rogers and Thermal Transfer Composites Partner........56
sp3 Partners with CPS........56
Celsia Teams Up with AET........56
1$100
   Mathis Forms Distribution Partnership with Setaram Instrumentation........57
1$100
   II-VI, Incorporated (US)........58
Marlow Industries (US)........58
Aavid Thermalloy, LLC (US)........58
Advanced Thermal Solutions, Inc. (US)........58
1$100
   Alcoa, Inc. (US)........59
Alpha Technologies, Inc. (US)........59
Ametek, Inc. (US)........59
1$100
   Amkor Technology, Inc. (US)........60
Ansys, Inc. (US)........60
1$100
   Ansoft Corporation (US)........61
Fluent, Inc. (US)........61
ASAT Holdings Ltd. (Hong Kong)........61
1$100
   Brush Engineered Materials, Inc. (US)........62
Ceramics Process Systems Corporation (US)........62
Chomerics (US)........62
1$100
   Comair Rotron, Inc. (US)........63
Cookson Electronics Assembly Materials (US)........63
Cool Innovations, Inc. (US)........63
1$100
   Cooler Master Co., Ltd. (UK)........64
C-Therm Technologies Ltd. (Canada)........64
CTS Corporation (US)........64
1$100
   Daat Research Corp. (US)........65
Degree Controls, Inc. (US)........65
Dow Corning Corporation (US)........65
Dynatron Corporation (US)........65
1$100
   Enertron, Inc. (US)........66
Ferraz Shawmut, LLC (Canada)........66
Fujikura Ltd. (Japan)........66
Henkel Loctite Corporation (US)........66
1$100
   Honeywell Electronic Materials (US)........67
Intricast Company Inc (US)........67
ITW Vortec (US)........67
1$100
   JARO Components, Inc. (US)........68
Kooltronic, Inc. (US)........68
Kyocera Corporation (Japan)........68
Laird Technologies (US)........68
1$100
   Liebert Corporation (US)........69
Lord Corporation (US)........69
Lytron Incorporated (US)........69
Mentor Graphics Corporation (US)........69
1$100
   Metal Matrix Cast Composites, LLC (US)........70
Micronel U.S. (US)........70
Netzsch Instruments, Inc. (US)........70
Netzsch Thermal Analysis (Germany)........70
1$100
   NMB Technologies Corporation (US)........71
Noren Products, Inc. (US)........71
Orient Semiconductor Electronics Ltd. (Taiwan)........71
PC Power & Cooling, Inc. (US)........71
1$100
   Pfannenberg, Inc. (US)........72
PLANSEE Thermal Management Solutions (US)........72
Sumitomo Electric Industries, Ltd. (Japan)........72
Tech Spray, L. P. (UK)........72
1$100
   Tellurex Corp. (US)........73
Tennmax United (US)........73
The Bergquist Company (US)........73
1$100
   The Filter Factory, Inc. (US)........74
Thermacore (US)........74
Transene Company, Inc. (US)........74
1$100
   U.S. Toyo Fan Corporation (US)........75
United Thermal Engineering Corporation (US)........75
Vette Corp. (US)........75
1$100
   Wakefield Thermal Solutions, Inc. (US)........76
1$100
   Table 6: World Recent Past, Current & Future Analysis for Electronic Thermal Management by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart)........771$350
   Table 7: World Historic Review for Electronic Thermal Management by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart)........781$350
   Table 8: World 11-Year Perspective for Electronic Thermal Management by Geographic Region – Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Markets for Years 2005, 2010 & 2015 (includes corresponding Graph/Chart)........791$350
   Table 9: World Recent Past, Current & Future Analysis for Electronic Thermal Management by Product Segment– Hardware, Software, and Interfaces & Substrates Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart)........801$350
   Table 10: World Historic Review for Electronic Thermal Management by Product Segment – Hardware, Software, and Interfaces & Substrates Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart)........81

Table 11: World 11-Year Perspective for Electronic Thermal Management by Product Segment – Percentage Breakdown of Dollar Sales for Hardware, Software, and Interfaces & Substrates Markets for Years 2005, 2010 & 2015 (includes corresponding Graph/Chart)........81
1$350
   Table 12: World Recent Past, Current & Future Analysis for Electronic Thermal Management in Computers by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart)........821$350
   Table 13: World Historic Review for Electronic Thermal Management in Computers by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart)........831$350
   Table 14: World 11-Year Perspective for Electronic Thermal Management in Computers by Geographic Region – Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Markets for Years 2005, 2010 & 2015 (includes corresponding Graph/Chart)........841$350
   Table 15: World Recent Past, Current & Future Analysis for Electronic Thermal Management in Telecom by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart)........851$350
   Table 16: World Historic Review for Electronic Thermal Management in Telecom by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart)........861$350
   Table 17: World 11-Year Perspective for Electronic Thermal Management in Telecom by Geographic Region – Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Markets for Years 2005, 2010 & 2015 (includes corresponding Graph/Chart)........871$350
   Table 18: World Recent Past, Current & Future Analysis for Electronic Thermal Management in Medical/ Office Equipment by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart)........881$350
   Table 19: World Historic Review for Electronic Thermal Management in Medical/Office Equipment by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart)........891$350
   Table 20: World 11-Year Perspective for Electronic Thermal Management in Medical/Office Equipment by Geographic Region – Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Markets for Years 2005, 2010 & 2015 (includes corresponding Graph/Chart)........901$350
   Table 21: World Recent Past, Current & Future Analysis for Electronic Thermal Management in Industrial/Military by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart)........911$350
   Table 22: World Historic Review for Electronic Thermal Management in Industrial/Military by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart)........921$350
   Table 23: World 11-Year Perspective for Electronic Thermal Management in Industrial/Military by Geographic Region – Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Markets for Years 2005, 2010 & 2015 (includes corresponding Graph/Chart)........931$350
   Table 24: World Recent Past, Current & Future Analysis for Electronic Thermal Management in Consumer Electronics by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart)........941$350
   Table 25: World Historic Review for Electronic Thermal Management in Consumer Electronics by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart)........951$350
   Table 26: World 11-Year Perspective for Electronic Thermal Management in Consumer Electronics by Geographic Region – Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Markets for Years 2005, 2010 & 2015 (includes corresponding Graph/Chart)........961$350
   Table 27: World Recent Past, Current & Future Analysis for Electronic Thermal Management in Automotive by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart)........971$350
   Table 28: World Historic Review for Electronic Thermal Management in Automotive by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart)........981$350
   Table 29: World 11-Year Perspective for Electronic Thermal Management in Automotive by Geographic Region – Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Markets for Years 2005, 2010 & 2015 (includes corresponding Graph/Chart)........99
1$350
   A. Market Analysis........100
Current and Future Analysis........100
By End-Use Segment........100
By Product Segment........100
Rising Complexities Present Lucrative Opportunities for Electronic Thermal
  Management........100
Price Pressures and Shifting of Manufacturing to Asia to Restrain Growth........100
1$100
   B. Market Analytics........101
Table 30: US Recent Past, Current & Future Analysis for Electronic Thermal Management by Product Segment – Hardware, Software, and Interfaces & Substrates Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart)........101
1$350
   Table 31: US Historic Review for Electronic Thermal Management by Product Segment – Hardware, Software, and Interfaces & Substrates Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart)........102

Table 32: US 11-Year Perspective for Electronic Thermal Management by Product Segment – Percentage Breakdown of Dollar Sales for Hardware, Software, and Interfaces & Substrates Markets for Years 2005, 2010 & 2015 (includes corresponding Graph/Chart)........102
1$350
   Table 33: US Recent Past, Current & Future Analysis for Electronic Thermal Management by End-Use Segment – Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart)........1031$350
   Table 34: US Historic Review for Electronic Thermal Management by End-Use Segment – Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart)........1041$350
   Table 35: US 11-Year Perspective for Electronic Thermal Management by End-Use Segment – Percentage Breakdown of Dollar Sales for Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets for 2005, 2010 & 2015 (includes corresponding Graph/Chart)........105
1$350
   Market Analysis........106
Table 36: Canadian Recent Past, Current & Future Analysis for Electronic Thermal Management by End-Use Segment – Computers, Telecom, Medical/ Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart)........106
1$350
   Table 37: Canadian Historic Review for Electronic Thermal Management by End-Use Segment – Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart)........1071$350
   Table 38: Canadian 11-Year Perspective for Electronic Thermal Management by End-Use Segment – Percentage Breakdown of Dollar Sales for Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets for 2005, 2010 & 2015 (includes corresponding Graph/Chart)........108
1$350
   Market Analysis........109
Table 39: Japanese Recent Past, Current & Future Analysis for Electronic Thermal Management by End-Use Segment – Computers, Telecom, Medical/ Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart)........109
1$350
   Table 40: Japanese Historic Review for Electronic Thermal Management by End-Use Segment – Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart)........1101$350
   Table 41: Japanese 11-Year Perspective for Electronic Thermal Management by End-Use Segment – Percentage Breakdown of Dollar Sales for Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets for 2005, 2010 & 2015 (includes corresponding Graph/Chart)........111
1$350
   Market Analysis........112
Table 42: European Recent Past, Current & Future Analysis for Electronic Thermal Management by End-Use Segment – Computers, Telecom, Medical/ Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart)........112
1$350
   Table 43: European Historic Review for Electronic Thermal Management by End-Use Segment – Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart)........1131$350
   Table 44: European 11-Year Perspective for Electronic Thermal Management by End-Use Segment – Percentage Breakdown of Dollar Sales for Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets for 2005, 2010 & 2015 (includes corresponding Graph/Chart)........114
1$350
   A. Market Analysis........115
Current and Future Analysis........115
Taiwan Market Scenario........115
1$100
   B. Market Analytics........116
Table 45: Asia-Pacific Recent Past, Current & Future Analysis for Electronic Thermal Management by End-Use Segment – Computers, Telecom, Medical/Office Equipment, Industrial/ Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart)........116
1$350
   Table 46: Asia-Pacific Historic Review for Electronic Thermal Management by End-Use Segment – Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart)........1171$350
   Table 47: Asia-Pacific 11-Year Perspective for Electronic Thermal Management by End-Use Segment – Percentage Breakdown of Dollar Sales for Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets for 2005, 2010 & 2015 (includes corresponding Graph/Chart)........118
1$350
   Market Analysis........119
Table 48: Rest of World Recent Past, Current & Future Analysis for Electronic Thermal Management by End-Use Segment – Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart)........119
1$350
   Table 49: Rest of World Historic Review for Electronic Thermal Management by End-Use Segment – Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart)........1201$350
   Table 50: Rest of World 11-Year Perspective for Electronic Thermal Management by End-Use Segment – Percentage Breakdown of Dollar Sales for Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets for 2005, 2010 & 2015 (includes corresponding Graph/Chart)........1211$350
  
Total Companies Profiled: 158 (including Divisions/Subsidiaries - 178)

Region/Country Players

The United States 120 Canada 4 Japan 6 Europe 35 France 3 Germany 4 The United Kingdom 17 Italy 5 Spain 1 Rest of Europe 5 Asia-Pacific (Excluding Japan) 13
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