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  ADVANCED ELECTRONIC PACKAGING
A Global Strategic Business Report

This report analyzes the worldwide markets for Advanced Electronic Packaging in Millions of US$. The specific product segments analyzed are Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), Latin America, and Rest of World. Annual forecasts are provided for each region and product segment for the period of 2000 through 2010. The report profiles 77 companies including many key and niche players worldwide such as Advanced Semiconductor Engineering Group, Amkor Technology, Inc., ASAT Holdings Limited, ASM International NV, ChipScale, Inc., Fairchild Semiconductor International, Motorola, Inc., NEC Electronics Corporation, Semtech Corporation, STATS ChipPAC Ltd., Tessera, Inc., Texas Instruments, Inc., and Toshiba America Electronic Components, Inc. Market data and analytics are derived from primary and secondary research. Company profiles are mostly extracted from URL research and reported select online sources.

CODE:    MCP-1203  PAGES:    459
PRICE:    $3950  DATE:       February 2006
COMPANIES:  77  MARKET DATA TABLES:   134
Due to the proprietary nature, our previews are offered only to manufacturers, top-tier management consultants, investment banks, and investment research groups.

 TABLE OF CONTENTS  
  ADVANCED ELECTRONIC PACKAGING (Complete Report) Pages : 459   | $3950
I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS4$100
II. EXECUTIVE SUMMARY52$2650
  1. Current and Future Analysis.....II-12 $400  
   Portable Devices Portray a Bright Future Ahead .....II-1
Regional Analysis.....II-1
Table 1: World Market for Advanced Electronic Packaging (2000-2010): Geographic Regions Ranked by Growth - Asia-Pacific (excluding Japan), Europe, Japan, US, Canada and Rest of World (include corresponding Graphs/Chart).....II-1
Analysis by Segment.....II-1
1$300
   Table 2: World Market for Advanced Electronic Packaging (2000-2010): Product Segments Ranked by Growth – Chip Scale Packages, Multi Chip Modules and Ball Grid Arrays (include corresponding Graphs/Chart).....II-2
1$300
  2. Industry Overview.....II-34 $700  
   A Brief Insight.....II-3
Table 3: Semiconductor Capital Equipment Market Worldwide (2005) - Percentage Breakdown of Dollar Sales by Region: Japan, North America, Korea, Taiwan, Europe, and Rest of World (include corresponding Graphs/Chart).....II-3

Table 4: Semiconductor Plastic Packaging Materials Market Worldwide (2005) – Percentage Breakdown of Dollar Sales by Geographic Region- Southeast Asia, Japan, Taiwan, Korea, China, and Rest of World (include corresponding Graphs/Chart).....II-3
1$300
   Advanced Electronic Packaging Technology Trends (2000-2015).....II-4
Table 5: Laminate Substrate Market Worldwide (2005) - Percentage Breakdown by Technology- Flip Chip, Wire Bond, and Chip Scale Packaging (include corresponding Graphs/Chart).....II-4

Table 6: Leading Fabless Packaging Techniques Worldwide (2004 & 2005) – Percentage Share Breakdown for QFP, BGA, SOIC, Leadless, CSP, FBGA, Discrete and Other (include corresponding Graphs/Chart).....II-4
1$300
   Table 7: Leading Foundry Manufacturing Regions Worldwide (2004 & 2005) – Percentage Share Breakdown for Taiwan, Singapore/Malaysia, Korea, China, Philippines, and Other (include corresponding Graphs/Chart).....II-5
Market Share Scenario.....II-5
Table 8: Leading IC Socket Manufacturers Worldwide (2004 & 2005) - Percentage Share Breakdown for Yamaichi, AMP, Molex, Thomas & Betts, FCI/Berg, and Others (include corresponding Graphs/Chart).....II-5
1$300
   Table 9: Leading CSP Substrate Suppliers Worldwide (2004 &2005) – Percentage Share Breakdown for Unimicron, Ibiden, Shinko, JCI, Samsung, LG, and Others (include corresponding Graphs/Chart).....II-6

Table 10: Leading Chip Packaging Manufacturers Worldwide (2004 & 2005) – Percentage Share Breakdown for Amkor, ASE, ChipPac, Siliconware, Orient, STATS, ASAT, and Others (include corresponding Graphs/Chart).....II-6
1$300
  3. Issues and Trends.....II-74 $400  
   Suppliers Outsource Packaging To Curtail Costs.....II-7
BGAs on a Tremendous Growth Path.....II-7
Glue Logic Makers Move to Advanced Packaging .....II-7
1$100
   Contractors Move Towards High Pin-Count Packages .....II-8
Wafer Scale Packaging Anticipated to Cut Costs.....II-8
Disparity in Scale Sizes – A Reason for Concern .....II-8
1$100
   Miniaturization Impels Adoption of Wafer-Level Chip Scale Packaging.....II-9
Challenges Facing Assembly and Packaging.....II-9
1$100
   Technology Trends.....II-10
1$100
  4. Growth Drivers.....II-112 $200  
   Portable Equipment Drives Growth in Flip Chips.....II-11
Drivers for Electronic Packaging Technologies.....II-11
Shrinking Die Sizes to Drive New Packaging Technologies.....II-11
1$100
   Factors Driving Growth in the Chip Scale Packaging Market.....II-12
Market Technology Drivers by Major End-Use Sectors.....II-12
1$100
  5. Product Overview.....II-1312 $1000  
   Definition.....II-131$100
   Packaging Hierarchy.....II-14
Semiconductor Manufacturing Process.....II-14
IC Supply Chain.....II-14
1$100
   Applications of Electronic Packaging Research.....II-15
Industrial Applications of Advanced Packaging and Interconnection.....II-15
Requirements for Electronic Packaging.....II-15
Technologies that Facilitate Electronic Packaging.....II-15
Origin and Evolution.....II-15
1$100
   Electronic Packaging Advances.....II-16
Product Segments.....II-16
1$100
   Ball Grid Arrays.....II-171$100
   Types of BGA.....II-18
Flip Chip Technology (FCT).....II-18
1$100
   Advantages of Flip-Chip Technology.....II-19
Flip Chip Materials & Modeling Infrastructure.....II-19
1$100
   Table 11: Trends in Flip Chip Production Worldwide (2000 Vs 2005): Percentage Breakdown by End Product - Lower Lead Count Products, Non Solder Bumped Die with TCB, Integrated Passives, Displays/Micro displays, Non Solder Bumped Die with Conductive Adhesive, High Performance Processors, High Performance Memory, High Performance ASICS Mid I/O Die, and High Frequency Products (include corresponding Graphs/Chart).....II-20
Multi Chip Modules (MCM).....II-20
Advantages of MCM.....II-20
1$300
   Disadvantages of MCM.....II-21
Module Assembly Techniques.....II-21
Module Encapsulation Techniques.....II-21
Chip Scale Packaging (CSP).....II-21
1$100
   Lead Counts by Packaging Technology - A Comparison.....II-22
Wafer-Level Packages.....II-22
1$100
   Wire Bonding.....II-23
Stacked Die Packages.....II-23
Die Products.....II-23
Chip-On-Board (COB).....II-23
Flip-Chip and Wafer-Level Packaging.....II-23
1$100
   Adhesive Flip Chip on Flex.....II-24
Solder Flip-Chip.....II-24
1$100
  6. Technological Developments/Breakthroughs.....II-253 $300  
   ChipPAC Offers Thinnest CSP and SiP Packages.....II-25
High-Density Socket Enables BGA Packaging for Mobile Processors.....II-25
Kingston Announces Elevated Package Over CSP Technology.....II-25
ICP Compounds Dissipate the Static in Electronic Packaging.....II-25
Legerity Offers SLIC Family in Quad Flat No- lead (QFN) Package.....II-25
1$100
   Swiss Scientists Develop New Flat-Pack technology.....II-26
Unitive Implements Innovative Wafer Level Packaging Technology.....II-26
Test Socket Enables for BGA Version of Mobile Pentium III.....II-26
World's Thinnest BGA Package - etCSP from Amkor .....II-26
1$100
   Amkor Formulates New Chip Packaging Technology.....II-27
BGA Production Socket Offers Ease in Installation.....II-27
Plastic in Place of Ceramics in IC Packaging .....II-27
1$100
  7. Product Introductions/Innovations.....II-289 $775  
   STATS Complements 3D Technology Portfolio .....II-28
Toshiba Develops TSSOP Advance Package.....II-28
Semtech Expands MicroClamp™ Family.....II-28
Advanced Interconnect Launches New Versions of Lead Frame Package .....II-28
1$100
   WJ Communications Launches New Multi Chip Module.....II-29
Traquair Announces Firewire Interface and On- Board DSP MCM.....II-29
Intersil Rolls Out MightyMUX Analog Switch Lines.....II-29
Amkor Technology Inks Agreement with ASAT Holdings .....II-29
Sharp Launches New Photocouplers in SOP 8-pin Packages .....II-29
ChipPAC Releases New Plastic Ball Grid Array Packaging.....II-29
1$100
   Motorola Unveils New PQFN Packages .....II-30
Skyworks Introduces Wireless LAN Front-End Module Family.....II-30
TI Introduces NanoStar Wafer Chip-Scale Packaging.....II-30
Tessera Launches Pyxis Chip-Scale Packaging (CSP) Solution .....II-30
1$100
   Ironwood Electronics Launches New BGA Sockets.....II-31
STATS and Aeluros Develop Low Cost Packaging.....II-31
Multilink Launches Advanced Modulator Driver.....II-31
Foothill Releases Two New Advanced Packaging Products.....II-31
Fujitsu Launches Industry's Smallest Chip-Size Module .....II-31
Micron Technology Releases Samples of 256 Megabit SDRAM .....II-31
1$100
   SST Unveils New Ultra-Thin Package .....II-32
Mitsubishi Electric Launches Low-Power SRAM.....II-32
ChipPAC Develops Two-Stacked Chip CSP .....II-32
Texas Instruments Unveils Wafer Level Logic Packages.....II-32
Hitachi Releases New Line of Multi-Chip Modules.....II-32
M-Systems Unveils New 16MB Single-Chip Flash Disk.....II-32
1$100
   Hitachi Introduces Two New Stack-Type Multi- Chip Modules.....II-33
MeltroniX Unveils First Multi-Chip Module Product.....II-33
Fairchild Semiconductor Rolls Out New Line of Optocouplers.....II-33
Sharp Microelectronics Launches 32Mbit Boot Block Flash CSP.....II-33
Multilink Rolls Out Next Generation Chipset .....II-33
1$100
   Ohmite Launches BG Series Resistor Arrays.....II-34
Semtech Launches ChipClamp Flip Chip Products .....II-34
STT Develops New BGA Test Socket.....II-34
Fairchild Semiconductor Introduces New MOSFET BGA Series.....II-34
SST Offers Flash Series in a Micro-BGA Package.....II-34
ChipPAC Launches EconoLGA Land Grid Array Package.....II-34
1$100
   ANADIGICS Announces Multi-Chip Module Assembly Line.....II-35
Toshiba Offers 2 KB EEPROM in 44-Pin Quad Flat Pack Package.....II-35
Atmel Launches World's First 8-Pin Small Outline Package .....II-35
Burr-Brown Releases DC Converters in Small Outline Package.....II-35
SST Introduces Flash Memory Products .....II-35
1$100
   Aavid Thermal Products Introduces BGA Cooling Products.....II-36
California Micro Devices Announces New Termination Arrays .....II-36
California Micro Devices Unveils ESD Devices.....II-36
1$100
  8. Recent Industry Activity.....II-379 $775  
   ASE and Flip Chip in a Licensing Agreement.....II-37
ASE and Flip Chip in a Licensing Agreement.....II-37
Quantum Acquires CiP technology from Silicon Bandwidth .....II-37
Sumitomo Acquires Stake in Quantum.....II-37
STATS to Expand Flip Chip Package Production Capacity .....II-37
1$100
   Tessera Inks a Licensing Deal with NEC Electronics.....II-38
ChipPac to Merge with STATS .....II-38
ASE Forms Strategic Partnership with NEC Electronics.....II-38
Amkor Bags Packaging Order from Oki Electric.....II-38
ASAT Holdings Expands Capacity.....II-38
Global Advanced Packaging Selects First Teradyne Tiger Test System.....II-38
1$100
   ASM Bags BGA Packaging Systems Order.....II-39
Toshiba Inks Licensing Agreement with Tessera .....II-39
Ace Semiconductor Forms Alliance with Chip Makers.....II-39
SEMCO to Mass Produce FC-BGA.....II-39
ASE Adopts Cadence’s IC Packaging Design Flow.....II-39
1$100
   Amkor Adds Stacked CSP to its Portfolio.....II-40
Tessera Expands Licensing Agreement With Hitachi .....II-40
Advanced Packaging to Open New Packaging Line.....II-40
Tegal Corp Joins Advanced Packaging and Interconnect Alliance .....II-40
Advanced Interconnect Adds System-In-Package to its Portfolio.....II-40
Tessera in Joint Venture with Intel Corp.....II-40
1$100
   Parelec Adds Parmod VLT Line of Products .....II-41
TDA Systems Discover Defects in BGA Packages.....II-41
ChipPAC Starts New Production Line in China.....II-41
Tchip Selects ASAT to Provide CSP .....II-41
Microsemi Signs Agreement with Nitronex.....II-41
Motorola Labs Receives Major Contract.....II-41
1$100
   Fujitsu to Expand Assembly Services Capacity .....II-42
DuPont Creates Three Separate Strategic Business Units.....II-42
ASE Starts Volume Production of Wafer-Level Chip Scale Packages.....II-42
SST Selects Kingpak to Provide Chip-Scale BGA Packaging.....II-42
Pacific Aerospace & Electronics Secures New Patent .....II-42
1$100
   DELSY to License Shellcase .....II-43
Micronic Bags Repeat Order for Pattern Generator .....II-43
ASE Provides Test Services for Transmeta.....II-43
Diodes Enters into Alliance with Microsemi Corp.....II-43
ASE and Conexant Enter into Cross-Licensing Agreement.....II-43
Amkor Adds Latest Packaging Equipment .....II-43
1$100
   Global Semiconductor Companies Form Consortium.....II-44
CSP Inks Agreement with Objective Interface.....II-44
Tessera Signs Licensing Agreement with Mitsui .....II-44
Tessera Strikes Agreement with Meicer.....II-44
1$100
   Semtech Announces Integration of Wafer-Level CSP Technology.....II-45
White Electronic Bags DSP Multi-Chip SRAM Module Order .....II-45
Interpoint Signs Agreement with Wave Systems .....II-45
Nortel Networks Divests Electronic Design and Packaging Units .....II-45
Amkor Technology Expands Capacity .....II-45
Globetronics Technology to Start New Production Unit.....II-45
1$100
  9. Focus on Select Players.....II-463 $300  
   Advanced Semiconductor Engineering Group (Taiwan).....II-46
Amkor Technology Inc (USA).....II-46
ASAT Holdings Limited (Hong Kong).....II-46
ASM International NV (The Netherlands).....II-46
1$100
   ChipScale, Inc. (USA).....II-47
Fairchild Semiconductor International (USA).....II-47
Motorola Inc (USA).....II-47
NEC Electronics Corporation (Japan).....II-47
Semtech Corporation (USA).....II-47
1$100
   STATS ChipPAC Ltd (Singapore).....II-48
Tessera, Inc (USA).....II-48
Texas Instruments Inc (USA).....II-48
Toshiba America Electronic Components, Inc. (USA).....II-48
Major Strategies of Integrated Solution Providers.....II-48
1$100
  10. Global Market Perspective.....II-49   
   Table12: World Recent Past, Current & Future Analysis for Advanced Electronic Packaging
  by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and
    Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for
      Years 2000 through 2010 (include corresponding Graphs/Chart).....II-49
Table 13: World 10-Year Perspective for Advanced Electronic Packaging by Geographic Region – Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2000, 2005 & 2010 (include corresponding Graphs/Chart).....II-49
1$300
   Table14: World Recent Past, Current & Future Analysis for Ball Grid Arrays by Geographic
  Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World
    Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000
      through 2010 (include corresponding Graphs/Chart).....II-50
Table15: World 10-Year Perspective for Ball Grid Arrays by Geographic Region –
  Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific
    (excluding Japan), and Rest of World Markets for Years 2000, 2005 & 2010 (include
      corresponding Graphs/Chart).....II-50
1$300
   Table16: World Recent Past, Current & Future Analysis for Chip Scale Packages by
  Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest
    of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for
      Years 2000 through 2010 (include corresponding Graphs/Chart).....II-51
Table17: World 10-Year Perspective for Chip Scale Packages by Geographic Region –
  Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific
    (excluding Japan), and Rest of World Markets for Years 2000, 2005 & 2010 (include
      corresponding Graphs/Chart).....II-51
1$300
   Table 18: World Recent Past, Current & Future Analysis for Multi Chip Modules by Geographic Region – US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (include corresponding Graphs/Chart).....II-52

Table 19: World 10-Year Perspective for Multi Chip Modules by Geographic Region – Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2000, 2005 & 2010 (include corresponding Graphs/Chart).....II-52
1$300
III. MARKET49$2450
  1. The United States.....III-118 $1025  
   A. Market Analysis.....III-1
Outlook.....III-1
A Brief Market Insight.....III-1
Market Shows Signs of Recovery.....III-1
1$75
   Chip Manufacturers – Looking for Greener Pastures.....III-2
Key US Players.....III-2
Amkor Technology Inc.....III-2
ChipScale, Inc......III-2
Fairchild Semiconductor International.....III-2
1$75
   Motorola Inc.....III-3
Semtech Corporation.....III-3
Tessera, Inc.....III-3
Texas Instruments Inc.....III-3
Toshiba America Electronic Components, Inc......III-3
1$75
   Technological Developments/Breakthroughs.....III-41$75
   Product Launches.....III-57$525
   Strategic Developments.....III-126$450
   B. Market Analytics.....III-18
Table 20: US Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Product Segment – Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (include corresponding Graphs/Chart).....III-18

Table 21 : US 10-Year Perspective for Advanced Electronic Packaging by Product Segment – Percentage Breakdown of Dollar Sales for Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets for years 2000, 2005 & 2010 (include corresponding Graphs/Chart).....III-18
1$150
  2. Canada .....III-192 $150  
   A. Market Analysis.....III-19
Outlook.....III-19
Strategic Development.....III-19
1$75
   B. Market Analytics.....III-20
Table 22 : Canadian Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Product Segment – Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (include corresponding Graphs/Chart).....III-20

Table 23: Canadian 10-Year Perspective for Advanced Electronic Packaging by Product Segment – Percentage Breakdown of Dollar Sales for Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets for years 2000, 2005 & 2010 (include corresponding Graphs/Chart).....III-20
1$150
  3. Japan .....III-214 $300  
   A. Market Analysis.....III-21
Outlook.....III-21
Weakness in the Industry Structure .....III-21
Japanese Companies on Comeback Trial.....III-21
1$75
   Product Launches.....III-22
Strategic Developments.....III-22
1$75
   Key Japanese Player.....III-23
NEC Electronics Corporation.....III-23
1$75
   B. Market Analytics.....III-24
Table 24: Japanese Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Product Segment – Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (include corresponding Graphs/Chart).....III-24
Table25: Japanese 10-Year Perspective for Advanced Electronic Packaging by Product
  Segment – Percentage Breakdown of Dollar Sales for Ball Grid Arrays, Chip Scale
    Packages, and Multi Chip Modules Markets for years 2000, 2005 & 2010 (include
      corresponding Graphs/Chart).....III-24
1$150
  4. Europe .....III-254 $375  
   A. Market Analysis.....III-25
Analysis by Geographic Region.....III-25
Table 26: European Market for Advanced Electronic Packaging: Geographic Regions Ranked by Growth – Rest of Europe, UK, Germany, France, and Italy (include corresponding Graphs/Chart).....III-25
Analysis by Product Segment.....III-25
1$150
   Table 27: European Market for Advanced Electronic Packaging: Product Segments Ranked by Growth – Chip Scale Packages, Ball Grid Arrays, and Multi Chip Modules (include corresponding Graphs/Chart).....III-26
European Advanced Packaging Technologies.....III-26
1$150
   B. Market Analytics.....III-27
Table 28: European Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Geographic Region – France, Germany, Italy, UK, and Rest of Europe Markets Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (include corresponding Graphs/Chart).....III-27

Table 29: European Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Product Segment – Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (include corresponding Graphs/Chart).....III-27
1$150
   Table30: European 10-Year Perspective for Advanced Electronic Packaging by Geographic
  Region – Percentage Breakdown of Dollar Sales for France, Germany, Italy, UK, and Rest
    of Europe Markets for Years 2000, 2005 & 2010 (include corresponding
      Graphs/Chart).....III-28
Table31: European 10-Year Perspective for Advanced Electronic Packaging by Product
  Segment – Percentage Breakdown of Dollar Sales for Ball Grid Arrays, Chip Scale
    Packages, and Multi Chip Modules Markets for Years 2000, 2005 & 2010 (include
      corresponding Graphs/Chart).....III-28
1$150
  4a. France .....III-292 $200  
   Market Analysis.....III-29
Table 32: French Recent Past, Current & Future Analysis for Advanced Electronic Packaging
  by Product Segment – Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules
    Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000
      through 2010 (include corresponding Graphs/Chart).....III-29
1$150
   Table33: French 10-Year Perspective for Advanced Electronic Packaging by Product Segment
  – Percentage Breakdown of Dollar Sales for Ball Grid Arrays, Chip Scale Packages, and
    Multi Chip Modules Markets for Years 2000, 2005 & 2010 (include corresponding
      Graphs/Chart).....III-30
1$150
  4b. Germany .....III-312 $150  
   A. Market Analysis.....III-31
Outlook.....III-31
Strategic Development.....III-31
1$75
   B. Market Analytics.....III-32
Table34: German Recent Past, Current & Future Analysis for Advanced Electronic Packaging
  by Product Segment – Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules
    Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000
      through 2010 (include corresponding Graphs/Chart).....III-32
Table35: German 10-Year Perspective for Advanced Electronic Packaging by Product Segment
  – Percentage Breakdown of Dollar Sales for Ball Grid Arrays, Chip Scale Packages, and
    Multi Chip Modules Markets for Years 2000, 2005 & 2010 (include corresponding
      Graphs/Chart).....III-32
1$150
  4c. Italy .....III-332 $200  
   Market Analysis.....III-33
Table36: Italian Recent Past, Current & Future Analysis for Advanced Electronic
  Packaging by Product Segment – Ball Grid Arrays, Chip Scale Packages, and Multi Chip
    Modules Markets Independently Analyzed with Annual Sales Figures in US$ Million for
      Years 2000 through 2010 (include corresponding Graphs/Chart).....III-33
1$150
   Table37: Italian 10-Year Perspective for Advanced Electronic Packaging by Product Segment
  – Percentage Breakdown of Dollar Sales for Ball Grid Arrays, Chip Scale Packages, and
    Multi Chip Modules Markets for Years 2000, 2005 & 2010 (include corresponding
      Graphs/Chart).....III-34
1$150
  4d. The United Kingdom .....III-352 $225  
   Market Analysis.....III-35
Table38: UK Recent Past, Current & Future Analysis for Advanced Electronic Packaging by
  Product Segment – Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets
    Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through
      2010 (include corresponding Graphs/Chart).....III-35
1$150
   Table39: UK 10-Year Perspective for Advanced Electronic Packaging by Product Segment –
  Percentage Breakdown of Dollar Sales for Ball Grid Arrays, Chip Scale Packages, and
    Multi Chip Modules Markets for Years 2000, 2005 & 2010 (include corresponding
      Graphs/Chart).....III-36
1$150
  4e. Rest of Europe .....III-373 $250  
   A. Market Analysis.....III-37
Outlook.....III-37
Technological Development/Breakthrough.....III-37
Strategic Developments.....III-37
1$75
   Key Player.....III-38
ASM International NV (The Netherlands).....III-38
B. Market Analytics.....III-38
Table 40: Rest of Europe Recent Past, Current & Future Analysis for Advanced Electronic Packaging - by Product Segment for Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (include corresponding Graphs/Chart).....III-38
1$150
   Table 41: Rest of Europe 10-Year Perspective for Advanced Electronic Packaging by Product Segment – Percentage Breakdown of Dollar Sales for Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets for Years 2000, 2005 & 2010 (include corresponding Graphs/Chart).....III-39
1$150
  5. Asia-Pacific .....III-408 $550  
   A. Market Analysis.....III-40
Outlook.....III-40
A Brief Review.....III-40
China – A Promising Market .....III-40
1$75
   Taiwan – Looking Ahead .....III-41
Technological Developments/Breakthroughs.....III-41
Product Launches.....III-41
1$75
   Strategic Developments.....III-423$225
   Key Players.....III-45
Advanced Semiconductor Engineering Group (Taiwan).....III-45
ASAT Holdings Limited (Hong Kong).....III-45
1$75
   STATS ChipPAC Ltd (Singapore).....III-46
B. Market Analytics.....III-46
Table 42: Asia-Pacific Recent Past, Current & Future Analysis for Advanced Electronic Packaging - by Product Segment for Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (include corresponding Graphs/Chart).....III-46
1$150
   Table 43: Asia-Pacific 10-Year Perspective for Advanced Electronic Packaging by Product Segment – Percentage Breakdown of Dollar Sales for Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets for Years 2000, 2005 & 2010 (include corresponding Graphs/Chart).....III-47
1$150
  6. Rest of World .....III-482 $300  
   Market Analysis.....III-48
Table 44: Rest of World Recent Past, Current & Future Analysis for Advanced Electronic Packaging - by Product Segment for Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (include corresponding Graphs/Chart).....III-48
1$150
   Table 45: Rest of World 10-Year Perspective for Advanced Electronic Packaging by Product Segment – Percentage Breakdown of Dollar Sales for Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets for Years 2000, 2005 & 2010.....III-491$150
IV. COMPETITIVE LANDSCAPE344$995
  
Total Companies Profiled: 77 (including Divisions/Subsidiaries - 88 )

Region/Country                 Players

The United States                  55
Japan                               7
Europe                             12
     Germany                        1
     Rest of Europe                11
Asia-Pacific (Excluding Japan)     12
Middle East                         2
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