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3D CHIPS (3D IC) - A GLOBAL MARKET REPORT   

Research Abstract

This report analyzes the Global market for 3D Chips (3D IC) in US$ Million. Annual estimates and forecasts are provided for the period 2006 through 2015. The report profiles 38 companies including many key and niche players such as Amkor Technology, GlobalFoundries, Inc., Hynix Semiconductor, Inc.., International Business Machines Corporation, Intel Corporation, Micron Technology, Inc., Renesas Electronics Corporation, Samsung Electronics Co., Ltd., Sony Corporation, Tezzaron Semiconductor Corporation, Toshiba Semiconductors, and Ziptronix, Inc. Market data and analytics are derived from primary and secondary research. Company profiles are primarily based upon search engine sources in the public domain.

Code : MCP-6575
Price : $3450
Companies : 38
Pages : 300
Date : October 2010
Market Data Tables : 96

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 TABLE OF CONTENTS

  3D CHIPS (3D IC) (Complete Report) Pages : 300   | $3450
 
I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS3$295
   Study Reliability and Reporting Limitations.....I-1  
   Disclaimers.....I-2  
   Data Interpretation & Reporting Level.....I-3
Quantitative Techniques & Analytics.....I-3
Product Definitions and Scope of Study.....I-3
  
II. EXECUTIVE SUMMARY26$2500
  1. MARKET OUTLOOK.....II-15 $395  
   Semiconductor Industry: An Overview.....II-1
Chip-Making Industry Reels Under the Economic Pressure.....II-1
1$100
   3D Chips: Market & Technology Overview.....II-2
A Quick Primer.....II-2
1$100
   Transition from 2D Configuration to 3D IC.....II-3
Appeal of 3D Chip Soars Among End-Use Sectors.....II-3
Rationale Behind the Growing Popularity of 3D IC.....II-3
1$100
   TSV Technology – Ensuring Success of 3D-IC Integration.....II-4
3D TSV: Technological Trends and Issues.....II-4
1$100
   Market Adoption of 3D IC Technology: Challenges.....II-5
1$100
  2. PRODUCT OVERVIEW.....II-64 $395  
   Semiconductor.....II-6
Discrete Devices.....II-6
Integrated Circuits (ICs).....II-6
Analog ICs.....II-6
1$100
   Digital ICs.....II-7
3D IC (Three-Dimensional Integrated Circuit) - An Introduction.....II-7
3D Packaging Vs 3D Ics.....II-7
1$100
   Benefits of 3D IC.....II-8
Manufacturing Technologies for 3D IC.....II-8
1$100
   Technological Challenges.....II-9
Manufacturing Costs.....II-9
Yield.....II-9
Heat.....II-9
Complexity of Design.....II-9
Lack of Clearly Defined Standards.....II-9
Lack of Relevance Post Insertion.....II-9
Supply Delay.....II-9
1$100
  3. PRODUCT INTRODUCTIONS/LAUNCHES.....II-104 $395  
   TierLogic Announces the Launch of 3D FPGA.....II-10
Movidius Rolls Out 3D Chip for Smartphones.....II-10
STMicroelectronics Unveils 3D IC Chip for Digital TV Applications.....II-10
Applied Materials Launches Avila™ Technology.....II-10
1$100
   STMicroelectronics Launches 3D IC for Enhanced Audio in Portable Media Players.....II-11
BeSang Unleashes 3D IC Technology to Enable Low Cost Solutions.....II-11
Sound Design Technologies Rolls Out New 3D Chip Stacking Technology.....II-11
Toshiba to Develop 3D NAND Flash Chip.....II-11
1$100
   NEC Develops New 3D Chip Stacked Flexible Memory for SoC.....II-12
IMEC Introduces 3D SIC Technology.....II-12
Aviza Technology Launches Versalis fxP.....II-12
2$200
  4. RECENT INDUSTRY ACTIVITY.....II-148 $595  
   CEA-Leti, SPTS Ally Over Next-Gen TSV Development.....II-14
EVG, IME Collaborate for 3D-IC Integration Technologies.....II-14
CMC, CMP, MOSIS Ally for 3D-IC Process.....II-14
Elpida Collaborate with PTI, UMC for 3D-IC Integration Development.....II-14
1$100
   Leti, R3Logic Partner for 3D-IC Methodologies and Designs.....II-15
NEC Electronics Merges with Renesas Technology.....II-15
Advanced Technology Investment Company Acquires Chartered Semiconductor
  Manufacturing.....II-15
ON Semiconductor Acquires Sound Design Technologies.....II-15
1$100
   SPP Acquires Key Assets of Aviza Technology.....II-16
IBM Partners with ETH and EPFL to Co-Develop Eco-Friendly 3D Microchips.....II-16
1$100
   S.E.T and IMEC Collaborate to Develop Processes for 3D Integration.....II-17
Industrial Technology Research Institute Collaborates with Applied Materials.....II-17
1$100
   EV Group and Applied Materials Collaborate to Develop Wafer Bonding Process for 3D
  IC.....II-18
Soitec Collaborates with CEA-Leti for 3D Integration.....II-18
Apple Acquires Stake in Imagination Technologies.....II-18
1$100
   Applied Materials Acquires Semitool.....II-19
KLA- Tencor Acquires Stake in ICOS Vision Systems.....II-19
Zoran Corporation Takes Over Let It Wave.....II-19
SanDisk Enters into Collaboration with Toshiba for Rewriteable 3D Chip
  Development.....II-19
1$100
   BeSang Collaborates with National NanoFab Centre and Stanford NanoFab to Develop 3D
  IC.....II-20
Singapore forms Novel Consortium to Boost 3D Adoption.....II-20
1$100
   DDD and Samsung Collaborate for Development of 3D Chips.....II-21
1$100
  5. FOCUS ON SELECT PLAYERS.....II-224 $395  
   Amkor Technology (US).....II-22
GlobalFoundries, Inc. (US).....II-22
Hynix Semiconductor, Inc. (South Korea).....II-22
1$100
   International Business Machines Corporation (US).....II-23
Intel Corporation (US).....II-23
Micron Technology, Inc. (US).....II-23
1$100
   Renesas Electronics Corporation (Japan).....II-24
Samsung Electronics Co., Ltd. (South Korea).....II-24
Sony Corporation (Japan).....II-24
1$100
   Tezzaron Semiconductor Corporation (US).....II-25
Toshiba Semiconductors (Japan).....II-25
Ziptronix, Inc. (US).....II-25
1$100
  6. GLOBAL MARKET PERSPECTIVE.....II-26   
   Table 1: World Recent Past, Current & Future Analysis for 3D Chips (3D IC) Analyzed with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart).....II-261$300
III. COMPETITIVE LANDSCAPE 266$995
  
Total Companies Profiled: 38 (including Divisions/Subsidiaries - 40)

Region/Country                 Players


The United States                 16    
Canada                             1
Japan                              6
Europe                             9
     France                        3
     The United Kingdom            1
     Rest of Europe                5
Asia-Pacific (Excluding Japan)     8
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